JP6172539B2 - LED module with waterproof function - Google Patents
LED module with waterproof function Download PDFInfo
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- JP6172539B2 JP6172539B2 JP2015122524A JP2015122524A JP6172539B2 JP 6172539 B2 JP6172539 B2 JP 6172539B2 JP 2015122524 A JP2015122524 A JP 2015122524A JP 2015122524 A JP2015122524 A JP 2015122524A JP 6172539 B2 JP6172539 B2 JP 6172539B2
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- led module
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- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000004078 waterproofing Methods 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
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- IUYHQGMDSZOPDZ-UHFFFAOYSA-N 2,3,4-trichlorobiphenyl Chemical compound ClC1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 IUYHQGMDSZOPDZ-UHFFFAOYSA-N 0.000 description 1
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- 229920003002 synthetic resin Polymers 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V27/00—Cable-stowing arrangements structurally associated with lighting devices, e.g. reels
- F21V27/02—Cable inlets
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
- F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Description
本発明は、防水機能を有するＬＥＤモジュールに関し、より詳しくは、極めて簡単な構造で、完璧な防水が得られ、品質を大きく向上させた防水機能を有するＬＥＤモジュールに関する。 The present invention relates to an LED module having a waterproof function, and more particularly, to an LED module having a waterproof function that has a very simple structure, can be completely waterproofed, and has greatly improved quality.
一般に、照明装置に用いられる光源としては、白熱ランプ、蛍光ランプ等が用いられるが、最近、発光ダイオード（Ｌｉｇｈｔ ｅｍｉｔｔｉｎｇ ｄｉｏｄｅ：ＬＥＤ）等のＬＥＤ素子が採用されている。 In general, an incandescent lamp, a fluorescent lamp, or the like is used as a light source used in an illumination device. Recently, an LED element such as a light emitting diode (LED) has been adopted.
前記ＬＥＤ素子は、発光効率が高く、消費電力が低く、環境に優しいという多くの長所があるので、前記ＬＥＤ素子を用いる技術の分野がだんだん増えてきている。 Since the LED element has many advantages such as high luminous efficiency, low power consumption, and environmental friendliness, the field of technology using the LED element is gradually increasing.
前記ＬＥＤ素子を用いた適用分野としては、照明産業が代表的であり、照明以外にも、シグナルランプ、造園用として広く用いられている。 As an application field using the LED element, the lighting industry is representative, and it is widely used for signal lamps and landscaping besides lighting.
夜間にも職別が容易なように、看板の周縁部には多数個のＬＥＤモジュールを直列で連結し、看板をさらに目立たせたり、視線を引いたりし、その他の施設物にも適用し、夜景を飾る用途としても活用されている。 To facilitate job classification at night, a large number of LED modules are connected in series at the peripheral part of the signboard, making the sign stand out more, draw a line of sight, and apply to other facilities, It is also used for decorating night views.
前記ＬＥＤモジュールは、ケース内に多数のＬＥＤ素子が備えられた印刷回路基板を搭載し、電線に直列で接地させた構成として用いられている。 The LED module is used as a configuration in which a printed circuit board having a large number of LED elements is mounted in a case and grounded in series with an electric wire.
このように用いられるＬＥＤモジュールは、屋外に設置されることが多く、湿気及び雨水流入等のような防水技術を考慮して作製されなければならない。 The LED module used in this way is often installed outdoors and must be manufactured in consideration of waterproof technology such as moisture and rainwater inflow.
このように防水を具現するためのＬＥＤモジュール関連先行技術としては、下記の特許文献１に記載のものが開示されている。 As a prior art related to an LED module for realizing waterproofing as described above, the one described in Patent Document 1 below is disclosed.
前記先行技術は、添付の図１及び図２に示すように、収容部１１を有するケース１０と、前記ケースの収容部に置かれたＰＣＢ２１と、前記ＰＣＢの前面に実装され、光を発するチップＬＥＤ２２と、前記ＰＣＢの後面に実装された各種の電子素子２３と、からなり、前記ＬＥＤに駆動電源を供給する回路部６０を有する発光手段２０と、前記ＰＣＢが置かれた前記ケースの収容部に液状の樹脂が注入された後、固くなり形成される防水コート層３０と、で構成される。 As shown in FIGS. 1 and 2, the prior art includes a case 10 having a receiving portion 11, a PCB 21 placed in the receiving portion of the case, and a chip that emits light mounted on the front surface of the PCB. The LED 22 and various electronic elements 23 mounted on the rear surface of the PCB, the light emitting means 20 having a circuit unit 60 for supplying driving power to the LED, and the housing portion of the case in which the PCB is placed After the liquid resin is injected into the waterproof coating layer 30, the waterproof coating layer 30 is formed to be hardened.
このようなＬＥＤ発光モジュール（以下、「ＬＥＤモジュール」という。）は、防水コート層を、全般的に、ケースに置かれた発光手段の上部に所定の厚さ層を有するように注入することにより、ＬＥＤモジュールが屋外に設置される製品の特性上、湿気遮断及び雨水を完全に遮断して防水が行われる構成であるが、過度な液状の樹脂を収容部内に注ぎ、硬化させるまでの作製時間が長くかかるという問題点があった。 Such LED light emitting modules (hereinafter referred to as “LED modules”) generally have a waterproof coat layer injected by having a predetermined thickness layer on top of the light emitting means placed on the case. Due to the characteristics of the products where the LED module is installed outdoors, it is configured to be waterproofed by completely blocking moisture and rainwater, but the production time until excessive liquid resin is poured into the housing and cured There was a problem that it took a long time.
本発明は、上記問題点に鑑みなされたものであり、その目的は、極めて簡単な構造で、完璧な防水が得られ、品質を大きく向上させた防水機能を有するＬＥＤモジュールを提供することにある。 The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an LED module having a waterproof function that has a very simple structure, provides perfect waterproofing, and has greatly improved quality. .
上述した目的を達成するために、本発明による防水機能を有するＬＥＤモジュールは、ケースの内外側に設けられた電線支持具をケーブルが貫通し、前記電線支持具の上部には、前記ケーブルと連結され、ＬＥＤ素子が実装された印刷回路基板が置かれ、前記ケースの開放した周縁と一致して結合される蓋１２２を有するＬＥＤモジュールにおいて、前記蓋は、印刷回路基板のＬＥＤ素子から点灯された光を外部に発散するための光孔が穿孔された不透明部を有し、前記不透明部の内側には、前記光孔を塞ぐ透明部が、一定の厚さを有するように、前記不透明部と一緒に二重射出成形されるが、前記透明部は、不透明部の面積と一致し、前記透明部と不透明部の側面側の周縁部が同時にケースに超音波接合されることを特徴とする。 In order to achieve the above-described object, the LED module having a waterproof function according to the present invention has a cable passing through a wire support provided inside and outside the case, and an upper portion of the wire support is connected to the cable. In the LED module having the lid 122 on which the printed circuit board on which the LED element is mounted is placed and coupled with the open periphery of the case, the lid is lit from the LED element of the printed circuit board. An opaque part having a light hole for emitting light to the outside is perforated, and the opaque part has a certain thickness inside the opaque part so that the transparent part closing the light hole has a certain thickness. Although the double injection molding is performed together, the transparent portion has the same area as the opaque portion, and the transparent portion and the peripheral portion on the side of the opaque portion are simultaneously ultrasonically bonded to the case.
本発明による前記ケーブルが通過するケースの内外側に位置した電線支持具、及び内側に設けられた電線支持具の間の両側には、側壁が対応して設けられ、前記対応する側壁間には、ケーブルが通過する上部に防水用液状樹脂を満たし、外部からケースの内部への水の流入を遮断するように構成されたことを特徴とする。 Side walls are provided correspondingly on both sides between the wire support located inside and outside the case through which the cable according to the present invention passes, and the wire support provided inside, and between the corresponding side walls. The upper portion through which the cable passes is filled with a waterproof liquid resin, and is configured to block the inflow of water from the outside to the inside of the case.
本発明による前記ケースの内部には、ＬＥＤモジュールを対象となる位置に締付ねじで固定するためのボスが形成されるが、ボスの上端面には、超音波接合による接合突部が形成され、前記ボスと対応して蓋の不透明部の底面には、ボスの上端部をガイドし、超音波接合が行われる接合部が突出形成され、前記ボスと通じる通孔が形成されたことを特徴とする。 In the case according to the present invention, a boss for fixing the LED module to a target position with a tightening screw is formed inside the case, and a bonding protrusion by ultrasonic bonding is formed on the upper end surface of the boss. The bottom surface of the opaque portion of the lid corresponding to the boss is formed with a protruding portion that guides the upper end of the boss and performs ultrasonic bonding, and has a through hole that communicates with the boss. And
本発明による前記透明部は、光孔と一致するとともに、光孔の上部に突出し、ＬＥＤ素子から点灯された光を外部に拡散させる凸レンズを有することを特徴とする。 The transparent part according to the present invention has a convex lens that coincides with the light hole and protrudes above the light hole and diffuses the light lit from the LED element to the outside.
本発明によれば、開放されたケース部分を塞ぎ、印刷回路基板を保護する蓋を不透明部と透明部に分けて二重射出し、蓋の周縁の側面側を超音波接合し、不透明部と透明部との間から浸透する湿気、雨水を遮断し、ケース側の電線支持具側には、側壁を有し、外部から電線支持具から流入する湿気、雨水の流入を完璧に遮断することにより、主要部分となるＬＥＤ素子が実装された印刷回路基板を漏水から保護し、ＬＥＤモジュールの使用寿命を大幅に延長することができる。 According to the present invention, the opened case portion is closed, the lid for protecting the printed circuit board is divided into an opaque portion and a transparent portion, and double injection is performed. By blocking moisture and rainwater penetrating from between the transparent parts, and by having a side wall on the side of the wire support on the case side, completely blocking the inflow of moisture and rainwater flowing in from the wire support from the outside The printed circuit board on which the LED element as the main part is mounted can be protected from water leakage, and the service life of the LED module can be greatly extended.
以下、添付した図面に基づき、本発明の好適な実施例について詳述する。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
これに先立って、本明細書及び請求の範囲に用いられた用語や単語は、通常、辞典的な意味に限定して解釈されてはならず、発明者は、自身の発明を最も最善の方法で説明するために、用語の概念を適宜定義することができるという原則に基づき、本発明の技術的思想に従う意味と概念として解釈されなければならない。 Prior to this, the terms and words used in the specification and claims should not normally be construed in a lexical sense, and the inventor shall make his invention the best way. In order to explain in the above, based on the principle that the concept of terms can be defined as appropriate, it should be interpreted as meaning and concept in accordance with the technical idea of the present invention.
したがって、本明細書に記載された実施例と図面に示された構成は、本発明の最も好適な一実施例に過ぎず、本発明の技術的思想を全て代弁するものではないので、本出願時点において、これらに代替可能な様々な均等物と変形例があり得ることを理解しなければならない。 Therefore, the embodiments described in the present specification and the configurations shown in the drawings are only the most preferred embodiments of the present invention, and do not represent all the technical ideas of the present invention. It should be understood that at the time, there can be various equivalents and variations that can be substituted.
本発明は、ケース１０１の内外側に設けられた電線支持具１０２をケーブルＣが貫通し、前記電線支持具１０２の上部には、ＬＥＤ素子Ｌが設けられた印刷回路基板１１０が置かれ、固定ねじ１１１で、印刷回路基板１１０とケーブルＣを直列で接続させる形態で設けられる多数個のＬＥＤモジュール１００において、前記ケース１０１の開放した周縁と一致して組み合わせられる蓋１２２が設けられるが、前記蓋１２０は、印刷回路基板１１０上のＬＥＤモジュールＬから点灯された光を外部に発散するための光孔１２１が設けられた不透明部１２２を有し、前記光孔１２１が設けられた不透明部１２２の内側には、前記光孔１２１を塞ぐ透明部１２４が、不透明部１２２の内側面に厚さ層を有するように、不透明部と一緒に二重射出成形され、前記不透明部と透明部の側面側の周縁部は、超音波接合機で接合処理される。 In the present invention, the cable C penetrates the electric wire support 102 provided on the inner and outer sides of the case 101, and the printed circuit board 110 provided with the LED element L is placed on the upper portion of the electric wire support 102 and fixed. In a large number of LED modules 100 provided in a form in which the printed circuit board 110 and the cable C are connected in series with the screw 111, a lid 122 that is combined with the open periphery of the case 101 is provided. 120 includes an opaque portion 122 provided with a light hole 121 for diverging light emitted from the LED module L on the printed circuit board 110 to the outside, and the opaque portion 122 provided with the light hole 121 is provided. On the inside, double injection molding is performed together with the opaque portion so that the transparent portion 124 that blocks the light hole 121 has a thickness layer on the inner surface of the opaque portion 122. Is, the peripheral edge portion of the side surface side of the opaque portion and the transparent portion is bonded by an ultrasonic bonding machine.
前記蓋１２０を構成するにおいて、二重射出成形に続き、不透明部１２２と透明部１２４の周縁側の超音波融着による接合は、前記光孔から流入される湿気及び雨水を完全に遮断可能なものであり、これは、特に蓋の周部となる周縁側を加圧する形態で、超音波接合させることにより、周縁の耐久性を高めることができる。 In the structure of the lid 120, following double injection molding, the joining of the opaque portion 122 and the transparent portion 124 by ultrasonic fusion can completely block moisture and rainwater flowing from the light hole. This is a form that pressurizes the peripheral side that is the peripheral part of the lid in particular, and the durability of the peripheral edge can be enhanced by ultrasonic bonding.
前記蓋１２０と一致して超音波接合されるケース１０１は、蓋１２０と仮組立されるための段部が形成され、前記蓋の周縁側面の内側は、前記段部の形状に合わせて組み合わされるようにする。 A case 101 that is ultrasonically bonded to the lid 120 is formed with a step portion for temporary assembly with the lid 120, and the inner side of the peripheral side surface of the lid is combined according to the shape of the step portion. Like that.
また、前記ケース１０１の開口した上部に、前記印刷回路基板１１０がガイドされて安着される支え台が内側のコーナーにそれぞれ形成され、印刷回路基板を支えている。 In addition, support bases on which the printed circuit board 110 is guided and seated are formed at the inner corners of the case 101 to support the printed circuit board.
前記ケーブルＣが通過するケース１０１の内外側に位置した電線支持具１０２及び内側に設けられた電線支持具１０２の間の両側には、側壁１０３が対応して設けられ、前記対応する側壁１０３間には、ケーブルＣが通過する上部に防水用液状樹脂Ｓを満たし、外部からケース１０１の内部への水の流入を遮断するように構成される。 Side walls 103 are provided correspondingly on both sides between the wire support 102 located inside and outside the case 101 through which the cable C passes and the wire support 102 provided inside, and between the corresponding side walls 103. Is configured such that the upper part through which the cable C passes is filled with a waterproof liquid resin S and blocks the inflow of water from the outside to the inside of the case 101.
前記ケース１０１の内部には、ＬＥＤモジュール１００を対象となる位置に締付ねじで固定するためのボス１０４が形成されるが、ボス１０４の上端面には、超音波接合による接合突部１０４ａが形成され、前記ボス１０４と対応して、蓋１２０の不透明部１２２の底面には、ボス１０４の上端部をガイドし、超音波接合が行われる接合部１２２ａが突出形成され、前記ボス１０４と通じる通孔１２２ｂが形成される。 A boss 104 for fixing the LED module 100 to a target position with a fastening screw is formed inside the case 101. A joining protrusion 104a by ultrasonic joining is formed on the upper end surface of the boss 104. Corresponding to the boss 104, a joint portion 122 a that guides the upper end portion of the boss 104 and performs ultrasonic joining is formed on the bottom surface of the opaque portion 122 of the lid 120 so as to communicate with the boss 104. A through hole 122b is formed.
前記ケース側のボスの形成により、本発明による印刷回路基板にもボスを貫通する案内孔が形成される。 By forming the boss on the case side, a guide hole penetrating the boss is also formed in the printed circuit board according to the present invention.
一方、前記透明部１２４は、光孔１２１と一致するとともに、光孔の上部に突出され、ＬＥＤ素子Ｌから点灯された光を外部に拡散させる凸レンズ１２３が一体で形成される。 On the other hand, the transparent portion 124 coincides with the light hole 121 and protrudes above the light hole, and is integrally formed with a convex lens 123 that diffuses the light emitted from the LED element L to the outside.
以下、このように構成された本発明の防水機能を有するＬＥＤモジュールの組立て及び使用上の作用について説明する。 Hereinafter, the assembly and use of the LED module having the waterproof function of the present invention configured as described above will be described.
ケース１０１側の電線支持具１０２にケーブルＣを通過させた状態で、前記電線支持具１０２側に形成された側壁１０３には、添付の図７及び図８に示すように、防水用液状樹脂Ｓを満たして硬化させる。 In the state where the cable C is passed through the wire support 102 on the case 101 side, the side wall 103 formed on the wire support 102 side is provided with a waterproof liquid resin S as shown in FIGS. To cure.
これは、ケーブルＣの貫通する電線支持具１０２の微細な透き間から流入される湿気、雨水の流入を遮断するためである。 This is to block the inflow of moisture and rainwater flowing in through the minute gap of the wire support 102 through which the cable C passes.
このように防水用液状樹脂Ｓの作業が完了し、硬化した状態で印刷回路基板１１０をケース１０１内に安着させる。 In this way, the work of the waterproof liquid resin S is completed, and the printed circuit board 110 is seated in the case 101 in a cured state.
前記印刷回路基板１１０は、案内孔の形成で、前記ボス１０４に挟まれ、図面を基準として、底面部は、ケース１０１の内側の支え台に支えられた状態で、固定ねじ１１１を印刷回路基板１１０側を貫通し、電線支持具１０２に締め付ける。 The printed circuit board 110 is formed between guide bosses 104 and is sandwiched between the bosses 104. With reference to the drawing, the bottom surface portion is supported by a support on the inside of the case 101, and the fixing screw 111 is inserted. 110 passes through and is fastened to the wire support 102.
前記固定ねじは、一つのケーブルに対して印刷回路基板１１０の接点部をケーブルＣ側の被覆部分を通して進入し、芯線に接続され、電気を導通させながら、印刷回路基板１１０を固定する役割をする。 The fixing screw enters the contact portion of the printed circuit board 110 through a covering portion on the cable C side with respect to one cable, is connected to the core wire, and serves to fix the printed circuit board 110 while conducting electricity. .
このように印刷回路基板１１０の固定作業まで行われた本発明のＬＥＤモジュール１００は、前記ケースの上部に蓋１２０を一致させ、周縁を相互組み合わせた状態で超音波接合することにより、完全な密封状態を維持させる。 The LED module 100 of the present invention, which has been performed until the printed circuit board 110 is fixed as described above, is completely sealed by aligning the lid 120 with the upper part of the case and ultrasonically bonding the peripheral edges together. Maintain state.
前記蓋１２０は、不透明部１２２を先に成形作製した状態で、これを金型に収容させ、二重射出を実施したものであって、二重射出での透明部１２４は、印刷回路基板１１０上のＬＥＤ素子Ｌの点灯光を外部に散乱させるための部分であり、不透明部１２２と透明部１２４側の周縁は、再度超音波接合を実施した。 The lid 120 is obtained by forming the opaque portion 122 in advance and accommodating the opaque portion 122 in a mold and performing double injection. The transparent portion 124 in the double injection includes the printed circuit board 110. It is a part for scattering the lighting light of the upper LED element L to the outside, and the periphery on the opaque part 122 and the transparent part 124 side was subjected to ultrasonic bonding again.
前記超音波接合は、合成樹脂で成形された不透明部１２２、透明部１２４の境界部分をさらに堅固に接合したものであり、耐久性を高め、前記ケース１０１との超音波接合で、外部からの完全な防水を具現させることができる。 In the ultrasonic bonding, a boundary portion between the opaque portion 122 and the transparent portion 124 formed of a synthetic resin is further firmly bonded, and the durability is enhanced, and the ultrasonic bonding with the case 101 is performed from the outside. Full waterproofing can be realized.
一方、前記ケース１０１と蓋１２０の接合時、ボスの上端部は、蓋１２０の不透明部１２２に形成された接合部１２２ａにガイドされ、瞬間的な超音波融着により、ボス１０４の上端に形成された接合突部１０４ａが、溶融されるとともに、堅固な接合が行われる。 On the other hand, when the case 101 and the lid 120 are joined, the upper end portion of the boss is guided by the joining portion 122a formed on the opaque portion 122 of the lid 120, and formed at the upper end of the boss 104 by instantaneous ultrasonic fusion. The welded protrusion 104a is melted and firmly joined.
このように作業したＬＥＤモジュール１００は、蓋１２０の不透明部１２２に形成された光孔１２１に、透明部１２４の凸レンズ１２３部位がガイドされたものであり、ＬＥＤ素子Ｌから光を外部に拡散させるが、光孔１２１と凸レンズ１２３部位の境界地点から微細に雨水が流入されても、蓋１２０の周縁は、超音波で接合されているので、ケース１０１の内部に雨水が流入することを完全に遮断することができる。 The LED module 100 thus operated is such that the convex lens 123 portion of the transparent portion 124 is guided to the light hole 121 formed in the opaque portion 122 of the lid 120, and diffuses light from the LED element L to the outside. However, even if rainwater is finely introduced from the boundary point between the light hole 121 and the convex lens 123, the peripheral edge of the lid 120 is joined by ultrasonic waves, so that the rainwater completely flows into the case 101. Can be blocked.
添付の図１１は、本発明による一例のＬＥＤモジュールを示すものであって、上述したように蓋の構成及びケースの構成は、全て同一であり、一字型のＬＥＤモジュールを適用してもよい。 The attached FIG. 11 shows an example of the LED module according to the present invention, and as described above, the lid configuration and the case configuration are all the same, and a one-letter type LED module may be applied. .
このように防水効果を高めたＬＥＤモジュール１００を看板または各種の造園部分等に適用させて用いることにより、屋外でも完璧な防水機能を発現し、これにより、ＬＥＤモジュールの使用寿命を大幅に延長させることができる。 By using the LED module 100 with an improved waterproofing effect applied to a signboard or various landscaping parts, a perfect waterproof function is exhibited even outdoors, thereby greatly extending the service life of the LED module. be able to.
以上、本発明では、具体的な構成要素のような特定の事項と、限定された実施例及び図面により説明されたが、これは、本発明のより全般的な理解を助けるためのものであるだけで、本発明は、上記した実施例に限定されるものではなく、本発明の属する分野における通常の知識を有する者であれば、このような記載から様々な修正及び変形が可能である。 The present invention has been described with reference to specific items such as specific components, and limited embodiments and drawings, but this is intended to assist in a more general understanding of the present invention. However, the present invention is not limited to the above-described embodiments, and various modifications and variations can be made from such description by those having ordinary knowledge in the field to which the present invention belongs.
したがって、本発明の思想は、説明された実施例に限って定められてはならず、後述する特許請求の範囲のみならず、この特許請求の範囲と均等であり、または等価的変形のある全てのものは、本発明による思想の範疇に属するものとみなされる。 Therefore, the idea of the present invention should not be limited to the described embodiments, and is not limited to the scope of claims described below, but is equivalent to the scope of claims. Are regarded as belonging to the category of the idea according to the invention.
１００ ＬＥＤモジュール
１０１ ケース
１０２ 電線支持具
１０３ 側壁
１０４ ボス
１０４ａ 接合突部
１１０ 印刷回路基板
１１１ 固定ねじ
１２０ 蓋
１２１ 光孔
１２２ 不透明部
１２２ａ 接合部
１２２ｂ 通孔
１２３ 凸レンズ
１２４ 透明部
Ｃ ケーブル
Ｌ ＬＥＤ素子
Ｓ 防水用液状樹脂
DESCRIPTION OF SYMBOLS 100 LED module 101 Case 102 Electric wire support 103 Side wall 104 Boss 104a Joint protrusion 110 Printed circuit board 111 Fixing screw 120 Lid 121 Optical hole 122 Opaque part 122a Joint part 122b Through-hole 123 Convex lens 124 Transparent part C Cable L LED element S Waterproof Liquid resin
Claims (4)
前記蓋１２０は、印刷回路基板１１０のＬＥＤ素子Ｌから点灯された光を外部に発散するための光孔１２１が穿孔された不透明部１２２を有し、前記不透明部１２２の内側には、前記光孔１２１を塞ぐ透明部１２４が、一定の厚さを有するように、前記不透明部と一緒に二重射出成形されるが、
前記透明部１２４は、不透明部１２２の面積と一致し、前記透明部１２４と不透明部１２２の側面側の周縁部が同時にケース１０１に超音波接合されることを特徴とする防水機能を有するＬＥＤモジュール。 Inner side of the case 101 and the wire support 102 provided on the outer cable C passes through, the upper part of the wire support 102, the coupled cable C, printed circuit board 110 on which the LED elements L are mounted In the LED module 100 having a lid 122 that is placed and joined in alignment with the open periphery of the case 101,
The lid 120 includes an opaque portion 122 having a light hole 121 for diverging light emitted from the LED element L of the printed circuit board 110 to the outside. The transparent portion 124 that closes the hole 121 is double injection molded together with the opaque portion so as to have a certain thickness,
The transparent part 124 has the same area as the opaque part 122, and the transparent part 124 and the peripheral part on the side of the opaque part 122 are simultaneously ultrasonically bonded to the case 101. .
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