CN109560181B - 一种led封装结构 - Google Patents
一种led封装结构 Download PDFInfo
- Publication number
- CN109560181B CN109560181B CN201811366063.3A CN201811366063A CN109560181B CN 109560181 B CN109560181 B CN 109560181B CN 201811366063 A CN201811366063 A CN 201811366063A CN 109560181 B CN109560181 B CN 109560181B
- Authority
- CN
- China
- Prior art keywords
- silica gel
- gel layer
- light
- package structure
- led package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 55
- 239000000741 silica gel Substances 0.000 claims abstract description 48
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 48
- 239000000463 material Substances 0.000 claims abstract description 6
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 230000007704 transition Effects 0.000 claims description 14
- 239000004576 sand Substances 0.000 claims description 7
- 238000005286 illumination Methods 0.000 abstract description 5
- 230000032683 aging Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 38
- 230000005540 biological transmission Effects 0.000 description 7
- 229920002379 silicone rubber Polymers 0.000 description 7
- 239000004945 silicone rubber Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000002654 heat shrinkable material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811366063.3A CN109560181B (zh) | 2018-11-16 | 2018-11-16 | 一种led封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811366063.3A CN109560181B (zh) | 2018-11-16 | 2018-11-16 | 一种led封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109560181A CN109560181A (zh) | 2019-04-02 |
CN109560181B true CN109560181B (zh) | 2020-04-17 |
Family
ID=65866491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811366063.3A Active CN109560181B (zh) | 2018-11-16 | 2018-11-16 | 一种led封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109560181B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114400278A (zh) * | 2021-12-27 | 2022-04-26 | 江苏国中芯半导体科技有限公司 | Led封装基板以及使用该led封装基板的led封装设备 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS634010U (zh) * | 1986-06-27 | 1988-01-12 | ||
JP5192646B2 (ja) * | 2006-01-16 | 2013-05-08 | Towa株式会社 | 光素子の樹脂封止方法、その樹脂封止装置、および、その製造方法 |
US8092042B2 (en) * | 2007-05-03 | 2012-01-10 | Ruud Lighting, Inc. | Shield member in LED apparatus |
-
2018
- 2018-11-16 CN CN201811366063.3A patent/CN109560181B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN109560181A (zh) | 2019-04-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102374421B (zh) | 灯具 | |
CN102410452B (zh) | 照明模块及包括该照明模块的照明装置 | |
WO2011017085A2 (en) | Solid state light with optical guide and integrated thermal guide | |
EP2893255B1 (en) | Lighting device with integrated lens heat sink | |
US9070845B2 (en) | Optical semiconductor lighting apparatus | |
JP2011159970A (ja) | 発光素子パッケージ | |
US20130033164A1 (en) | Planar remote phosphor illumination apparatus | |
KR20120027320A (ko) | Led 광 엔진 및 그 제조 방법 | |
CN109560181B (zh) | 一种led封装结构 | |
EP3195375A1 (en) | Flexible light emitting device | |
RU2011153969A (ru) | Эффективное светоизлучающее устройство и способ изготовления такого устройства | |
JP2014007145A (ja) | 照明装置 | |
US8952407B2 (en) | Lighting device | |
JP2012114081A (ja) | グレア低減照明装置 | |
KR20150013052A (ko) | 액상 봉지재를 갖는 광원 | |
RU2596941C2 (ru) | Компактное светоизлучающее устройство с преобразованием длины волны | |
JP2005116817A (ja) | Ledランプ用パッケージおよび該ledランプ用パッケージを具備するledランプ | |
US20150221839A1 (en) | Light emitting device package and lighting apparatus including the same | |
KR101349833B1 (ko) | Led 조명장치 | |
KR101087064B1 (ko) | 엘이디 패키지용 렌즈 및 이를 이용한 엘이디 패키지 | |
CN203442717U (zh) | 照明器具 | |
KR20130110997A (ko) | Led용 렌즈 및 그 제조방법 | |
KR101549028B1 (ko) | 조명장치 | |
KR101519013B1 (ko) | 렌즈 어레이를 구비한 발광 유닛 및 발광 유닛의 확산 부재 제조 방법 | |
CN104121549A (zh) | 灯泡结构及其导光式灯罩 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201130 Address after: Room 11-8, building 2, No. 60, Kecheng Road, Jiulongpo District, Chongqing Patentee after: Chongqing Bingwei photoelectric Co., Ltd Patentee after: CHONGQING BINGWEI TECHNOLOGY Co.,Ltd. Address before: Floor 11, building 2, No. 60, Kecheng Road, Jiulongpo District, Chongqing Patentee before: CHONGQING BINGWEI TECHNOLOGY Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201228 Address after: 400039 building 4, No.39 Xinggu Road, Jiulongpo District, Chongqing Patentee after: CHONGQING BINGWEI TECHNOLOGY Co.,Ltd. Address before: 400039 11-8, building 2, No. 60, Kecheng Road, Jiulongpo District, Chongqing Patentee before: Chongqing Bingwei photoelectric Co., Ltd Patentee before: CHONGQING BINGWEI TECHNOLOGY Co.,Ltd. |
|
TR01 | Transfer of patent right |