TW200733431A - Method of sealing/molding optical element by resin - Google Patents
Method of sealing/molding optical element by resinInfo
- Publication number
- TW200733431A TW200733431A TW095148165A TW95148165A TW200733431A TW 200733431 A TW200733431 A TW 200733431A TW 095148165 A TW095148165 A TW 095148165A TW 95148165 A TW95148165 A TW 95148165A TW 200733431 A TW200733431 A TW 200733431A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- upper die
- substrate
- molten resin
- sealing
- Prior art date
Links
- 239000011347 resin Substances 0.000 title abstract 8
- 229920005989 resin Polymers 0.000 title abstract 8
- 238000000465 moulding Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 2
- 230000003287 optical effect Effects 0.000 title abstract 2
- 238000007789 sealing Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 4
- 239000000463 material Substances 0.000 abstract 2
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
- B29K2995/0029—Translucent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01L2924/01046—Palladium [Pd]
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- H01L2924/01047—Silver [Ag]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01078—Platinum [Pt]
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- H01L2924/01082—Lead [Pb]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006006922A JP5192646B2 (ja) | 2006-01-16 | 2006-01-16 | 光素子の樹脂封止方法、その樹脂封止装置、および、その製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200733431A true TW200733431A (en) | 2007-09-01 |
TWI325643B TWI325643B (zh) | 2010-06-01 |
Family
ID=38256154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095148165A TW200733431A (en) | 2006-01-16 | 2006-12-21 | Method of sealing/molding optical element by resin |
Country Status (8)
Country | Link |
---|---|
US (1) | US20090091048A1 (zh) |
EP (1) | EP1976028A1 (zh) |
JP (1) | JP5192646B2 (zh) |
KR (2) | KR101138077B1 (zh) |
CN (2) | CN101361201B (zh) |
MY (1) | MY151939A (zh) |
TW (1) | TW200733431A (zh) |
WO (1) | WO2007080742A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI381496B (zh) * | 2009-01-23 | 2013-01-01 | Everlight Electronics Co Ltd | 封裝基板結構與晶片封裝結構及其製程 |
TWI416674B (zh) * | 2008-11-05 | 2013-11-21 | Advanced Semiconductor Eng | 封膠模具與封膠方法 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009117536A (ja) * | 2007-11-05 | 2009-05-28 | Towa Corp | 樹脂封止発光体及びその製造方法 |
US20090230409A1 (en) * | 2008-03-17 | 2009-09-17 | Philips Lumileds Lighting Company, Llc | Underfill process for flip-chip leds |
DE102008025159A1 (de) | 2008-05-26 | 2009-12-10 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement, Reflexlichtschranke und Verfahren zur Herstellung eines Gehäuses |
US20100209670A1 (en) * | 2009-02-17 | 2010-08-19 | Nitto Denko Corporation | Sheet for photosemiconductor encapsulation |
JP5173940B2 (ja) * | 2009-06-02 | 2013-04-03 | アピックヤマダ株式会社 | 半導体パッケージの製造方法及び切断装置 |
KR20110011405A (ko) * | 2009-07-28 | 2011-02-08 | 한미반도체 주식회사 | 반도체 패키지 제조용 패키지 집합체 |
JP5894723B2 (ja) * | 2009-12-29 | 2016-03-30 | 株式会社朝日ラバー | 半導体発光装置の製造方法 |
WO2011109442A2 (en) * | 2010-03-02 | 2011-09-09 | Oliver Steven D | Led packaging with integrated optics and methods of manufacturing the same |
JP5563918B2 (ja) * | 2010-07-22 | 2014-07-30 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置の製造方法 |
JP5697919B2 (ja) * | 2010-07-29 | 2015-04-08 | Towa株式会社 | 樹脂封止装置及び樹脂封止方法 |
WO2012031703A1 (de) * | 2010-09-06 | 2012-03-15 | Heraeus Noblelight Gmbh | Beschichtungsverfahren für ein optoelektronisches chip-on-board-modul |
JP5744697B2 (ja) * | 2011-10-17 | 2015-07-08 | Towa株式会社 | 光電子部品及びその製造方法 |
EP2812929B1 (en) | 2012-02-10 | 2020-03-11 | Lumileds Holding B.V. | Molded lens forming a chip scale led package and method of manufacturing the same |
JP6559424B2 (ja) * | 2012-03-06 | 2019-08-14 | シグニファイ ホールディング ビー ヴィ | 照明モジュール及び照明モジュールを製造する方法 |
CN103437632A (zh) * | 2013-08-31 | 2013-12-11 | 德清科迪特安保设备有限公司 | 防潮保险柜 |
CN104051669B (zh) * | 2014-05-28 | 2016-02-03 | 京东方科技集团股份有限公司 | 封装基板、封装方法、显示面板 |
KR101638125B1 (ko) * | 2014-10-23 | 2016-07-11 | 주식회사 세미콘라이트 | 반도체 발광소자 및 이의 제조 방법 |
WO2016039593A1 (ko) | 2014-09-12 | 2016-03-17 | 주식회사 세미콘라이트 | 반도체 발광소자의 제조 방법 |
JP6356581B2 (ja) * | 2014-11-19 | 2018-07-11 | 信越化学工業株式会社 | 半導体装置の製造方法 |
JP6598723B2 (ja) * | 2016-04-06 | 2019-10-30 | 株式会社ディスコ | パッケージウェーハの製造方法 |
KR20170136158A (ko) * | 2016-06-01 | 2017-12-11 | 주식회사 라이트전자 | Uv 플립칩 led 면광원 모듈 |
JP6672113B2 (ja) * | 2016-09-09 | 2020-03-25 | Towa株式会社 | 電子回路装置及び電子回路装置の製造方法 |
CN108417699A (zh) * | 2018-05-18 | 2018-08-17 | 深圳市德彩光电有限公司 | Led光源的塑封模具 |
CN108807649B (zh) * | 2018-06-13 | 2020-09-11 | 深德彩光电(深圳)有限公司 | 一种led光源塑封方法 |
CN108547839A (zh) * | 2018-06-14 | 2018-09-18 | 深圳市德彩光电有限公司 | 封胶装置 |
CN109560181B (zh) * | 2018-11-16 | 2020-04-17 | 重庆秉为科技有限公司 | 一种led封装结构 |
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JP4326786B2 (ja) * | 2002-11-26 | 2009-09-09 | Towa株式会社 | 樹脂封止装置 |
JP4519398B2 (ja) * | 2002-11-26 | 2010-08-04 | Towa株式会社 | 樹脂封止方法及び半導体装置の製造方法 |
JP4336499B2 (ja) * | 2003-01-09 | 2009-09-30 | Towa株式会社 | 電子部品の樹脂封止成形方法及び装置 |
JP4182783B2 (ja) * | 2003-03-14 | 2008-11-19 | 豊田合成株式会社 | Ledパッケージ |
WO2005032757A1 (en) * | 2003-09-30 | 2005-04-14 | Matsushita Electric Industrial Co. Ltd. | Mold for optical components |
TW200522387A (en) * | 2003-12-26 | 2005-07-01 | Ind Tech Res Inst | High-power LED planarization encapsulation structure |
JP2005259847A (ja) * | 2004-03-10 | 2005-09-22 | Nitto Denko Corp | 光半導体装置の製造方法 |
JP5004410B2 (ja) * | 2004-04-26 | 2012-08-22 | Towa株式会社 | 光素子の樹脂封止成形方法および樹脂封止成形装置 |
-
2006
- 2006-01-16 JP JP2006006922A patent/JP5192646B2/ja active Active
- 2006-12-15 MY MYPI20082537 patent/MY151939A/en unknown
- 2006-12-15 KR KR1020107027347A patent/KR101138077B1/ko active IP Right Grant
- 2006-12-15 US US11/990,016 patent/US20090091048A1/en not_active Abandoned
- 2006-12-15 WO PCT/JP2006/325039 patent/WO2007080742A1/ja active Application Filing
- 2006-12-15 CN CN2006800511439A patent/CN101361201B/zh active Active
- 2006-12-15 EP EP06834782A patent/EP1976028A1/en not_active Withdrawn
- 2006-12-15 CN CN2012102853052A patent/CN102820234A/zh active Pending
- 2006-12-15 KR KR1020087017304A patent/KR20080078901A/ko active Application Filing
- 2006-12-21 TW TW095148165A patent/TW200733431A/zh unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI416674B (zh) * | 2008-11-05 | 2013-11-21 | Advanced Semiconductor Eng | 封膠模具與封膠方法 |
TWI381496B (zh) * | 2009-01-23 | 2013-01-01 | Everlight Electronics Co Ltd | 封裝基板結構與晶片封裝結構及其製程 |
US8513820B2 (en) | 2009-01-23 | 2013-08-20 | Everlight Electronics Co., Ltd. | Package substrate structure and chip package structure and manufacturing process thereof |
Also Published As
Publication number | Publication date |
---|---|
MY151939A (en) | 2014-07-31 |
CN101361201A (zh) | 2009-02-04 |
JP5192646B2 (ja) | 2013-05-08 |
KR20080078901A (ko) | 2008-08-28 |
WO2007080742A1 (ja) | 2007-07-19 |
US20090091048A1 (en) | 2009-04-09 |
EP1976028A1 (en) | 2008-10-01 |
TWI325643B (zh) | 2010-06-01 |
KR101138077B1 (ko) | 2012-04-24 |
CN101361201B (zh) | 2013-04-03 |
CN102820234A (zh) | 2012-12-12 |
KR20100132563A (ko) | 2010-12-17 |
JP2007189116A (ja) | 2007-07-26 |
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