JP6559424B2 - 照明モジュール及び照明モジュールを製造する方法 - Google Patents
照明モジュール及び照明モジュールを製造する方法 Download PDFInfo
- Publication number
- JP6559424B2 JP6559424B2 JP2014560476A JP2014560476A JP6559424B2 JP 6559424 B2 JP6559424 B2 JP 6559424B2 JP 2014560476 A JP2014560476 A JP 2014560476A JP 2014560476 A JP2014560476 A JP 2014560476A JP 6559424 B2 JP6559424 B2 JP 6559424B2
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- JP
- Japan
- Prior art keywords
- heat sink
- sink material
- light source
- lighting module
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
- F21S8/06—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
Description
Claims (12)
- 流体状態のヒートシンク材料を提供するステップと、
各光源が発光面を有し、導電性の担体に電気的に接続されている複数の光源を含む光源アセンブリを提供するステップと、
前記導電性の担体と前記複数の光源の各光源の一部とが前記ヒートシンク材料によって覆われる一方で、前記複数の光源の各光源の前記発光面が前記ヒートシンク材料によって覆われないように、前記光源アセンブリを前記ヒートシンク材料の中に埋め込むステップと、
前記ヒートシンク材料を凝固させるステップと、
を含み、
前記ヒートシンク材料は、少なくとも1つのセラミック材料を含む、
照明モジュールを製造する方法。 - 前記ヒートシンク材料は、不透明である、請求項1に記載の方法。
- 前記少なくとも1つのセラミック材料は、粘土、コンクリート及び磁器からなる群から選択される、請求項1又は2に記載の方法。
- 前記導電性の担体は、ワイヤグリッドを含む、請求項1乃至3の何れか一項に記載の方法。
- 前記複数の光源のうちの少なくとも1つに、蛍光体層を付与するステップを更に含む、請求項1乃至4の何れか一項に記載の方法。
- 前記複数の光源のうちの少なくとも1つに、光学構造体を付与するステップを更に含む、請求項1乃至5の何れか一項に記載の方法。
- 前記複数の光源のうちの少なくとも1つに、保護層を付与するステップを更に含む、請求項1乃至6の何れか一項に記載の方法。
- 前記埋め込むステップは、
基部と、前記基部から突出する少なくとも1つの突出部とを含む加圧手段によって前記光源アセンブリを前記流体状態の前記ヒートシンク材料の中に押し込むステップを含み、前記少なくとも1つの突出部は、前記ヒートシンク材料が前記発光面を覆わないように、少なくとも1つの光源の前記発光面において前記少なくとも1つの光源を前記ヒートシンク材料の中に押し込む、請求項1乃至7の何れか一項に記載の方法。 - 前記ヒートシンク材料は、前記少なくとも1つの光源の周りにキャビティを形成するように前記光源アセンブリが前記ヒートシンク材料の中に押し込まれると前記加圧手段によって成形される、請求項8に記載の方法。
- 前記凝固させるステップは、
前記ヒートシンク材料を重合させるステップを含む、請求項1乃至9の何れか一項に記載の方法。 - 前記凝固させるステップは、
前記ヒートシンク材料を加熱するステップを含む、請求項1乃至9の何れか一項に記載の方法。 - 前記凝固させるステップは、
前記ヒートシンク材料を加圧するステップを含む、請求項1乃至9の何れか一項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261607058P | 2012-03-06 | 2012-03-06 | |
US61/607,058 | 2012-03-06 | ||
PCT/IB2013/051563 WO2013132389A1 (en) | 2012-03-06 | 2013-02-27 | Lighting module and method of manufacturing a lighting module |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015511066A JP2015511066A (ja) | 2015-04-13 |
JP2015511066A5 JP2015511066A5 (ja) | 2016-04-14 |
JP6559424B2 true JP6559424B2 (ja) | 2019-08-14 |
Family
ID=48093044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014560476A Active JP6559424B2 (ja) | 2012-03-06 | 2013-02-27 | 照明モジュール及び照明モジュールを製造する方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9777890B2 (ja) |
EP (1) | EP2823517B1 (ja) |
JP (1) | JP6559424B2 (ja) |
CN (1) | CN104160522B (ja) |
WO (1) | WO2013132389A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150131295A1 (en) * | 2013-11-12 | 2015-05-14 | GE Lighting Solutions, LLC | Thin-film coating for improved outdoor led reflectors |
US11562982B2 (en) * | 2019-04-29 | 2023-01-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit packages and methods of forming the same |
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-
2013
- 2013-02-27 WO PCT/IB2013/051563 patent/WO2013132389A1/en active Application Filing
- 2013-02-27 EP EP13716059.4A patent/EP2823517B1/en active Active
- 2013-02-27 CN CN201380012842.2A patent/CN104160522B/zh active Active
- 2013-02-27 JP JP2014560476A patent/JP6559424B2/ja active Active
- 2013-02-27 US US14/381,240 patent/US9777890B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2015511066A (ja) | 2015-04-13 |
CN104160522A (zh) | 2014-11-19 |
CN104160522B (zh) | 2017-12-22 |
US9777890B2 (en) | 2017-10-03 |
US20150103521A1 (en) | 2015-04-16 |
EP2823517B1 (en) | 2016-04-27 |
EP2823517A1 (en) | 2015-01-14 |
WO2013132389A1 (en) | 2013-09-12 |
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