1353807 ___ 第94133473號專利申請案 100年8月25日修正替換頁 九、發明說明： 【發明所屬之技術領域】 本發明係關於附有反射器之安裝基板的製造方法，尤 其是關於一種以組裝有發光元件之玻璃環氧基板所構成之 附有反射器之安裝基板的製造方法。 【先前技術】 第7圖係顯示有效率地將從發光元件往侧面放出的光 馨線加以反射之發光效率較高的發光裝置。 此發光裝置係由：發光元件1〇〇、基板2〇〇、反射器 300及密封構件400所構成。發光元件1〇〇為3族氮化物 .系化合物半導體發光元件。安裝基板200為絕緣性基板， 係形成有所希望的配線圖案並安裝有發光元件1〇〇。反射 器300為將氧化鈦加以一致地分散後之聚醯胺（p〇lyamide) 系樹脂所組成’並以使形成杯狀部5〇〇之内周面相對於光 軸呈所希望角度之方式來成型，並以A1的蒸鑛來製作反射 %層310。矽酮樹脂等密封構件400係以包覆發光元件1 〇〇 的方式而充填於杯狀部500(參照專利文獻i、第i圖）。 此外’關於其他光半導體裝置，具備反射器的功能之 外殼，係藉由在聚碳酸酯中包含氧化鈦之光反射率較高的 白色系樹脂之成型來加以形成（參照專利文獻2、第3圖）。 尤其是，為了降低成本，大多藉由樹脂成型來製作反 射器’但是在該情況下’會產生下述之種種問題點。 [專利文獻1]日本特開2004-134699號公報 [專利文獻2]日本特開2〇〇〇_1834〇7號公報 317459修正本 5 1353807 第94133473號專利申請案 _ 100年8月25曰修正替換頁 【發明内容】 (發明所欲解決之課題） ' 然而，在上述發光裝置中係具有下列問題點。 由於反射器大多採用光反射率較高的白色系之樹脂， 因此必須具備用來進行樹脂成型之模具，因而產生在試作 上極為花費時間之問題點。 此外，樹脂成型大多採用熱可塑性樹脂的射出成型， 嫌因而導致在將高溫的樹脂加以成型而從模具取出為止，會 產生翹曲等變形之問題點。因此在將反射器黏接於安裝基 板時，會由於該翹曲的、緣故，而無法同時將多數個反射器 . 黏接於安裝基板。 此外，由於在對反射器進行接t脂成型時使用模具，因 此，與鄰接的反射器之間必須具備某種程度的間隔，因此 無法提高反射器的形成密度，而無法提高設置量。 ^，由於反射器為樹脂製，因此在將發光裝置焊接 驚於主基板時的回焊溫度高達巧代，因而具有使反射器本 :產生變形而導致不良品產生之問題。尤其是在採用無鉛 2錫時，此回焊溫度極高，該不良品的發生率因而變得更 南。 (解決課題之手段） ”本發明係鑑於上述問題點而研創者，為一種附有反射 ^之安裝基㈣製造方法，其特徵為具備：形成安裝基板之 '程幵/成安裝基板之製程’係於兩面貼附有導電落的第 1印刷基板材料之上側的上述導電㈣成用以載置複數個 317459修正本 6 1353807 第94133473號專利申請案 ，一 | 100年8月25曰修正替換頁 二光70件用的共通電極與用以個別連接至上述多數個發光 元件之另電極的多數個個別電極，於上述第1印刷基板 •材料之下側的上述導電落形成通過通孔電極而分別與對應 的上述共通電極或上述個別電極連接的多數個取出電極； 形成反射器基板之製程，係準備於❺面貼附有導電落的第 2印刷基板材料，藉由機械加工而於上述第2印刷基板材 料形成在内壁具有傾斜面之行列狀排列的多數個貫穿孔， 並於王邛的上述貝穿孔的傾斜面進行通孔電鍍後形成反射 電鍍膜’及藉由黏接層而將上述安裝基板及上述反射器基 板加以黏接之製程。 - 此外，於本發明中，上述第2印刷基板材料及上述第 1印刷基板材料係由BT樹脂（Bismaleimide Triazine1353807 ___ Patent Application No. 94,133,473, the disclosure of which is incorporated herein by reference in its entirety in its entirety in the the the the the the the the the the the the the the the the the A method of manufacturing a mounting substrate with a reflector formed of a glass epoxy substrate having a light-emitting element. [Prior Art] Fig. 7 is a view showing a light-emitting device which efficiently reflects light from a light-emitting element to a side surface and has high luminous efficiency. This light-emitting device is composed of a light-emitting element 1A, a substrate 2A, a reflector 300, and a sealing member 400. The light-emitting element 1A is a Group 3 nitride. A compound semiconductor light-emitting element. The mounting substrate 200 is an insulating substrate, and a desired wiring pattern is formed and the light-emitting element 1A is mounted. The reflector 300 is composed of a polyfluorene-based resin in which titanium oxide is uniformly dispersed, and is formed such that the inner peripheral surface forming the cup portion 5 is at a desired angle with respect to the optical axis. Molded, and the reflective % layer 310 was produced by steaming of A1. The sealing member 400 such as an oxime resin is filled in the cup portion 500 so as to cover the light-emitting element 1 ( (see Patent Document i and Fig. i). In addition, in the other optical semiconductor device, the outer casing having the function of the reflector is formed by molding a white resin containing a high reflectance of titanium oxide in the polycarbonate (see Patent Documents 2 and 3). Figure). In particular, in order to reduce the cost, the reflector ’ is often formed by resin molding, but in this case, the following problems occur. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2004-134699 (Patent Document 2) Japanese Patent Application Laid-Open No. Hei. No. Hei. No. Hei. [Replacement page] [Problem to be Solved by the Invention] However, the above-described light-emitting device has the following problems. Since the reflector is mostly made of a white resin having a high light reflectance, it is necessary to have a mold for performing resin molding, which causes a problem that it takes a lot of time for the test. Further, in the resin molding, injection molding of a thermoplastic resin is often used, which may cause deformation of warpage or the like when a high-temperature resin is molded and taken out from the mold. Therefore, when the reflector is adhered to the mounting substrate, a plurality of reflectors cannot be bonded to the mounting substrate at the same time due to the warpage. Further, since the mold is used for the lip-molding of the reflector, it is necessary to have a certain interval between the adjacent reflectors, so that the formation density of the reflector cannot be increased, and the amount of installation cannot be increased. Since the reflector is made of a resin, the reflow temperature at the time of soldering the illuminating device to the main substrate is as high as it is, and thus there is a problem that the reflector is deformed to cause defective products. Especially in the case of lead-free 2 tin, the reflow temperature is extremely high, and the incidence of the defective product is thus further increased. (Means for Solving the Problem) The present invention has been made in view of the above problems, and is a method for manufacturing a mounting base (four) with a reflection, characterized in that it has a process of forming a mounting substrate and a process for mounting a substrate. The above-mentioned conductive (four) on the upper side of the first printed circuit board material to which the conductive drops are attached on both sides is used for placing a plurality of 317459 amendments. Patent application No. 94,133,473, filed on August 25, 2005. a common electrode for the two-light 70-piece and a plurality of individual electrodes for individually connecting to the other electrode of the plurality of light-emitting elements, wherein the conductive holes on the lower side of the first printed circuit board and the material are formed by the via electrodes a plurality of extraction electrodes connected to the corresponding common electrode or the individual electrodes; and the process of forming the reflector substrate is prepared by attaching a second printed substrate material having a conductive drop to the surface, and machining the second substrate The printed circuit board material is formed in a plurality of through holes having an inclined surface in an inner wall, and is subjected to through-hole plating on the inclined surface of the above-mentioned bay perforation of Wang Hao. Forming a reflective plating film ′ and bonding the mounting substrate and the reflector substrate by an adhesive layer. Further, in the invention, the second printed substrate material and the first printed substrate material are BT resin (Bismaleimide Triazine
Resin雙順丁烯二醯亞胺/三畊樹脂）、玻璃環氧樹脂、共 聚物（composite)、玻璃聚醯亞胺樹脂或是紙酚類樹脂中任 一者來形成。 ^ 此外於本發明中，形成上述安裝基板的上述通孔電 極的製知與形成上述反射器基板之上述通孔電鐘的製程係 在相同製造線進行。 ” 此外，於本發明中，具有將上述反射電鍍膜形成在上 述反射器基板的全面後，選擇性地殘留於上述反射器基板 的上面及上述貫穿孔的傾斜面’且將上述反射器基板之背 面的前述導電箔去除的步驟。 此外，於本發明中，在將上述安裝基板及上述反射器 基板藉由黏接層而黏接的製程中，上述安裝基板及上述反 7 317459修正本 1353807 第94133473號專利申諳案 射时 / | 100年8月25曰修正替換頁 益土板’係夾著黏接劑層而進行加熱硬化而黏接為一體。 此外，於本發明令，上述黏接劑層係採用經半硬化的 •樹脂。 此外’於本發明中，在選擇性去除上述反射器基板下面 之上述導電箔後，再形成上述反射電鍍膜。 此外，於本發明中，上述於上述第2印刷基板材料藉 由機械加工而形成在内壁具有傾斜面之行列狀排列的多數 壽個貝穿孔的製程，係在選擇鑽孔、端銳刀、或是欽刀加工 之齒的切削面之傾斜角度後，於上述第2印刷基板材料機 械性地形成具有與前述齒的切削面之傾斜角度對應的傾斜 面的上述貫通孔。 (發明之效果） 根據本發明，係具備以下優點，亦即，準備安裝基板 及反射器基板，並以黏接劑來貼合兩基板，藉此可藉由極 為簡單之製造方法，來實現具有多數個電極之附有反射器 %之安裝基板。 此外，根據本發明，係具備可藉由通孔來連接電極與 外部電極而可實現安裝基板之優點，該電極係採用設在安 裝基板兩面之導電箔來裝載發光元件。 此外，根據本發明，係以印刷電路基板材料來構成安 裝基板及反射器基板，因此具備即使將兩基板加以貼合亦 不會產生翹曲等之優點。尤其是採用BT樹脂、玻璃環氧樹 脂、共聚物、玻璃聚醯亞胺樹脂或是紙酚類樹脂中任一者 所形成之基板材料，而與一般的印刷電路基板相同，即使 317459修正本 丄353807 ~第94133473號專利申請^ | 100年8月25日修正替換頁 在焊錫的回焊溫度為25(TC以上，亦具備充分的耐熱性， 而不會產生反射器之變形等。 • ^此外’在本發明中’設在反射器基板的所有貫穿孔， 係以鑽孔（dri11)、端銑刀（end-mill)或是鉸刀（reamer) 加工等機械加工所形成，由於未進行熱處理，因此反射器 基板與以往的樹脂製基板不同，完全不需要模具。貫穿孔 的大小可由鑽孔等的選擇而為隨意的大小，而傾斜面的大 着小亦可經由選擇反射器基板的厚度來加以對應。由於反射 益基板係僅藉由機械加工所完成，因此不會於製造中因過 熱而產生翹曲。因此，在以黏接劑來貼合安裝基板及反射 .器基板時不會產生翹曲，故可縮小與鄰接的貫穿孔之間的 間隔’而增加反射器的設置量。 此外，在本發明中’反射器基板之反射電鍍膜，係將 反射器基板整體浸潰於電鍍液槽内而同時形成，因此不需 採用遮罩而可簡單地製造。It is formed by any one of Resin bis-sandimide/three-pile resin, glass epoxy resin, composite, glass polyimide resin or paper phenol resin. Further, in the present invention, the process of forming the through-hole electrode forming the mounting substrate and the process of forming the through-hole clock of the reflector substrate are performed on the same manufacturing line. Further, in the present invention, the reflective plating film is formed on the entire surface of the reflector substrate, and is selectively left on the upper surface of the reflector substrate and the inclined surface of the through hole, and the reflector substrate is The step of removing the conductive foil on the back surface. In the present invention, in the process of bonding the mounting substrate and the reflector substrate by an adhesive layer, the mounting substrate and the reverse 7 317459 are modified. Patent application No. 94133473 / / August 25, pp. 25 曰 Amendment replacement page 益土板' is heat-hardened and bonded together with an adhesive layer. Further, in the present invention, the above-mentioned bonding The agent layer is a semi-hardened resin. Further, in the present invention, the reflective plating film is formed after selectively removing the conductive foil under the reflector substrate. Further, in the present invention, the above The second printed circuit board material is formed by mechanical processing to form a majority of the perforated perforations in which the inner wall has an inclined surface arranged in an array, and is selected for drilling and sharpening. After the inclination angle of the cutting surface of the tooth processed by the knives, the through-hole having the inclined surface corresponding to the inclination angle of the cutting surface of the tooth is mechanically formed on the second printed circuit board material. According to the present invention, there is provided an advantage that the mounting substrate and the reflector substrate are prepared, and the two substrates are bonded together by an adhesive, whereby a plurality of electrodes can be realized by an extremely simple manufacturing method. Further, according to the present invention, there is an advantage that a mounting substrate can be realized by connecting an electrode and an external electrode through a through hole, and the electrode is loaded by a conductive foil provided on both sides of the mounting substrate. Further, according to the present invention, since the mounting substrate and the reflector substrate are formed of the printed circuit board material, there is an advantage that warpage or the like does not occur even if the two substrates are bonded together, in particular, BT resin or glass is used. A substrate material formed by any one of an epoxy resin, a copolymer, a glass polyimide resin, or a paper phenol resin, and a general print The brush circuit board is the same, even if the 317459 revision 丄 353807 ~ 94133473 patent application ^ | August 25, 100 revised replacement page in the solder reflow temperature of 25 (TC or more, also has sufficient heat resistance, and will not Deformation of the reflector, etc. • In addition, in the present invention, all the through holes provided in the reflector substrate are processed by drilling (dri11), end-mill or reamer. Since the machining is performed, since the heat treatment is not performed, the reflector substrate is different from the conventional resin substrate, and the mold is not required at all. The size of the through hole can be selected as a random size by drilling or the like, and the inclined surface is large. Small can also be made by selecting the thickness of the reflector substrate. Since the reflective substrate is only machined, it does not cause warpage due to overheating during manufacturing. Therefore, when the mounting substrate and the reflector substrate are bonded together by the adhesive, warpage does not occur, so that the interval between the adjacent through holes can be reduced, and the amount of the reflector can be increased. Further, in the present invention, the reflective plating film of the reflector substrate is formed by simultaneously immersing the entire reflector substrate in the plating bath, so that it can be easily manufactured without using a mask.
此外’在本發明中’上述安裝基板及上述反射器基板， 係夾著黏接劑層而進行加熱硬化而黏接為一體，因此可做 為1個基板來處理，且防止反射器的變形。 此外’在本發明中，由於安裝基板及反射器基板係幾 乎經過同一條製造線，因此可達到製造線的共通化。因此 不需另外增設反射器基板的製造線。 【實施方式】 首先’第1圖係顯示以本發明的製造方法所完成之附 有反射器之安裝基板。第1圖（A)為其上視圖，第1圖（β) 317459修正本 9 1353807 第94133473號專利申請案 ^ | 100年8月25曰修正替換頁Further, in the present invention, the mounting substrate and the reflector substrate are heat-hardened and bonded integrally with the adhesive layer, so that the substrate can be handled as one substrate and the reflector can be prevented from being deformed. Further, in the present invention, since the mounting substrate and the reflector substrate pass through the same manufacturing line, the common line of the manufacturing line can be achieved. Therefore, it is not necessary to additionally add a manufacturing line of the reflector substrate. [Embodiment] First, Fig. 1 shows a mounting substrate with a reflector completed by the manufacturing method of the present invention. Figure 1 (A) is a top view, Figure 1 (β) 317459 Amendment 9 1353807 Patent Application No. 94133473 ^ | August 25, 1995 Correction Replacement Page
% 為其剖視圖。於安裝基板1〇之上面設置有十字形的共通電 極11 ’於四個角落設置個別電極12a、12b、12c、12d，於 下面叹置有取出電極Wa、13b，該取出電極i3a、13b係 透過各自所對應的電極及通孔電極而連接。於安裝基板1〇 的上側，係以露出共通電極11及個別電極12a、12b、12c、 12d的一部分之方式，以黏接層5〇來貼附反射器3〇,並於 反射器30之貝牙孔31的傾斜面32及上面，設置反射電鍍 層33。在共通電極u之十字形的突出部分，分別固接有4 個，光το件14a、14b、14c、14d，共通電極u係構成共 極电極各發光元件的陰極電極係藉由金屬細線15 與鄰接的個別電極12a、12b、12c、12d相連接。 ^接下來，本發明之附有反射器之安裝基板的製造方法 係由以下製賴構成··準備具有多數個電極之安裝基板之 製程，該電極乃用以裝載發光元件；準備反射器基板之製 程’該反射器基板係以包圍用以裝載上述發光元件之上述 各電極的方式，形成在内壁具有傾斜面之貫穿孔，並於上 述^孔的傾斜面形成反射電鍍膜；及藉由黏接層而將上 述文裝基板及上述反射器基板加以黏接之製程。 接著參照第2圖及第3圖 之製程。 來說明準備安裝基板10 於第2圖⑴中，係準備玻璃環氧基板，該玻璃環氧基 板係於兩面貼附有銅等導電箔16、17。導電箔Μ、”係 採产用18"的銅箱，基板1〇係採用〇15職的板厚者。導 電落16係用來形成在上側裝載有發光元件之電極，電極係 317459修正本 10 1353807 Ϊ94】33473號專利申請索 I 100年8月25曰修正替換頁 以第3圖所示之十字形的共通電極丨丨及個別電極i仏、 12b、12c、12d所構成。安裝基板10係除了玻璃環氧樹脂 •之外，亦可從 BT 樹脂(Bismaleimide Triazine Resin，雙 项丁烯一醯亞胺/二哄樹脂）、共聚物、玻璃聚酿亞胺樹脂 或是紙酚類樹脂等印刷基板材料中加以選擇。Β T樹脂係以 T成分（二卩井樹脂）為主成分，並由B成分（多官能順丁烯二 醯亞胺化合物）或是其他改質用的化合物所構成之高耐熱 Φ加成聚合型熱硬化性樹脂之總稱。共聚物係為疊層複數個 基板材料者。這些基板材料均可進行切削等機械加工。 於第2圖（B)中’為了形成通孔電極，係採用nc工作 .機，藉由鑽孔等將導電箔16、17與基板1〇加以貫穿，而 形成大約〇. 3mm的通孔用貫穿孔18。接著，將安裝基板1〇 浸潰於鈀溶液，以兩個導電箔16、17為電極，藉由電解電 鍍銅，而在通孔用貫穿孔18的内壁形成約2〇#111膜厚的通 孔電極19。 ^ 於第2圖（C)中，安裝基板1〇上面及下面的導電箔 16、17’係以光阻層20所包覆，將第3圖（A)所示之十字 形的共通電極11及個別電極12aM2b、i2c、12d的圖案 加以曝光顯影在上面的導電箔16，並將第3圖（B)所示之 取出電極13a、13b、13c、13d、13e、13f的圖案加以曝光 顯衫在下面的導電箔17，並以殘存的光阻層2〇為遮罩， 而對導電箔16、17進行蝕刻。在導電箔16、17為銅時， 係採用氯化鐵來做為蝕刻液。 於第2圖（D)中，將光阻層20予以剝離去除，在上面 317459修正本 I353807 第94133473號專利申請案 100年8月25曰修正替換頁 的十字形的共通電極11及個別電極12a、i2b、12c、12d 以及下面的取出電極13a、13b、13c、13d、13e、13f的表 •-面，設置鍍銀層21 ’而進行各電極的表面處理。藉由此鍍 銀層21，可進行發光元件的固接、金屬細線的接合或是焊 接。 第3圖係顯示更具體的安裝基板。第3圖（“係顯示安 裝基板10整體之上視圖，第3圖（B)係顯示以安裝基板 %上面的導電箔16所形成之共通電極11及個別電極12a ' 12b、12c、12d的放大俯視圖，第3圖（c)係顯示以安裝基 板ίο下面的導電落17所形成之取出電極13a、i3b、i3c、 、 13d、l3e、13f的放大俯視圖。 安裝基板10係採用60随x90mm的玻璃環氧基板。於周 ，設置複數個對位孔22,於内部在行列上配置有多數個各 單元之共通電極11及個別電極12a、12b、12c、12d。此 外’於，邊殘存有框狀導電落23,以做為電解電鐘用之電 %極，各單兀之共通電極u及個別電極i2a、1化、Uc、12d 皆與框狀導電箔23電性連接。 ^各單70之共通電極11及個別電極12a、12b、12c、12d 係如第3圖⑻所示，十字形的共通電極u係在橫向接連 配置，並於十字的突出部之間喪入個別電極i2a'⑽、 1 一2c 12d在十字的突出部之中間位置，以圓形標記所表 不之通孔電極19，係設置在各單元之共通電極“及個別 電極12a、12b、12c、12d，而進行與下面的取出電極13&、 13c 13d 13e、13f之連接。上侧的個別電極l2a 317459修正本 12 第94133473號專利申請i ::接:條24而與該上方之單元下侧的^^ =接，蛇形狀的連接細條25而與相同單 二藉由此連接細條24、25及通咖 12d I各早70之共通電極11及個別電極12a、12b、12c、 、取出電極13a、13b、13c、咖、⑶、Η卜此外， 雖…、'將於之後說明，但是在分離為各單元時，於切割各單 兀的邊界時乃將連接細條24、25切斷，而使各單元的各電 極呈電性獨立。 各單元的取出電極13a、13b、13c、13d、i3e i3f 係如第3圖(C)所示，乃並聯配置大約3個，並藉由圓形標 輯不之通孔電極19 ’使上面的共通電極u及個別電極 12b 12c、12d電性連接。上側的取出電極丨3f係形 成為較其他取出電極還長，乃做為接腳（pin)配置的標記。 該取出電極13a、l3b、13c、13d、13e、13f係以通孔電極 19之間的6個構成i個單元，於通孔電極i9的兩侧形成 為一體之取出電極13a、Ub、13c、13d、13e、13f係屬於 鄰接的單元這疋因為切割線恰巧位於此通孔電極19上之 故。此外，位於各單元的中央之斜線部分為光阻層26，係 用以防止在女裝於主基板表面時，焊錫侵入而導致取出電 極 13a、13b、13c、l3d、13e、13f 之間的短路。 接著參照第4圖及第5圖來說明準備反射器基板34 之製程。 於第4圖（A)中’係準備玻璃環氧基板，該玻璃環氧基 板係於兩面貼附有銅等導電箔35、36。導電箔35、36係 13 317459修正本 1353807 _ , 第94133473號專利申請案 100年8月25日修正替換頁 採用18 μ m的銅箔’基板係採用〇. 6mm的板厚者。並採用 .NC工作機’藉由鑽孔等將導電箔35、36與基板34加以貫 穿，而將用來形成反射器30之貫穿孔31加以穿孔。首先， 貫穿孔31係配合反射器30下面的直徑而穿孔，將與内壁 垂直的貫穿孔31予以穿孔例如2· 2mm。反射器基板34係 與安裝基板10相同地，除了玻璃環氧樹脂之外，可從BT 樹脂、共聚物、玻璃聚醯亞胺樹脂或是紙酚類樹脂等印刷 電路基板材料中加以選擇。 於第4圖（B)中，為了在貫穿孔31形成反射器30的反 射面’係採用NC工作機’错由鑽孔、端銳刀（end m丨11) 或是鉸刀（reamer)加工等來形成傾斜面32。貫穿孔31之 上面的直徑，例如選擇為2. 8mm，貫穿孔31的内壁係形成 有研缽狀的傾斜面32。此外，可藉由選擇基板的板厚，而 谷易地選擇反射器30的反射面之面積。此外，可藉由選擇 鉸刀齒的切削角度，而容易地選擇傾斜面32的角度。 % 於第4圖（c)中’將反射器基板34浸潰於鈀溶液，以 兩個導電箔35、36為電極，藉由電解電鍍銅，而在貫穿孔 31的内壁之傾斜面32形成約20膜厚的導電電錢膜37。 於第4圖（D)中’將填充材38加以印刷而埋入於貫穿 孔31而包覆反射器基板34的上面。填充材38係可採用 石膏溶液。石膏溶液係在印刷之後加以燒結而乾燥，並以 拋光研磨（polishing)來去除附著於反射器基板34下面之 導電泊36之石膏。因此，在本製程中，係僅露出反射器基 板34下面之導電箔36,而上面的導電箔36及導電電鍍膜 317459修正本 14 1353807 第94133473號專利申請案 | 100年8月25曰修正替換頁 37係以填充材38所包覆。 於第4圖（E)中，以填充材38為遮罩，而選擇性將反 •射器基板34下面之導電箔36加以蝕刻去除。蝕刻液係採 用氣化鐵。蝕刻後的填充材3 8之石膏，係藉由苛性鈉溶液 來加以剝離去除。 於第4圖（F)中，在反射器基板34上面的導電羯35 及貫穿孔31的導電電鍍膜37上，在無遮罩的狀態下，藉 φ 由電解電錄進行鑛銀或鍵鉻，而形成反射電鍍膜犯。尤其 是在鍍鉻的情況下，乃具備表面不易損傷且不易氧化，並 且不易腐蝕之特徵，因此可於長時間下實現良好的反射。 於本製程中，係採用配合傾斜面3 2之鑽孔，來對前端 進行寸動加工’藉此，亦可採用僅藉由鑽孔加工而一次形 成至傾斜面3 2為止之方法。藉此，可同時以1項製程，來 形成上述貫穿孔31及傾斜面32。 第5圖係顯示更具體的反射器基板34。第5圖（A)係 %顯示反射器基板34整體之上視圖，第5圖（B)係顯示反射 器基板34的放大俯視圖。 於反射器基板34,係在對應於上述安裝基板1〇的各 單元之位置，設置所對應的數量之反射器3〇。因此，各單 π的反射器30亦在行列上配置。反射器基板34的大小為 54.5mmx76.0nm，於周邊設置突出部40，並於該處設置對 位孔41，而藉由導引接腳等來進行與安裝基板1〇的對位 孔22之間的對位》於反射器基板34，係在行列上排列有 用來構成反射器30之貫穿孔31，於貫穿孔31之内壁的傾 317459修正本 15 1353807 第94133473號專利申請案 叩〇年8月25日修正替換頁 斜面32設置有反射電鍍層33。% is its section view. The common electrodes 12a, 12b, 12c, and 12d are provided at four corners on the upper surface of the mounting substrate 1A, and the extraction electrodes Wa, 13b are slanted below, and the extraction electrodes i3a and 13b are transmitted through The respective electrodes and the via electrodes are connected to each other. On the upper side of the mounting substrate 1A, the reflector 3〇 is attached to the adhesive layer 5〇 so as to expose a part of the common electrode 11 and the individual electrodes 12a, 12b, 12c, and 12d, and is attached to the reflector 30. A reflective plating layer 33 is provided on the inclined surface 32 and the upper surface of the dental cavity 31. In the cross-shaped protruding portion of the common electrode u, four light-shielding members 14a, 14b, 14c, and 14d are fixed, and the common electrode u is a common electrode. The cathode electrode of each of the light-emitting elements is formed by a thin metal wire 15 It is connected to the adjacent individual electrodes 12a, 12b, 12c, 12d. Next, the manufacturing method of the reflector-attached mounting substrate of the present invention is constituted by the following process: preparing a mounting substrate having a plurality of electrodes for loading the light-emitting elements; preparing the reflector substrate The reflector substrate forms a through hole having an inclined surface on the inner wall so as to surround the electrodes for mounting the light-emitting element, and forms a reflective plating film on the inclined surface of the hole; and by bonding And a process of bonding the above-mentioned text substrate and the reflector substrate. Next, the processes of Figs. 2 and 3 will be referred to. In the second drawing (1), a glass epoxy substrate having conductive foils 16 and 17 such as copper attached to both surfaces thereof is prepared. Conductive foil crucible, "18" for the production of copper boxes, the substrate 1 is used for the thickness of the 15th grade. Conductive drop 16 is used to form the electrode with the light-emitting element on the upper side, the electrode system 317459 revision 10 1353807 Ϊ94] Patent No. 33,473 Patent Application No. I. August 25, pp. Amendment Replacement Page consists of a cross-shaped common electrode 丨丨 and individual electrodes i 仏, 12b, 12c, 12d shown in Fig. 3. Mounting substrate 10 In addition to glass epoxy resin, it can also be printed from BT resin (Bismaleimide Triazine Resin, double-stranded imine/diamine resin), copolymer, glass-polyimide resin or paper phenolic resin. The substrate material is selected. The ΒT resin is mainly composed of a T component (two bismuth resin) and is composed of a B component (polyfunctional maleimide compound) or other compound for modification. A general term for a high heat-resistant Φ addition polymerization type thermosetting resin. The copolymer is a laminate of a plurality of substrate materials. These substrate materials can be machined by cutting or the like. In Fig. 2(B), in order to form a through hole Electrode, working with nc. The conductive foils 16 and 17 and the substrate 1 are penetrated by drilling or the like to form a through hole 18 for a via of about 3 mm. Next, the mounting substrate 1 is immersed in a palladium solution to be electrically conductive. The foils 16 and 17 are electrodes, and by electroplating copper, a via electrode 19 having a thickness of about 2 Å #111 is formed on the inner wall of the through hole 18 for through holes. ^ In Fig. 2(C), the substrate 1 is mounted. The conductive foils 16 and 17' on the upper and lower sides of the crucible are covered with the photoresist layer 20, and the patterns of the cross-shaped common electrode 11 and the individual electrodes 12aM2b, i2c, and 12d shown in FIG. 3(A) are exposed and developed. On the upper conductive foil 16, the pattern of the extraction electrodes 13a, 13b, 13c, 13d, 13e, 13f shown in Fig. 3(B) is exposed to the underlying conductive foil 17, and the remaining photoresist is used. The layer 2 is a mask, and the conductive foils 16 and 17 are etched. When the conductive foils 16 and 17 are copper, ferric chloride is used as an etching liquid. In Fig. 2 (D), the photoresist is used. The layer 20 is stripped and removed, and the above-mentioned 317459 is amended by the I353807 patent application No. 94133473, aug. 25, pp. The surface of each of the electrodes 11 and the individual electrodes 12a, i2b, 12c, and 12d and the lower and lower extraction electrodes 13a, 13b, 13c, 13d, 13e, and 13f are provided with a silver plating layer 21' to perform surface treatment of each electrode. The silver plating layer 21 can be used for fixing the light-emitting element, bonding or soldering the thin metal wires. Fig. 3 shows a more specific mounting substrate. Fig. 3 (" shows the upper surface of the mounting substrate 10, the third view Figure (B) shows an enlarged plan view of the common electrode 11 and the individual electrodes 12a' 12b, 12c, 12d formed by the conductive foil 16 on the mounting substrate %, and Figure 3 (c) shows the conductive under the mounting substrate ίο An enlarged plan view of the extraction electrodes 13a, i3b, i3c, 13d, l3e, 13f formed by the drop 17. The mounting substrate 10 is a glass epoxy substrate with 60 x 90 mm. In the circumference, a plurality of registration holes 22 are provided, and a common electrode 11 and individual electrodes 12a, 12b, 12c, and 12d of a plurality of cells are arranged in the row. In addition, there is a frame-shaped conductive drop 23 remaining as an electric pole for the electrolysis clock, and the common electrode u and the individual electrodes i2a, 1 , Uc, 12d of each unit are combined with the frame-shaped conductive foil 23 Electrical connection. ^ The common electrode 11 and the individual electrodes 12a, 12b, 12c, and 12d of the respective sheets 70 are as shown in Fig. 3 (8), and the common electrodes u of the cross shape are arranged in the lateral direction, and are individually dropped between the protruding portions of the cross. The electrodes i2a'(10), 1 - 2c 12d are in the middle of the protruding portion of the cross, and the through-hole electrodes 19 are indicated by circular marks, and are provided in the common electrodes of the respective units "and the individual electrodes 12a, 12b, 12c, 12d The connection to the lower extraction electrodes 13 & 13c 13d 13e, 13f is performed. The upper individual electrode 12a 317459 is modified by the patent application No. 94133473, the following: ^^ = connected, the serpentine shape connecting strips 25 and the same single two by means of the strips 24, 25 and the common electrode 11 of each of the early 70s and the individual electrodes 12a, 12b, 12c, the extraction electrode 13a, 13b, 13c, coffee, (3), and Η 此外 虽 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The electrodes of the unit are electrically independent. The extraction electrodes 13a, 13b, 13c, 13 of each unit d, i3e i3f is as shown in Fig. 3(C), and is arranged in parallel in about three, and the common electrode u and the individual electrodes 12b 12c, 12d are electrically connected by the circular electrode 19' The upper extraction electrode 丨3f is formed to be longer than the other extraction electrodes, and is used as a pin arrangement. The extraction electrodes 13a, 13b, 13c, 13d, 13e, and 13f are through-hole electrodes. The six units between 19 constitute i units, and the extraction electrodes 13a, Ub, 13c, 13d, 13e, and 13f which are integrally formed on both sides of the through-hole electrode i9 belong to the adjacent unit, because the cutting line happens to be located in this unit. In addition, the oblique line portion located at the center of each unit is a photoresist layer 26 for preventing the intrusion of solder when the surface of the main substrate is worn on the main substrate, thereby causing the extraction electrodes 13a, 13b, 13c, 13d, A short circuit between 13e and 13f. Next, a process of preparing the reflector substrate 34 will be described with reference to FIGS. 4 and 5. In Fig. 4(A), a glass epoxy substrate is prepared, which is attached to the glass epoxy substrate. Conductive foils 35 and 36 such as copper are attached to both sides. Conductive foils 35 and 36 are modified by 13 317459 1353807 _ , Patent application No. 94133473 revised on August 25, 100. The replacement page uses a copper foil of 18 μm. The substrate is made of 〇. 6mm thick. The .NC working machine is used. The conductive foils 35, 36 and the substrate 34 are penetrated, and the through holes 31 for forming the reflector 30 are perforated. First, the through holes 31 are perforated by the diameter of the lower surface of the reflector 30 to penetrate the through holes 31 perpendicular to the inner wall. Perforation is for example 2·2 mm. The reflector substrate 34 can be selected from printed circuit board materials such as BT resin, copolymer, glass polyimide resin, or paper phenol resin, in addition to the glass epoxy resin, similarly to the mounting substrate 10. In Fig. 4(B), in order to form the reflecting surface of the reflector 30 in the through hole 31, the NC working machine is used to be machined by a drill hole, an end sharp knife (end m丨11) or a reamer. Etc. to form the inclined surface 32. The diameter of the upper surface of the through hole 31 is, for example, selected to be 2.8 mm, and the inner wall of the through hole 31 is formed with a mortar-like inclined surface 32. Further, the area of the reflecting surface of the reflector 30 can be selected by selecting the thickness of the substrate. Further, the angle of the inclined surface 32 can be easily selected by selecting the cutting angle of the reamer teeth. % in Fig. 4(c), 'the reflector substrate 34 is immersed in the palladium solution, and the two conductive foils 35, 36 are used as electrodes, and the copper plate is electrolytically plated to form the inclined surface 32 of the inner wall of the through hole 31. About 20 film thick conductive money film 37. In the fourth drawing (D), the filler 38 is printed and embedded in the through hole 31 to cover the upper surface of the reflector substrate 34. The filler 38 can be a gypsum solution. The gypsum solution is dried by sintering after printing, and is removed by polishing to remove the gypsum attached to the conductive bogie 36 under the reflector substrate 34. Therefore, in the present process, only the conductive foil 36 under the reflector substrate 34 is exposed, and the upper conductive foil 36 and the conductive plating film 317459 are modified by the patent application No. 94 133 473 | Page 37 is covered with a filler material 38. In Fig. 4(E), the filler material 38 is used as a mask, and the conductive foil 36 under the counter substrate 34 is selectively etched away. The etchant system uses gasified iron. The etched filler material 38 gypsum is removed by a caustic soda solution. In Fig. 4(F), on the conductive crucible 35 on the reflector substrate 34 and the electroconductive plating film 37 of the through hole 31, in the unshielded state, mineral or silver chrome is performed by electrolytic recording. And the formation of reflective plating film is committed. In particular, in the case of chrome plating, it is characterized in that the surface is not easily damaged, is not easily oxidized, and is not easily corroded, so that good reflection can be achieved over a long period of time. In the present process, the front end is inscribed by the drilling of the inclined surface 32. Thus, the method of forming the inclined surface 32 by the drilling process only once may be employed. Thereby, the through hole 31 and the inclined surface 32 can be formed in one process at the same time. Figure 5 shows a more specific reflector substrate 34. Fig. 5(A) shows a top view of the entire reflector substrate 34, and Fig. 5(B) shows an enlarged plan view of the reflector substrate 34. The reflector substrate 34 is provided with a corresponding number of reflectors 3 at positions corresponding to the respective units of the mounting substrate 1A. Therefore, the reflectors 30 of each single π are also arranged on the rows and columns. The size of the reflector substrate 34 is 54.5 mm x 76.0 nm, and the protruding portion 40 is provided at the periphery, and the alignment hole 41 is provided there, and the alignment hole 22 of the mounting substrate 1 is formed by the guiding pin or the like. In the reflector substrate 34, the through-holes 31 for constituting the reflector 30 are arranged in rows and columns, and the inner wall of the through-hole 31 is tilted 317459. The present invention is applied to the patent application No. 94133473. The modified replacement page slope 32 is provided with a reflective plating layer 33 on the 25th of the month.
=孔31之上面開口的直徑42 8随，下面開口的直 4 2. 2職。此外，於橫向所鄰接之單元之貫穿孔μ的中 〜之間的間隔為3· 56mm，於縱向所鄰接之單元之貫穿孔Μ 中之間的間隔為3. 36mm。因此，於橫向所鄰接之貫穿 孔31之間的離開距離為〇. 76咖，於縱向所鄰接之貫穿孔 31之間的離開距離為〇 56随，由於可比習知樹脂成型的反 射器還配置得更接近，因此，每—反射器基板34之反射器 30的設置量’可多出大約2〇至3〇%。因此，即使採用成 本較樹脂更高之玻璃環氧基板，亦由於不需_模具，而 可抑制成本之上升。 反射器基板34係採用板厚為0· 6mm且比安裝基板1〇 之板厚0.15mm更厚之玻璃環氧基板，因而反射器基板34 具有平坦且不會產生翹曲之特徵。構成有設置於反射器基 板34之各單元的反射器30之貫穿孔31，係採用κ工作 %機而以機械加工來形成，因此可不需進行加熱處理而形 成’並且可縮短各單元之間之貫穿孔31的間隔。 接下來參照第6圖，來說明以黏接層來黏接安裝基板 10及反射器基板34之製程。 黏接層50係採用於玻璃布（glass cloth)使環氧系樹 脂進行半硬化後所形成之Super Bonding Sheet(商品名 稱）。此薄片狀的Super Bonding Sheet係採用NC工作機， 針對安裝基板10的電極從反射器基板34的貫穿孔31露出 的部分，進行穿孔加工而成者。此時，若在Super Bonding 16 317459修正本 1353807= the diameter of the upper opening of the hole 31 is 42 8 , and the opening below is straight. The distance between the through holes 单元 of the cells adjacent to the longitudinal direction is 3.36 mm. Therefore, the distance between the through-holes 31 adjacent to the lateral direction is 〇. 76 coffee, and the distance between the through-holes 31 adjacent to the longitudinal direction is 〇56, as it is also configured by a conventional resin-molded reflector. To be closer, therefore, the amount of the reflector 30 per reflector substrate 34 can be increased by about 2 〇 to 3 〇 %. Therefore, even if a glass epoxy substrate having a higher cost than the resin is used, the increase in cost can be suppressed because the mold is not required. The reflector substrate 34 is a glass epoxy substrate having a thickness of 0.6 mm and a thickness of 0.15 mm thicker than the mounting substrate 1〇. Therefore, the reflector substrate 34 has a flat shape and does not cause warpage. The through hole 31 constituting the reflector 30 provided in each unit of the reflector substrate 34 is formed by machining using a κ operation % machine, so that it can be formed without heat treatment and can shorten the relationship between the units. The spacing of the through holes 31. Next, referring to Fig. 6, a process of bonding the mounting substrate 10 and the reflector substrate 34 with an adhesive layer will be described. The adhesive layer 50 is a Super Bonding Sheet (trade name) formed by semi-curing an epoxy resin to a glass cloth. This sheet-like Super Bonding Sheet is formed by punching a portion of the electrode of the mounting substrate 10 exposed from the through hole 31 of the reflector substrate 34 by using an NC machine. At this time, if the Super Bonding 16 317459 revision 1353807
參 第94133^專利申請案I L 100年8月25日修正替換頁Ref. 94133^Patent Application I L Correction Replacement Page on August 25, 100
Sheet預先在與上述安裝基板1〇及反射器基板34相同的 位置設置對位孔（未圖示）的話，則可藉由導引接腳等自動 地進行對位。 接下來，將安裝基板10及作為黏接層5〇iSuper Bonding Sheet與反射器基板34加以疊合，採用油壓沖壓 機而以3至5MPa予以加壓，並在160至17(rc下進行約i 個小時的退火處理，使黏接層5〇真正硬化，並且以厚度大 φ約50 # 111之黏接層50,使安裝基板10及反射器基板34黏 接為一體，而完成附有反射器之安裝基板。 由於反射器基板34下面之導電箔36在反射器基板34 的製程中所去除的部分，為與安裝基板10的共通電極11 及個別電極12a、12b、12c、12d僅夾著黏接層50，並與 反射器基板34下面形成為一體者，因此在黏接層5〇具有 針孔（pin hole)時，可防止因水分等所造成之短路。 若可增加黏接層50的厚度而防止針孔的產生，則可不 %用去除反射器基板34下面之導電箔36，而在反射器基板 34之全面設置反射電鍍層33。此時，可省略將反射器基板 34下面之導電箔加以去除之製程’而縮短製程。 在經由以上製程所完成之附有反射器之安裝基板’首 先將發光元件組裝於共通電極u上，接著以金屬細線，將 發光元件的陰極電極與個別電極12a、丨2b、丨2c、12d加以 淳接而連接’並以透明的保護樹脂來包覆發光元件及金屬 細線。 之後’附有反射器之安裝基板係藉由切割裝置，在縱 17 317459修正本 1353807 第94133473號專利申請案 100年8月25日修正替換頁 向將通孔電極加以切斷’在橫向以設在反射器基板之三角 形標記（參照第5圖（B))為基準來加以切斷，而分離為各個 •發光裝置。 在本發明中’安裝基板10係採用NC工作機，於兩面 具有導電笛之玻璃環氧基板設置通孔用貫穿孔18,並以電 鍍來形成通孔電極19，在形成各電極之後進行鍍銀。此 外，反射器基板34亦採用NC工作機，於兩面具有導電箔 之玻璃環氧基板形成貫穿孔31之後，進行通孔電鍍後選擇 性進行鍍銀或鍍鉻。亦即，由於安裝基板1〇及反射器基板 34白4乎通過同一條製造線，因此可達到製造線的共通 化。因此不需另外增設反射器基板的製造線。 【圖式簡單說明】 第1圖係顯示以本發明的製造方法所完成之附有反射 器之安裝基板的（A)上視圖，及（B)剖視圖。 第2圖（A)至⑻係顯示用來說明本發明之安裝基板的 | 製造方法之剖視圖。 第3圖係顯示本發明的安裝基板之（A)顯示整體之俯 視圖、（B)放大後的上視圖、及（c)放大後的底視圖。 第4圖（A)至⑺係用來說明本發明之反射器基板的製 造方法之刮視圖。 第5圖係本發明的反射器基板之⑷顯示整體之俯視 圖及（B)放大後的上視圖。 第6圖係用來說明本發明的製造方法之剖視圖。 第7圖係用來說明習知發光裝置之剖視圖。 317459修正本 18 1353807When the sheet is provided with a registration hole (not shown) at the same position as the mounting substrate 1A and the reflector substrate 34, the alignment can be automatically performed by the guide pins or the like. Next, the mounting substrate 10 and the adhesive layer 5〇iSuper Bonding Sheet and the reflector substrate 34 are superposed, pressed with a hydraulic press at 3 to 5 MPa, and subjected to about 160 to 17 (rc). After an hour of annealing, the adhesive layer 5 is actually hardened, and the bonding layer 50 having a thickness of about φ about 50 #111 is used to bond the mounting substrate 10 and the reflector substrate 34 into one body, and the reflection is completed. The mounting substrate of the device is removed from the common electrode 11 and the individual electrodes 12a, 12b, 12c, and 12d of the mounting substrate 10 because the conductive foil 36 under the reflector substrate 34 is removed in the process of the reflector substrate 34. The adhesive layer 50 is formed integrally with the underside of the reflector substrate 34. Therefore, when the adhesive layer 5 has a pin hole, short circuit caused by moisture or the like can be prevented. If the adhesive layer 50 can be added. The thickness of the pinhole is prevented from being removed, and the conductive foil 36 under the reflector substrate 34 is removed, and the reflective plating layer 33 is entirely disposed on the reflector substrate 34. At this time, the underside of the reflector substrate 34 can be omitted. The process of removing the conductive foil is reduced In the mounting substrate with the reflector completed through the above process, the light-emitting element is first assembled on the common electrode u, and then the cathode electrode of the light-emitting element and the individual electrodes 12a, 丨2b, 丨2c, and the metal thin wires are used. 12d is connected and connected to 'and covers the light-emitting element and the thin metal wire with a transparent protective resin. The mounting substrate with the reflector is then modified by the cutting device, and the patent application No. 94133473 is amended in the vertical 17 317459. On August 25, 100, the replacement page was cut to cut the through-hole electrode. In the lateral direction, the triangular mark (see Fig. 5 (B)) provided on the reflector substrate was cut and separated into individual parts. In the present invention, the mounting substrate 10 is an NC working machine, and a through hole 18 for through holes is provided in a glass epoxy substrate having conductive flute on both sides, and a via electrode 19 is formed by electroplating, after forming each electrode. Silver plating is performed. In addition, the reflector substrate 34 is also an NC working machine, and after the through hole 31 is formed on the glass epoxy substrate having the conductive foil on both sides, the through hole plating is selected. Silver plating or chrome plating is performed. That is, since the mounting substrate 1 and the reflector substrate 34 are passed through the same manufacturing line, the common line of the manufacturing line can be achieved. Therefore, it is not necessary to additionally add a manufacturing line of the reflector substrate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a (A) top view and (B) a cross-sectional view showing a mounting substrate with a reflector completed by the manufacturing method of the present invention. Fig. 2 (A) to (8) show Fig. 3 is a cross-sectional view showing a mounting method of the mounting substrate of the present invention. Fig. 3 is a plan view showing the entire display panel of the mounting board of the present invention, (B) an enlarged top view, and (c) an enlarged view. Bottom view. Fig. 4 (A) to (7) are views showing a scraping view of a method of manufacturing a reflector substrate of the present invention. Fig. 5 is a plan view showing (4) of the reflector substrate of the present invention as a whole and (B) an enlarged top view. Figure 6 is a cross-sectional view for explaining the manufacturing method of the present invention. Figure 7 is a cross-sectional view showing a conventional light-emitting device. Amendment 317459 18 1353807
• 第94丨33473號專利申請案 100年8月25日修正替換百 主要元件符號說明】 -- 10 安裝基板 11 共通電極 12a 、12b、12c ' 12d 個別電極 13a 、13b、13c、13d、 13e、13f 取出電極 14a 、14b 、 14c 、 14d 發光元件 15 金屬細線 16 ' 17導電箔 18 通孔用貫穿孔 19 通孔電極 20 光阻層 21 鍍銀層 22 對位孔 23 框狀導電箔 24 > 25連接細線 30 反射器 31 貫穿孔 32 傾斜面 33 反射電鍍層 34 反射器基板 35、 36導電箔 37 導電電鍍層 38 填充材 40 突出部 41 對位孔 50 黏接層 100 發光元件 200 基板 300 反射器 310 反射層 400 密封構件 500 杯狀部 19 317459修正本• Patent Application No. 94-33473, August 25, 100, revised, and replacement of the main components of the symbol] - 10 mounting substrate 11 common electrodes 12a, 12b, 12c' 12d individual electrodes 13a, 13b, 13c, 13d, 13e, 13f Take out the electrodes 14a, 14b, 14c, 14d Light-emitting element 15 Metal thin wire 16' 17 Conductive foil 18 Through-hole 19 through-hole electrode 20 Photoresist layer 21 Silver-plated layer 22 Alignment hole 23 Frame-shaped conductive foil 24 > 25 connection thin wire 30 reflector 31 through hole 32 inclined surface 33 reflective plating layer 34 reflector substrate 35, 36 conductive foil 37 conductive plating layer 38 filler 40 protruding portion 41 alignment hole 50 adhesion layer 100 light emitting element 200 substrate 300 reflection Reflector layer 400 sealing member 500 cup portion 19 317459 revision