KR100958329B1 - Light emitting diode package substrate having side reflective surface coated with metals using mask and manufacturing method thereof - Google Patents

Light emitting diode package substrate having side reflective surface coated with metals using mask and manufacturing method thereof Download PDF

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Publication number
KR100958329B1
KR100958329B1 KR1020090075307A KR20090075307A KR100958329B1 KR 100958329 B1 KR100958329 B1 KR 100958329B1 KR 1020090075307 A KR1020090075307 A KR 1020090075307A KR 20090075307 A KR20090075307 A KR 20090075307A KR 100958329 B1 KR100958329 B1 KR 100958329B1
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KR
South Korea
Prior art keywords
package substrate
opening
light emitting
emitting diode
metal
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KR1020090075307A
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Korean (ko)
Inventor
조현춘
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(주)참빛
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Priority to KR1020090075307A priority Critical patent/KR100958329B1/en
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Publication of KR100958329B1 publication Critical patent/KR100958329B1/en
Priority to PCT/KR2010/004644 priority patent/WO2011019145A2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Abstract

The present invention provides an expensive photoresist process when coating a metal reflective layer on a side of a polymer in an opening to increase brightness reliability and light extraction efficiency of a light emitting diode package substrate molded by polymer-based plastic on a metal electrode. Instead, the present invention relates to a light emitting diode package substrate manufactured by applying a mask and a method of manufacturing the same. When there is no heat slug at the bottom of the opening, the metal reflective layer is divided into regions electrically insulated by the number of electrodes, and each region is connected to one of the bottom metal electrodes. In the LED package substrate according to the present invention, a mask that can be repeatedly used in a three-dimensional structure having a through hole corresponding to a light reflection surface area inside the opening is mounted on a package substrate having an opening for mounting the LED chip. In addition, the metal reflective surface is formed by coating a metal material on the light reflection surface area by a predetermined coating method.

Description

Light Emitting Diode Package Substrate Having Side Reflective Surface Coated With Metals using Mask and Manufacturing Method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package substrate for a light emitting diode, wherein the first package of a light emitting diode improves luminance reliability by preventing continuous degradation of the polymer due to deterioration of the polymer as the use time increases. In order to increase light extraction efficiency by using an excellent metal material, a light emitting diode package substrate coated with a metal reflective layer on the side of an opening made of a polymer, and a method of manufacturing the same. An expensive photoresist and an exposure device are generally used. The present invention relates to a light emitting diode package substrate manufactured by forming a metal reflective layer in a desired pattern in an opening by applying a mask having a three-dimensional shape, which can be repeatedly used instead of using a process.

The light emitting diode is a structure in which an active layer is bonded between a p-type semiconductor layer and an n-type semiconductor layer, and when a forward voltage is applied, the light emitting diode recombines the excited electrons in the active layer to emit light. Such light emitting diodes are used as light emitting lamps of various electronic devices such as automobile dashboards, taillights, keyboards, traffic lights and LCD backlights.

Since these light emitting diodes are made in a chip form, they are often applied to a system (primarily a PCB) required in a package form mounted on a package substrate. BACKGROUND ART Package substrates for light emitting diodes, which are commonly used, include a metal electrode for supplying power, a housing (polymer or ceramic) that collects light forward, and a metal heat slug for dissipating heat generated from the device. (There is also a substrate without heat slug). The package substrate made of ceramic is excellent in durability against heat and light generated in the device, but is used only in special cases where high reliability is necessary because of its high price, and in most cases, a package substrate made of a polymer housing is used. However, the inner side of the opening in which the light emitting diode is mounted on the substrate having the polymer housing is affected by heat and short wavelength light generated from the device so that the color of the polymer turns black or leaks light due to cracks in the polymer. As a result, the phenomenon that the luminance gradually decreases with time occurs. When this happens, it becomes a serious problem in LCD-TV, monitor BLU, etc., which require high reliability even after long time use.

In order to solve this problem, coating the metal on the side reflecting surface of the polymer housing opening prevents discoloration over time, thereby improving luminance reliability and increasing the light extraction efficiency by coating a metal with better reflection efficiency than polymer. Can be. However, as shown in FIG. 1, the polymer that insulates the metal electrodes on the bottom surface of the package substrate should not be coated, and the metal reflective layer on the side of the opening portion is also two or more regions electrically separated by the number of metal electrodes. You must have In order to classify and coat the above-mentioned areas, a patterned barrier film is required to prevent the coating on a desired portion in advance. However, since the light emitting diode package substrate has a three-dimensional surface having a three-dimensional shape rather than a plane, it is not only a technically difficult problem but also expensive materials and materials when the existing PR (Photo Resist) or Dry Film PR is applied. The use of equipment (exposures) leads to a high cost and low productivity, which leads to a significant increase in price, which makes it more advantageous to use a packaging substrate with a high performance ceramic housing. Therefore, it is necessary to develop a metal coating method and a package substrate using the same in a desired form at a low cost.

Accordingly, an object of the present invention is to solve the above-described problem, and an object of the present invention is to provide a three-dimensional mask in close contact with an opening of a package substrate without using an expensive PR, and to provide an inclined surface inside the opening in which the LED chip is mounted. The present invention provides a package substrate for a light emitting diode manufactured by easily coating a metal reflective layer and a method of manufacturing the same.

In order to enable the formation of such a low-cost metal reflective layer, a metal electrode, which is a package board for low-cost LEDs, which is widely used in the past, is electrically insulated from a substrate having a polymer housing and separated into regions separated from each other by the number of electrodes. It has a structure for forming a true metal reflective layer. At this time, since each reflective layer is connected to one of the metal electrodes, the shape of the mask can be simplified to reduce the manufacturing cost of the mask and to apply electricity to the electrodes commonly connected to the plurality of substrate arrays in the plating process. Since the main surface is electrically connected to the reflective layers of each substrate at the same time, electroplating can be easily performed.

Another object of the present invention is to place a mask on a curved package substrate, and to coat the metal material on the side of the opening of the package substrate by vacuum deposition (Sputtering, Evaporation, CVD, etc.), electroplating or chemical plating, etc. The present invention provides a light emitting diode package substrate and a method of manufacturing the same by forming a reflective layer and improving light extraction efficiency and luminance reliability at low cost.

First, to summarize the features of the present invention, a light emitting diode package substrate for mounting a light emitting diode chip in a housing having an opening in accordance with an aspect of the present invention for achieving the above object, the bottom of the opening It includes at least two metal electrodes formed to be electrically insulated from the surface, and is predetermined in the reflective layer region except for the insulation portion of the bottom surface other than the metal electrodes and the insulation portion of the inclined surface inside the opening extending from the insulation portion of the bottom surface. It characterized in that it comprises a structure in which a reflective surface is coated with a metal material in a coating manner.

In the method of manufacturing a light emitting diode package substrate, a penetrating portion corresponding to a reflective layer region having a desired pattern (shape) is formed on a housing having an opening for mounting a light emitting diode chip (an opening may be formed in a polymer housing or a ceramic housing). A mask having a hole is placed thereon, and a reflective surface is formed by coating a metal material on the reflective layer region by a predetermined coating method. The mask is made of metal or polymer, or a combination of both, and can be reused at least thousands of times, depending on the working conditions, and has a three-dimensional shape that exactly matches the concave-convexities that do not coat the desired area within the package substrate opening. Are manufactured precisely.

In the LED package substrate manufactured by the above method, the reflective surface includes a bottom surface of the opening and an inclined surface from the bottom surface to the top surface of the package substrate and does not include the outside of the housing.

Before the coating, the bottom surface of the opening includes two or more metal electrodes formed to be electrically insulated, and the protruding portion of the bottom surface of the mask is in close contact with an insulating portion other than the metal electrodes to mask the metal material from being coded. It is characterized in that the manufactured.

Sides of the openings are made of polymer (or ceramic) series.

At least one or more of the adhesive layer, the intermediate layer, and the light reflection layer may be sequentially coated with a metal material.

The adhesive layer is coated by a vacuum deposition method or an electroless chemical plating method, and in the case of vacuum deposition, a mask is placed on a package substrate and plasma is applied to modify the exposed polymer surface to improve the adhesion of the adhesive layer. Coat the metal corresponding to the adhesive layer. On the other hand, in the case of electroless chemical plating of the adhesive layer, the mask is placed on the package substrate, the polymer surface exposed to the plasma is modified, the mask is removed, and the chemical plating is performed so that only the portion where the surface is modified is plated. .

 The intermediate layer may be coated by a vacuum deposition method or an electroless chemical plating method or a combination of an electroless plating and an electrochemical method, and the light reflection layer may be coated by a vacuum deposition method or an electroplating method.

Before coating the adhesive layer, the metal material may be coated on the metal electrode formed on the bottom surface of the opening. The surface treatment may be performed by electroplating or electroless chemical plating.

According to the light emitting diode package substrate and the method of manufacturing the same, a metal reflective layer is easily formed in a desired shape on an inclined surface inside the opening in which the light emitting diode chip is mounted by closely attaching a mask to the package substrate without a complicated process with an expensive material such as a photoresist. It is possible to provide a package substrate for a light emitting diode manufactured by coating.

In addition, according to the light emitting diode package substrate and the manufacturing method thereof according to the present invention, the mask is placed on a curved package substrate, and the method is applied by vacuum deposition (Sputtering, Evaporation, CVD, etc.), electroplating or chemical plating. Since the side reflective layer can be formed by simply coating a metal material, it is possible to provide a light emitting diode package with improved light extraction efficiency and luminance reliability at low cost. Because light extraction efficiency is improved, less power may be used to achieve the same brightness, which reduces the amount of heat generated, thus facilitating the heat dissipation design of the entire system.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. Like reference numerals in the drawings denote like elements.

1 is a perspective view of a light emitting diode package 10 according to an embodiment of the present invention.

Referring to FIG. 1, a light emitting diode package substrate 10 according to an exemplary embodiment of the present invention directly contacts a mask 42 (see FIG. 4) on a polymer resin-based housing 11 having a groove formed therein. On the surface of the reflective layer, the reflective surface 12 and 13 are formed by coating a metal material with a predetermined coating method. The housing 11 portion including the side surface of the opening may be made of polymer resin, and in some cases, may be made of another material such as ceramic.

As can also be seen in FIG. 2, which shows a cross-sectional view between AB of FIG. 1, two metal electrodes formed to be electrically insulated from the bottom surface inside the opening of the package substrate 10 before the reflective surfaces 12, 13 are formed. Field 14 (more than two metal electrodes are also possible, as shown in FIG. 7), from the bottom surface 12 (exposed surface of the insulated electrodes) and the bottom surface 12 inside the opening of the housing 11. The reflective surface is formed on the inclined surface 13 to the upper surface of the housing 11. The reflective surfaces 12 and 13 have a structure in which at least one or more of the adhesive layer 21, the intermediate layer 22, and the light reflection layer 23 are sequentially coated with a metal material. As described below, the adhesive layer and the intermediate layer 22 may be omitted as necessary.

3 is a cross-sectional view between A-B of a package in which the light emitting diode chip 15 is mounted on the package substrate 10 of FIG.

As shown in FIG. 3, the light emitting diode chip 15 is formed on the bottom surface of the inside of the opening of the housing 11 after the reflective surfaces 12 and 13 are formed, and the two metal electrodes 14 are respectively formed on the light emitting diode chip ( The wire bonding is performed with two terminals formed in 15). Of course, according to the characteristics and type of the light emitting diode chip 15 is used according to a variety of packaging methods that are commonly applied, such as one wire bonding or another method instead of wire bonding. At this time, if necessary, one of the electrodes of the light emitting diode chip 15 may be connected to the electrodes of the package substrate 10 through a zener diode. As described above, after the LED chip 15 is mounted, the inside of the opening 11 of the housing 11 may be filled with a light transmissive material such as transparent resin or glass.

Accordingly, the light emitting diode chip 15 is operated and emitted to the side through the reflective surfaces 12 and 13 formed by directly placing the mask 42 (see FIG. 4) on the package substrate 10 according to the present invention. The light can be reflected to the front. The use of such reflective surfaces 12 and 13 can increase the light extraction efficiency from the light emitting diode chip 15, and as the use time of the device elapses, the side surface of the opening of the housing 11 made of a polymer resin is lighted. It is possible to prevent the discoloration gradually becoming black by heat or heat. In other words, by using the reflective surfaces 12 and 13, discoloration is prevented to improve luminance reliability, and an increase in luminance means that less power can be used to obtain the same luminance, and thus heat dissipation design can be easily performed. have.

4 is a view for explaining a manufacturing process of the LED package substrate 10 according to an embodiment of the present invention.

As shown in Figure 4, in order to manufacture the LED package substrate 10 according to an embodiment of the present invention, first, two metals formed to be electrically insulated on the bottom surface inside each opening for mounting the LED chip The package substrate array 110 formed by molding each polymer (or ceramic) housing 11 to have the electrodes 14 is prepared. Next, on each housing 11 in which openings are formed in portions of the package substrate array 110 to be separated into respective package substrates, a mask consisting of a projecting portion 40 and a planar portion 41 of the lower surface ( 42) and the reflective surface (12, 13) is formed by coating a metal material on the reflective layer region by a predetermined coating method. 4 illustrates a process of manufacturing a plurality of package substrates in the form of an array, and after all processes are completed, may be separated into individual package substrates 10 along the cutting line 19.

As shown in FIG. 5, the mask 42 used herein has a through hole corresponding to the reflective layer region inside the opening of the package substrate 10, and a metal material passes through the through hole to allow the mask 42 to be disposed within the opening of the package substrate 10. By being deposited on the bottom surface 12 and the inclined surface 13, it is possible to form a reflective surface.

4 or 6, the lower surface of the mask is provided with a protruding portion 40, and the protruding portion 40 is formed on the bottom surface of the inside of the opening of the package substrate 10 except for the metal electrodes 12. The insulating surface 18 is also in close contact with the insulating portion of the inclined surface of the opening extending from the mask, so that the metal material is masked so that the coating of the reflective surface 13 is performed.

As such, the process of forming the reflective surfaces 12 and 13 in the reflective layer region by directly placing the mask 42 on the package substrate 10 may include an adhesive layer constituting the reflective surfaces 12 and 13 as shown in [Table 1]. 21), the intermediate layer 21, and the light reflection layer 23 may be formed in various ways.

TABLE 1

Coating method 1 Coating method 2 Coating method 3 Adhesive layer Vacuum deposition Vacuum deposition Chemical plating Mezzanine Vacuum deposition (Process can be omitted) Chemical plating Light reflection layer Electroplating Vacuum deposition Electroplating

For example, first, in order to coat the tie layer 21 according to the first coating method of [Table 1], a vacuum deposition method such as sputtering, chemical vapor deposition (CVD), evaporation, or the like is used. It is available. As shown in FIG. 4, the mask 42 is placed directly on the package substrate 10, and the bottom surface 12 and the inclined surface 13, which are exposed surfaces of the metal electrode 14 inside the opening, are formed by the vacuum deposition method. It may be coated with a metal material, such as Cr, Ti, Ni, W, Cu, or an alloy material including at least one of them, which may enhance adhesion to the metal.

In some cases, a metal material, eg, on the exposed surface of the metal electrode 14, on the bottom surface 12 inside the opening of the package substrate 10, prior to coating the adhesive layer 21 by vacuum deposition, may be used. For example, a metal thin film (or a plurality of thin films) such as Ag, Pd, Au, Ni, Cu, Cr, Sn or an alloy including at least one of them may be surface treated. This is a treatment to increase the adhesion between the metal electrode 14 and the adhesive layer 21, or in the case of the coating method-2, in order to satisfy the wire bonding and soldering requirements, the electroplating method or It may be made by an electroless chemical plating method. In the case of manufacturing the plurality of package substrates 10 using the package substrate array 110 as shown in FIG. 4, since the metal electrodes 14 on the package substrate array 110 are all electrically connected, the electroplating method is performed. In this case, power is applied to all of the metal electrodes 14 at the same time to facilitate the processing of the plurality of package substrates 10 at a time.

Next, in order to coat the intermediate layer 22 between the adhesive layer 21 and the light reflection layer 23, the mask 42 is placed directly on the package substrate 10 and the adhesive layer 21 is formed by the vacuum deposition method as described above. The coating may be coated with a material such as Ni, Cu, Al, Ag, or an alloy material including at least one of them in order to further enhance adhesion to and to serve as an electrode in subsequent electroplating.

In addition, when the light reflection layer 23 is coated on the intermediate layer 22 by electroplating, the light reflection layer 23 is plated only in a region in which the intermediate layer serves as an electrode in the plating process and the intermediate layer is formed. It is not necessary to place the mask 42 directly on the surface, and in this case, a metal material having excellent light reflection characteristics by electroplating using a predetermined electrolysis method, for example, Ag, Pd, Au, Al, or at least any of these Immerse the package substrate 10 coated with the intermediate layer 22 in an electrolyte solution containing an alloy material including one, and can coat the corresponding metal material as described above due to the power supply to the metal electrode 14 connected to the outside. In this case, when manufacturing the plurality of package substrates 10 using the package substrate array 110 as shown in FIG. 4, since the metal electrodes 14 on the package substrate array 110 are all electrically connected, In the case of such an electroplating method, power is applied to all of the metal electrodes 14 at the same time to facilitate the processing of the plurality of package substrates 10 at a time.

Meanwhile, in the case of the second coating method of Table 1, the intermediate layer 22 may be formed, and in some cases, the intermediate layer 22 may be omitted. If the intermediate layer 22 is omitted, the adhesive layer 21 and the light reflection layer 23 may be sequentially coated using the above vacuum deposition method.

As another example, as in the third coating method of [Table 1], after coating the adhesive layer 21 by an electroless chemical plating method and the intermediate layer 22 by an electroless chemical plating method or an electroplating method, the light reflection layer 23 may be coated by the above electroplating method. Here, in the electroless chemical plating method, the mask 42 is directly placed on the package substrate 10, and the plasma treatment is performed on the reflective layer region inside the opening exposed to the plasma through the through hole of the mask 42. After surface modification is performed, only exposed parts are plated by chemical action. After removing the mask 42 placed on the surface-modified package substrate 10 on the portion to be coated as above, the package substrate 11 is immersed in an electrolyte prepared in advance so that the metal material may be chemically plated. 21 and the intermediate layer 22 may be coated with the metal material. Even using the electroless chemical plating method, the adhesive layer 21 may be coated with Ni, Cu, Cr, Ti, Al, or an alloy material including at least one of them, and the intermediate layer 22 may be Ni, Cu, Al, It may be coated with Ag or an alloy material including at least one of them.

In order to make the mask 42 adhere to the package substrate 10 as much as possible and to prevent the mask 42 from shaking in the vacuum deposition coating process or the plasma treatment process for electroless chemical plating, the package substrate may be The mask 42 matched with 10 may be fixed. This may be the case when the mask 42 is made of a rigid material such as metal, polymer, ceramic, or the like. In addition, the mask 42 may be manufactured in the form of a flexible film or tape. In this case, the mask 42 is fixed to the package substrate 10 using a predetermined fixing means, and then the mask 42 is fixed as described above. In this manner, the reflective surface 13 may be coated. The mask may be repeatedly reused thousands of times, and depending on the process, the mask may be infinitely reused until mechanical durability is reached.

As such, in the present invention, a predetermined mask 42 having a three-dimensional structure is placed on the curved package substrate 10, and vacuum deposition (PVD, CVD, etc.) Since the reflective surface 13 may be coated by plating or chemical plating, a light emitting diode package having improved light extraction efficiency and luminance reliability may be easily provided at low cost. This improvement in light extraction efficiency means that less power can be used to achieve the same brightness, which reduces heat generation and facilitates heat dissipation design.

7 is a perspective view of a light emitting diode package substrate 70 according to another embodiment of the present invention. As shown in FIG. 7, the LED package substrate 70 according to another embodiment of the present invention includes metal electrodes 72 formed to electrically insulate the bottom surface of the opening of the housing made of a polymer or ceramic material. Two or more, for example four, in which case the bottom surface and the bottom inside the opening of the housing according to the method of the invention in which the mask 42 is placed directly on the package substrate and the reflective layer area is coated. The reflective surface 73 may be formed on the inclined surface from the surface to the upper surface of the package substrate. As shown in FIG. 2, the reflective surface 73 may be formed by sequentially coating at least one of the adhesive layer 21, the intermediate layer 22, and the light reflection layer 23 with a metal material.

8 is a perspective view of a light emitting diode package 80 according to another embodiment of the present invention.

As shown in FIG. 8, in the LED package substrate 80 according to another exemplary embodiment, a heat slug 84 is formed on a bottom surface of an opening of a housing made of a polymer or a ceramic. This includes the case where there are two or more metal electrodes 82 formed in each opening so as to be electrically insulated from the upper surface side of the package substrate. In this case, the reflective layer is placed directly on the package substrate. Reflective surfaces 83 can be formed on the bottom surface inside the opening of the housing and on the inclined surface from the bottom surface to the top surface of the package substrate in accordance with the inventive method of coating the area. In the substrate having the heat slug, the opening side metal reflective layer consists of one region, which is insulated from the metal electrode and instead connected to the heat slug. Here, the reflective surface 83 may be formed by sequentially coating at least one of the adhesive layer 21, the intermediate layer 22, and the light reflection layer 23 with a metal material as shown in FIG. 2.

As described above, the present invention has been described by way of limited embodiments and drawings, but the present invention is not limited to the above embodiments, and those skilled in the art to which the present invention pertains various modifications and variations from such descriptions. This is possible. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below but also by the equivalents of the claims.

1 is a perspective view of a light emitting diode package substrate according to an embodiment of the present invention.

2 is a cross-sectional view taken along the line A-B of FIG.

3 is a cross-sectional view taken along line A-B of a package in which a light emitting diode chip is mounted on the package substrate of FIG. 1.

4 is a view for explaining a manufacturing process of the LED package substrate according to an embodiment of the present invention.

5 is a top view of a mask according to an embodiment of the present invention.

6 is a cross-sectional view of a mask according to an embodiment of the present invention.

7 is a perspective view of a light emitting diode package substrate according to another embodiment of the present invention.

8 is a perspective view of a light emitting diode package substrate according to another embodiment of the present invention.

Claims (17)

A light emitting diode package substrate having an opening and having a polymer housing structure molded to a metal electrode, At least two metal electrodes formed to be electrically insulated from a bottom surface of the opening, And a reflective surface formed by coating a metal material on a reflective layer region except for an insulation portion of a bottom surface other than the metal electrodes and an inclined surface inside the opening extending from the insulation portion of the bottom surface. On the polymer housing including the metal electrodes, the reflective surface has a three-dimensional mask having a through hole corresponding to the reflective layer region and a protruding portion corresponding to insulating portions other than the reflective layer region on a lower surface thereof. The light emitting diode package substrate, characterized in that formed by coating the metal material through the through hole. On the housing having an opening for mounting the light emitting diode chip, A mask having a three-dimensional shape having a through hole corresponding to the reflective layer region inside the opening and having a protruding portion corresponding to a portion to be masked so as not to be coated other than the reflective layer region on a lower surface thereof, And manufacturing a reflective surface by coating a metal material through the through hole in the reflective layer region. A housing having an opening, On the housing, a three-dimensional mask having a through hole corresponding to the reflective layer region inside the opening and having a protruding portion corresponding to a portion to be masked so as not to be coated other than the reflective layer region is placed on the lower surface, and the reflective layer region It includes a reflecting surface formed by coating a metal material through the through hole, The light emitting diode package comprising a light emitting diode chip mounted in the opening. A housing having an opening for mounting the light emitting diode chip, On the housing, a three-dimensional mask having a through hole corresponding to the reflective layer region inside the opening and having a protruding portion corresponding to a portion to be masked so as not to be coated other than the reflective layer region is placed on the lower surface, and the reflective layer region And a reflecting surface formed by coating a metal material through the through hole. The package substrate of claim 4, wherein the reflective surface comprises a bottom surface inside the opening and an inclined surface from the bottom surface to an upper surface of the package substrate. The method of claim 5, The bottom surface is a light emitting diode package substrate, characterized in that the exposed surface of the electrode or heat slug formed in the housing. The method of claim 4, wherein the bottom surface inside the opening before the coating comprises two or more metal electrodes formed to be electrically insulated, The metal material may not be coated on a portion where the protruding portion of the lower surface of the mask is in close contact with the insulating portion of the bottom surface other than the metal electrodes and the inclined surface inside the opening extending from the insulating portion of the bottom surface. Package substrate for a light emitting diode, characterized in that the manufacturing to mask. The light emitting diode package substrate of claim 4, wherein a side surface of the opening is made of a polymer resin-based material. The package substrate of claim 4, wherein at least one of the adhesive layer, the intermediate layer, and the light reflection layer is sequentially coated with a metal material. The light emitting diode package substrate of claim 9, wherein the adhesive layer is coated by vacuum deposition or electroless chemical plating. The package substrate of claim 9, wherein the adhesive layer is formed of a metal including at least one of Cr, Ti, Al, Ni, W, or Cu. The package substrate of claim 9, wherein the intermediate layer is coated by vacuum deposition or electroless chemical plating. The package substrate of claim 9, wherein the intermediate layer is made of a metal including at least one of Cu, Ni, Al, and Ag. 10. The package board of claim 9, wherein the light reflection layer is coated by vacuum deposition or electroplating. The package substrate of claim 9, wherein the light reflection layer is formed of a metal including at least one of Ag, Au, Pd, and Al. The light emitting diode package substrate of claim 9, wherein at least one metal thin film is coated on the metal electrode formed on the bottom surface of the opening before coating the adhesive layer. The method of claim 16, wherein the surface treatment is performed by electroplating or electroless chemical plating so that a metal including at least one of Ag, Pd, Au, Ni, Cu, Cr, or Sn is coated. A light emitting diode package substrate.
KR1020090075307A 2009-08-14 2009-08-14 Light emitting diode package substrate having side reflective surface coated with metals using mask and manufacturing method thereof KR100958329B1 (en)

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KR1020090075307A KR100958329B1 (en) 2009-08-14 2009-08-14 Light emitting diode package substrate having side reflective surface coated with metals using mask and manufacturing method thereof
PCT/KR2010/004644 WO2011019145A2 (en) 2009-08-14 2010-07-16 Light-emitting diode package substrate and method for manufacturing same employing a mask to form a metal coating on a reflective side surface of the light-emitting diode package substrate

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CN105428507A (en) * 2015-11-20 2016-03-23 华天科技（昆山）电子有限公司 Chip packaging structure and method
KR102658589B1 (en) 2023-08-14 2024-04-18 주식회사 동부엘이디 High efficiency uv led package

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KR100643333B1 (en) 2005-05-20 2006-11-10 럭스피아 주식회사 Light emitting diode package having a reflector cup by metal thin film and its manufacturing method
JP2007013067A (en) 2005-07-04 2007-01-18 Element Denshi:Kk Method of manufacturing mounting substrate with reflector
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CN105428507A (en) * 2015-11-20 2016-03-23 华天科技（昆山）电子有限公司 Chip packaging structure and method
KR102658589B1 (en) 2023-08-14 2024-04-18 주식회사 동부엘이디 High efficiency uv led package

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WO2011019145A3 (en) 2011-04-07

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