TW200744426A - Case-containing multilayer module - Google Patents
Case-containing multilayer moduleInfo
- Publication number
- TW200744426A TW200744426A TW096107162A TW96107162A TW200744426A TW 200744426 A TW200744426 A TW 200744426A TW 096107162 A TW096107162 A TW 096107162A TW 96107162 A TW96107162 A TW 96107162A TW 200744426 A TW200744426 A TW 200744426A
- Authority
- TW
- Taiwan
- Prior art keywords
- side face
- exposed
- multilayer module
- case
- inner conductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006138235A JP3969453B1 (ja) | 2006-05-17 | 2006-05-17 | ケース付き多層モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200744426A true TW200744426A (en) | 2007-12-01 |
TWI336609B TWI336609B (en) | 2011-01-21 |
Family
ID=38556211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096107162A TWI336609B (en) | 2006-05-17 | 2007-03-02 | Case-containing multilayer module |
Country Status (9)
Country | Link |
---|---|
US (1) | US7660132B2 (zh) |
EP (1) | EP2019577B1 (zh) |
JP (1) | JP3969453B1 (zh) |
KR (1) | KR100977391B1 (zh) |
CN (1) | CN101449635B (zh) |
AT (1) | ATE472931T1 (zh) |
DE (1) | DE602007007470D1 (zh) |
TW (1) | TWI336609B (zh) |
WO (1) | WO2007132599A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5118713B2 (ja) * | 2010-02-25 | 2013-01-16 | シャープ株式会社 | 回路モジュールおよびそれを備えた電子機器ならびに回路モジュールの製造方法 |
KR101128931B1 (ko) * | 2010-08-11 | 2012-03-27 | 삼성전기주식회사 | 카메라 모듈 |
TWI525782B (zh) * | 2011-01-05 | 2016-03-11 | 矽品精密工業股份有限公司 | 半導體封裝件及其製法 |
US9105899B2 (en) * | 2012-09-07 | 2015-08-11 | Apple Inc. | Electronic device subassemblies |
CN103811432B (zh) * | 2012-11-12 | 2016-09-14 | 财团法人工业技术研究院 | 环境敏感电子元件封装体 |
KR20170057954A (ko) * | 2015-11-18 | 2017-05-26 | 삼성전자주식회사 | 쉴드캔 구조 |
CN109699115B (zh) * | 2017-10-23 | 2020-06-23 | 苏州旭创科技有限公司 | 光模块 |
JP2020155517A (ja) * | 2019-03-19 | 2020-09-24 | キオクシア株式会社 | 半導体装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03110906A (ja) * | 1989-09-26 | 1991-05-10 | Nec Corp | 発振器 |
JP2616280B2 (ja) * | 1991-04-27 | 1997-06-04 | 株式会社村田製作所 | 発振器及びその製造方法 |
JPH06252562A (ja) | 1993-02-26 | 1994-09-09 | Alps Electric Co Ltd | 多層回路基板 |
US5376759A (en) * | 1993-06-24 | 1994-12-27 | Northern Telecom Limited | Multiple layer printed circuit board |
JPH07263892A (ja) * | 1994-03-18 | 1995-10-13 | Sony Corp | ケース付き電子部品 |
JP2938820B2 (ja) * | 1996-03-14 | 1999-08-25 | ティーディーケイ株式会社 | 高周波モジュール |
US5875099A (en) * | 1996-05-09 | 1999-02-23 | Murata Manufacturing Co., Ltd. | Electronic component |
JP2850860B2 (ja) * | 1996-06-24 | 1999-01-27 | 住友金属工業株式会社 | 電子部品の製造方法 |
JPH10284935A (ja) * | 1997-04-09 | 1998-10-23 | Murata Mfg Co Ltd | 電圧制御発振器およびその製造方法 |
JPH1131893A (ja) * | 1997-05-12 | 1999-02-02 | Murata Mfg Co Ltd | 電子部品の製造方法およびそれを用いた電子部品 |
JP3679600B2 (ja) | 1998-02-19 | 2005-08-03 | 日本特殊陶業株式会社 | 表面実装用基板 |
JP3520776B2 (ja) * | 1998-05-28 | 2004-04-19 | 株式会社村田製作所 | 電子部品 |
JP3304898B2 (ja) * | 1998-11-20 | 2002-07-22 | 株式会社村田製作所 | 複合高周波部品及びそれを用いた移動体通信装置 |
JP3891737B2 (ja) * | 1999-04-19 | 2007-03-14 | シャープ株式会社 | 発振器及びその発振特性調整方法 |
JP2001237585A (ja) * | 2000-02-22 | 2001-08-31 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
GB2365007B (en) * | 2000-07-21 | 2002-06-26 | Murata Manufacturing Co | Insulative ceramic compact |
JP2002141248A (ja) * | 2000-11-02 | 2002-05-17 | Murata Mfg Co Ltd | セラミック電子部品およびその製造方法 |
US6760227B2 (en) * | 2000-11-02 | 2004-07-06 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component and manufacturing method thereof |
GB2371775B (en) * | 2000-12-19 | 2002-12-31 | Murata Manufacturing Co | Composite multilayer ceramic electronic parts and method of manfacturing the same |
KR100519422B1 (ko) * | 2001-03-28 | 2005-10-07 | 가부시키가이샤 무라타 세이사쿠쇼 | 절연체 세라믹 조성물 및 그것을 이용한 절연체 세라믹 |
JP3855679B2 (ja) * | 2001-05-01 | 2006-12-13 | 株式会社村田製作所 | 表面実装型電子部品 |
JP3843912B2 (ja) * | 2001-10-22 | 2006-11-08 | 株式会社村田製作所 | 多層回路基板用ガラスセラミック材料および多層回路基板 |
JP2004235184A (ja) * | 2003-01-28 | 2004-08-19 | Matsushita Electric Ind Co Ltd | 高周波装置 |
-
2006
- 2006-05-17 JP JP2006138235A patent/JP3969453B1/ja not_active Expired - Fee Related
-
2007
- 2007-03-02 TW TW096107162A patent/TWI336609B/zh not_active IP Right Cessation
- 2007-03-30 CN CN2007800178801A patent/CN101449635B/zh not_active Expired - Fee Related
- 2007-03-30 KR KR1020087027741A patent/KR100977391B1/ko not_active IP Right Cessation
- 2007-03-30 WO PCT/JP2007/057101 patent/WO2007132599A1/ja active Application Filing
- 2007-03-30 AT AT07740537T patent/ATE472931T1/de not_active IP Right Cessation
- 2007-03-30 EP EP07740537A patent/EP2019577B1/en not_active Not-in-force
- 2007-03-30 DE DE602007007470T patent/DE602007007470D1/de active Active
-
2008
- 2008-11-06 US US12/265,948 patent/US7660132B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP2019577B1 (en) | 2010-06-30 |
CN101449635B (zh) | 2012-06-13 |
ATE472931T1 (de) | 2010-07-15 |
JP2007311505A (ja) | 2007-11-29 |
WO2007132599A1 (ja) | 2007-11-22 |
US7660132B2 (en) | 2010-02-09 |
US20090052149A1 (en) | 2009-02-26 |
TWI336609B (en) | 2011-01-21 |
CN101449635A (zh) | 2009-06-03 |
JP3969453B1 (ja) | 2007-09-05 |
KR20080109091A (ko) | 2008-12-16 |
EP2019577A4 (en) | 2009-08-26 |
EP2019577A1 (en) | 2009-01-28 |
KR100977391B1 (ko) | 2010-08-20 |
DE602007007470D1 (de) | 2010-08-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |