TW200704309A - Manufacturing method of mounting substrate with reflector - Google Patents
Manufacturing method of mounting substrate with reflectorInfo
- Publication number
- TW200704309A TW200704309A TW094133473A TW94133473A TW200704309A TW 200704309 A TW200704309 A TW 200704309A TW 094133473 A TW094133473 A TW 094133473A TW 94133473 A TW94133473 A TW 94133473A TW 200704309 A TW200704309 A TW 200704309A
- Authority
- TW
- Taiwan
- Prior art keywords
- reflector
- electric conduction
- plating film
- foils
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
Abstract
Conventionally, white resin with high reflectivity is much used as a reflector for reflecting the light from illuminating elements, but the reflector needs a mold for resin molding and it takes time for trial production. In the present invention, reflector substrate (34) is provided with electric conduction foils (35, 36) on both sides, through hole (31) is so formed as to pass through electric conduction foils (35, 36), slant surface (32) of inner wall of through hole is formed with electric conduction plating film (37), and reflection plating film (33) is formed on the electric conduction foil (35) and electric conduction plating film(37), thereby the reflector can be mechanically formed on a glass epoxy substrate.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005195610A JP3963923B2 (en) | 2005-07-04 | 2005-07-04 | Manufacturing method of mounting substrate with reflector |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200704309A true TW200704309A (en) | 2007-01-16 |
TWI353807B TWI353807B (en) | 2011-12-01 |
Family
ID=37597689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94133473A TWI353807B (en) | 2005-07-04 | 2005-09-27 | Manufacturing method of mounting substrate withref |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3963923B2 (en) |
KR (1) | KR101155693B1 (en) |
CN (1) | CN1892979A (en) |
TW (1) | TWI353807B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100958329B1 (en) * | 2009-08-14 | 2010-05-17 | (주)참빛 | Light emitting diode package substrate having side reflective surface coated with metals using mask and manufacturing method thereof |
JP5780044B2 (en) * | 2011-08-05 | 2015-09-16 | 大日本印刷株式会社 | Manufacturing method of substrate with reflector |
JP2013110179A (en) * | 2011-11-18 | 2013-06-06 | Citizen Holdings Co Ltd | Semiconductor light-emitting device |
KR101292197B1 (en) * | 2012-04-10 | 2013-08-01 | 대덕전자 주식회사 | Method for manufacturing a reflector for led chip mounted printed circuit board |
JP2014063777A (en) * | 2012-09-19 | 2014-04-10 | Chang Wah Electromaterials Inc | Method of manufacturing light-emitting diode package and structure thereof |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11220178A (en) * | 1998-01-30 | 1999-08-10 | Rohm Co Ltd | Semiconductor light-emitting device |
-
2005
- 2005-07-04 JP JP2005195610A patent/JP3963923B2/en active Active
- 2005-09-27 TW TW94133473A patent/TWI353807B/en not_active IP Right Cessation
- 2005-10-06 KR KR1020050093775A patent/KR101155693B1/en not_active IP Right Cessation
- 2005-10-31 CN CN 200510118761 patent/CN1892979A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP3963923B2 (en) | 2007-08-22 |
JP2007013067A (en) | 2007-01-18 |
KR20070004402A (en) | 2007-01-09 |
KR101155693B1 (en) | 2012-06-12 |
CN1892979A (en) | 2007-01-10 |
TWI353807B (en) | 2011-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |