KR101155693B1

KR101155693B1 - Method of manufacturing mounting board with reflector

Info

Publication number: KR101155693B1
Application number: KR1020050093775A
Authority: KR
Inventors: 고로 나리따
Original assignee: 가부시끼가이샤 엘리먼트 덴시
Priority date: 2005-07-04
Filing date: 2005-10-06
Publication date: 2012-06-12
Also published as: CN1892979A; KR20070004402A; TW200704309A; TWI353807B; JP3963923B2; JP2007013067A

Abstract

As a reflector which reflects light from a light emitting element, many white resins with high light reflectance are used. However, the reflector requires a mold for molding the resin, and there is a problem that it takes time to start. In the present invention, the reflector substrate 34 is provided with conductive foils 35 and 36 on both surfaces thereof, and the through holes 31 are formed through the through holes 35 and 36, and the inner walls of the through holes 31 are formed. The conductive plating film 37 is formed on the inclined surface 32 using the conductive foil as an electrode, and the reflective plating film 33 is formed on the conductive foil 35 and the conductive plating film, thereby mechanically reflecting the reflector on the glass epoxy substrate. It is characterized by forming.

Reflector substrate, conductive plating film, conductive foil, reflective plating film, through hole, adhesive layer

Description

Manufacturing method of mounting board with reflector {METHOD OF MANUFACTURING MOUNTING BOARD WITH REFLECTOR}

BRIEF DESCRIPTION OF THE DRAWINGS (A) Top view and (B) sectional drawing of the mounting board with a reflector completed by the manufacturing method of this invention.

2 (A) to (D) are cross-sectional views illustrating the method for manufacturing the mounting substrate of the present invention.

3 is a plan view showing the entirety of (A) of the mounting substrate of the present invention, (B) an enlarged top view, and (C) an enlarged bottom view.

4: (A)-(F) is sectional drawing explaining the manufacturing method of the reflector substrate of this invention.

5 is a plan view showing the entirety of (A) of the reflector substrate of the present invention, and (B) an enlarged top view.

6 is a cross-sectional view illustrating the manufacturing method of the present invention.

7 is a cross-sectional view illustrating a conventional light emitting device.

10: mounting board

11: common electrode

12a, 12b, 12c, 12d: individual electrodes

13a, 13b, 13c, 13d, 13e, 13f: extraction electrode

14a, 14b, 14c, 14d: light emitting element

15: fine metal wire

16, 17: Challenge Night

18: through hole for through hole

19: through hole electrode

20: resist layer

21: reflective plating film

22: position registration hole

23: frame-shaped conductive foil

30: reflector

31: through hole

32: slope

33: reflective plating film

34 reflector substrate

35, 36: Challenge Night

37: conductive plating film

38: filling material

40: protrusion

41: position registration hole

50: adhesive layer

[Patent Document 1] Japanese Patent Application Laid-Open No. 2004-134699

[Patent Document 2] Japanese Patent Application Laid-Open No. 2000-183407

TECHNICAL FIELD This invention relates to the manufacturing method of the mounting board with a reflector. Specifically, It is related with the manufacturing method of the mounting board with a reflector comprised with the glass epoxy board | substrate which embeds a light emitting element.

7 shows a light emitting device having a high luminous efficiency for efficiently reflecting light emitted from the light emitting element to the side surface.

This light emitting device is composed of a light emitting element 100, a substrate 200, a reflector 300 and a sealing member 400. The light emitting device 100 is a group III nitride compound semiconductor light emitting device. The mounting substrate 200 is an insulating substrate, and a desired wiring pattern is formed to mount the light emitting device 100. The reflector 300 is made of a polyamide-based resin in which titanium oxide is uniformly dispersed. The reflector 300 is formed such that an inner circumferential surface forming the cup portion 500 has a desired angle with respect to the optical axis, and the reflective layer 310 is formed by deposition of Al. Formed. The sealing member 400 such as a silicone resin is filled in the cup portion 500 so as to cover the light emitting element 100 (see Patent Document 1 and FIG. 1).

In addition, also in another optical semiconductor device, the case which functions as a reflector is formed by shaping | molding of white resin with high light reflectance which included titanium oxide in polycarbonate (refer patent document 2, FIG. 3).

In particular, in order to reduce the cost, the reflector is often formed by resin molding, in which case the problem described below occurs.

However, the above-described light emitting device has the following problems.

Since the reflector uses a lot of a white resin having a high light reflectance, a mold for molding a resin is required, which takes a long time to start.

In addition, since resin molding is often used for injection molding of thermoplastic resins, there is a problem that deformation such as bending occurs until molding a high temperature resin and taking it out of a mold. For this reason, when a reflector is adhere | attached on a mount board | substrate, many reflectors cannot be adhere | attached simultaneously to a mount board | substrate because of this curvature.

In addition, since a metal mold | die is used for resin molding a reflector, the space | interval with an adjacent reflector is needed to some extent, and it cannot enlarge a yield without raising the density of formation of a reflector.

In addition, since the reflector is made of resin, the reflow temperature at the time of soldering the light emitting device to the mother substrate is high at 250 ° C., so that the reflector itself is deformed, resulting in a problem of defective products. In particular, when lead-free solder is used, this reflow temperature is high, and the incidence rate of the defect is high.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and includes a step of preparing a mounting substrate having a plurality of electrodes on which a light emitting element is placed, and a through hole having an inclined surface in an inner wall to surround the respective electrodes on which the light emitting element is placed. And a reflector substrate having a reflection plated film formed on an inclined surface of the through hole, and bonding the mounting substrate and the reflector substrate with an adhesive layer.

Further, in the present invention, the mounting substrate is provided with conductive foils on both surfaces thereof, and forms an electrode on which the light emitting element is placed. It is characterized by that.

In the present invention, the reflector substrate is formed of a printed circuit board material which can be mechanically processed.

In the present invention, the reflector substrate and the mounting substrate are formed of any one of a BT resin, a glass epoxy resin, a composite, a glass polyimide resin, or a paper phenol resin.

Moreover, in this invention, all the said through holes formed in the said reflector board | substrate are formed by mechanical processing, It is characterized by the above-mentioned.

In the present invention, the reflective plated film of the reflector substrate is formed by simultaneously immersing the entire reflector substrate in a plating solution bath.

In the present invention, the reflective plated film is selectively formed on the top surface of the reflector substrate and the inclined surface of the through hole.

Moreover, in this invention, the said mounting board | substrate and the said reflector board | substrate are heat-hardened with an adhesive bond layer interposed, and it is characterized by integrally bonding.

Moreover, in this invention, the said adhesive bond layer is characterized by using semi-hardened resin.

In the present invention, the reflector substrate is provided with conductive foil on both sides, the through hole is formed through the conductive foil, and a conductive plating film is formed on the inclined surface of the inner wall of the through hole as the electrode. And forming a reflective plating film on the conductive foil and the conductive plating film.

In the present invention, after the conductive foil on the lower surface of the reflector substrate is selectively removed, the reflective plating film is formed.

First, the mounting board with a reflector completed by the manufacturing method of this invention is shown in FIG. FIG. 1A is a top view thereof, and FIG. 1B is a sectional view thereof. The mounting board is provided with a cross-shaped common electrode 11 on the upper surface and individual electrodes 12a, 12b, 12c, and 12d on four corners, and the extraction electrode connected to each of the corresponding electrodes and through-hole electrodes on the lower surface. 13a and 13b are provided. The reflector 30 is adhered to the adhesive layer 50 so as to expose a part of the common electrode 11 and the individual electrodes 12a, 12b, 12c, and 12d on the mounting substrate 10, and through holes of the reflector 30. The reflection plating film 33 is formed in the inclined surface 32 and the upper surface of 31. Four light emitting elements 14a, 14b, 14c, and 14d are fixed to the protruding portions of the cross of the common electrode 11, and the common electrode 11 constitutes a common anode electrode. The cathode electrode of each light emitting element is connected by the adjacent individual electrodes 12a, 12b, 12c, 12d, and the metal fine wire 15. As shown in FIG.

Next, the manufacturing method of the mounting substrate with a reflector which concerns on this invention is a process of preparing the mounting substrate provided with the several electrode which mounts a light emitting element, and the inclined surface in the inner wall so that each said electrode which mounts the said light emitting element may be enclosed. And a step of preparing a reflector substrate having a through hole having a through hole and having a reflective plated film formed on an inclined surface of the through hole, and bonding the mounting substrate and the reflector substrate by an adhesive layer.

A process of preparing the mounting substrate 10 will be described with reference to FIGS. 2 and 3.

In FIG. 2 (A), the glass epoxy board | substrate which adhere | attached the conductive foils 16 and 17, such as copper, on both surfaces is prepared. The electroconductive foils 16 and 17 use 18 micrometers copper foil, and the board | substrate 10 uses the thing of 0.15 mm plate | board thickness. The conductive foil 16 is used to form an electrode on which the light emitting element is placed, and the electrode is composed of a cross-shaped common electrode 11 and individual electrodes 12a, 12b, 12c, and 12d shown in FIG. do. In addition to the glass epoxy resin, the mounting substrate 10 is selected from printed substrate materials such as BT resin, composite, glass polyimide resin or paper phenol resin. BT resin refers to the general term of the high heat-resistant addition polymerization type thermosetting resin which consists of T component (triazine resin) as a main component, and consists of B component (polyfunctional maleimide compound) or another compound for modification. The composite is a laminate of a plurality of substrate materials. All of these substrate materials can be mechanically processed, such as grinding.

In FIG. 2B, a through hole through hole 18 of about 0.3 mm for forming a through hole electrode is penetrated through the conductive foils 16 and 17 and the substrate 10 by a drill or the like using an NC machine tool. Open. Next, the mounting substrate 10 is immersed in a palladium solution, and both of the conductive foils 16 and 17 are used as electrodes to form a film thickness of about 20 탆 by electrolytic plating of copper on the inner wall of the through holes 18 for through holes. Through-hole electrodes 19 are formed.

In FIG. 2C, the conductive foils 16 and 17 on the upper and lower surfaces of the mounting substrate 10 are covered with a resist layer 20, and the conductive foil 16 on the upper surface of FIG. 3A is shown in FIG. 3A. The cross-shaped common electrode 11 and the patterns of the individual electrodes 12a, 12b, 12c, and 12d are shown in the conductive foil 17 on the lower surface of the extraction electrodes 13a and 13b shown in FIG. The patterns of 13c, 13d, 13e, and 13f are exposed and developed, and the conductive foils 16 and 17 are etched using the remaining resist layer 20 as a mask. When the conductive foils 16 and 17 are copper, ferric chloride is used as the solution.

In FIG. 2D, the resist layer 20 is peeled off, and the crosswise common electrode 11, the individual electrodes 12a, 12b, 12c, 12d and the extraction electrodes 13a, 13b, The silver plating layer 21 is formed in the surface of 13c, 13d, 13e, and 13f, and surface treatment of each electrode is performed. The silver plating layer 21 enables fixing of the light emitting element, bonding or brazing of fine metal wires.

The mounting substrate embodied by FIG. 3 is shown. FIG. 3A shows a top view of the entire mounting substrate 10. FIG. 3B shows a common electrode 11 formed of a conductive foil 16 on the top surface of the mounting substrate 10 and the individual ones. An enlarged plan view of the electrodes 12a, 12b, 12c, and 12d is shown, and FIG. 3C shows the extraction electrodes 13a, 13b, 13c, and 13d formed of the electrodes 17 on the lower surface of the mounting substrate 10. FIG. , Enlarged plan views of 13e, 13f) are shown.

The mounting substrate 10 uses a glass epoxy substrate of 60 mm x 90 mm. A plurality of position matching holes 22 are formed in the periphery, and a plurality of common electrodes 11 and individual electrodes 12a, 12b, 12c, and 12d are disposed on the matrix inside. In addition, a frame-shaped conductive foil 23 is left as an electrode for electrolytic plating, and both of the common electrode 11 and the individual electrodes 12a, 12b, 12c, and 12d of each unit have this frame-shaped conductive foil. It is electrically connected with (23).

As shown in FIG. 3B, the common electrode 11 and the individual electrodes 12a, 12b, 12c, and 12d of each unit are arranged with cross-shaped common electrodes 11 connected in a horizontal direction. The individual electrodes 12a, 12b, 12c, 12d are fitted between the projections of the cross. Through-hole electrodes 19, which are circled at the intermediate positions of the cross, are formed on the common electrode 11 and the individual electrodes 12a, 12b, 12c, and 12d of each unit, and the extraction electrodes 13a and 13b on the lower surface thereof. , 13c, 13d, 13e, and 13f). The upper individual electrode 12a is connected to the individual electrode 12b on the lower side of the unit above by the communication fine wire 24, and is also connected to the common electrode 11 in the same unit by the communication fine wire 25. have. By the communication fine wires 24 and 25 and through-hole electrodes 19, the common electrode 11 and the individual electrodes 12a, 12b, 12c, 12d of each unit, and the extraction electrodes 13a, 13b, 13c, 13d, 13e 13f) is electrically connected. In addition, as will be described later, when dividing the boundary of each unit when separating into each unit, the communication fine lines 24 and 25 are cut so that each electrode of each unit is electrically independent.

Each of the extraction electrodes 13a, 13b, 13c, 13d, 13e, and 13f of each unit is arranged in parallel with each other as shown in FIG. 3C and has an upper surface by a through-hole electrode 19 represented by a circle. Is electrically connected to the common electrode 11 and the individual electrodes 12a, 12b, 12c, and 12d. The upper extraction electrode 13f is formed slightly longer than the other, and is used as a mark for pin arrangement. Each of the extraction electrodes 13a, 13b, 13c, 13d, 13e, and 13f constitutes one unit between six through-hole electrodes 19, and the extraction electrode (integrated on both sides of the through-hole electrode 19) 13a, 13b, 13c, 13d, 13e, and 13f belong to adjacent units. This is because the dicing line is exactly on this through hole electrode 19. In addition, the diagonal line in the center of each unit is the resist layer 26, and it prevents a short circuit between the extraction electrodes 13a, 13b, 13c, 13d, 13e, and 13f by solder invading during surface mounting to a mother substrate. do.

A process of preparing the reflector substrate 34 will be described with reference to FIGS. 4 and 5.

In FIG. 4A, the glass epoxy substrate which adhere | attached the conductive foils 35 and 36, such as copper, on both surfaces is prepared. The electroconductive foils 35 and 36 use copper foil of 18 micrometers, and the board | substrate uses the thing of 0.6-mm board thickness. The through hole 31 for forming the reflector 30 is opened through the conductive foils 35 and 36 and the substrate 34 with a drill or the like using an NC machine tool. The through hole 31 is first opened in accordance with the diameter of the lower surface of the reflector 30, and the through hole 31 perpendicular to the inner wall is opened at 2.2 mm, for example. In addition to the glass epoxy resin, the reflector substrate 34 is selected from printed substrate materials such as BT resin, composite, glass polyimide resin, or paper phenol resin, in addition to the glass epoxy resin.

In FIG. 4B, in order to form the reflecting surface of the reflector 30 in the through hole 31, the inclined surface 32 is formed by drilling, end milling or reamering using an NC machine tool. The diameter of the upper surface of the through hole 31 is selected, for example, 2.8 mm, and the inner wall of the through hole 31 is formed with a mortar-shaped inclined surface 32. In addition, the area of the reflecting surface of the reflector 30 can be easily selected by selecting the plate thickness of the substrate. In addition, the angle of the inclined surface 32 can also be selected easily by selecting the grinding angle of the reamer blade.

In FIG. 4C, the reflector substrate 34 is immersed in a palladium solution, and the electroconductive plating of copper is applied to the inclined surface 32 of the inner wall of the through hole 31 using both conductive foils 35 and 36 as electrodes. As a result, a conductive plating film 37 having a film thickness of about 20 mu m is formed.

In FIG. 4D, the filler 38 is printed to fill the through hole 31 and cover the upper surface of the reflector substrate 34. As the filler 38, a solution of gypsum is used. The gypsum solution is calcined and dried after printing, and the gypsum attached to the conductive foil 36 on the lower surface of the reflector substrate 34 is removed by buff polishing. Therefore, in this step, only the conductive foil 36 on the lower surface of the reflector substrate 34 is exposed, and the conductive foil 36 and the conductive plating film 37 on the upper surface are covered with the filler 38.

In FIG. 4E, the conductive foil 36 on the lower surface of the reflector substrate 34 is selectively etched away using the filler 38 as a mask. The etching solution uses ferric chloride. After etching, the gypsum filler 38 is peeled off and removed with a caustic soda solution.

In FIG. 4F, silver plating or chrome plating is performed on the conductive foil 35 on the upper surface of the reflector substrate 34 and the conductive plating film 37 of the through hole 31 by electroless plating without a mask. The reflective plating film 33 is formed. In particular, in the case of chromium plating, there is a characteristic that the surface is hardly damaged, the surface is not oxidized and is hardly corroded, so that good reflection can be realized over a long period of time.

In this process, by inching the tip by using the drill matched to the inclined surface 32, a method capable of forming the inclined surface 32 in a single step by drilling only can also be employed. Thereby, formation of the through hole 31 and formation of the inclined surface 32 mentioned above can be performed simultaneously in one process.

The reflector substrate 34 embodied by FIG. 5 is shown. FIG. 5A shows a top view of the reflector substrate 34 as a whole, and FIG. 5B shows an enlarged plan view of the reflector substrate 34.

The reflector board | substrate 34 is provided with the number of reflectors 30 corresponding to the position corresponding to each unit of the mounting board 11 mentioned above. Therefore, the reflector 30 of each unit is also arrange | positioned on a matrix. The reflector substrate 34 has a size of 54.5 mm x 76.0 mm, and the projection 40 is formed at the periphery to form the position matching hole 41 therein, and the position matching hole 22 of the mounting substrate 11 with a guide pin or the like. Position matching). Through-holes 31 for constituting the reflector 30 are arranged on a matrix in the reflector substrate 34, and a reflective plating film 33 is formed on the inclined surface 32 of the inner wall of the through-hole 31.

The diameter of the upper surface opening of the through hole 31 is 2.8 mm, and the diameter of the lower surface opening is 2.2 mm. In addition, the space | interval between the center of the through-hole 31 of a unit adjacent to a horizontal direction is 3.56 mm, and the space | interval between the center of the through-hole 31 of an adjacent unit of a longitudinal direction is 3.36 mm. Therefore, the separation distance between adjacent through holes 31 in the horizontal direction is 0.76 mm, and the separation distance between adjacent through holes 31 in the vertical direction is 0.56 mm, and is disposed very close to the reflector of the conventional resin molding. In this way, the output of the reflector 30 per reflector substrate 34 can be increased by about 20 to 30%.

For this reason, cost increase is suppressed by not using a metal mold | die, even if it uses the glass epoxy substrate which is higher in cost than resin.

Since the reflector substrate 34 uses a glass epoxy substrate having a plate thickness of 0.6 mm and considerably thicker than a plate thickness of 0.15 mm of the mounting substrate 11, the reflector substrate 34 is flat and does not generate warpage. Since the through holes 31 constituting the reflector 30 of each unit provided on the reflector substrate 34 are mechanically formed by the NC machine tool, they can be formed without heat treatment, so that the through holes between the units The interval of 31 is also narrowed.

A process of adhering the mounting substrate 10 and the reflector substrate 34 with the adhesive layer will be described with reference to FIG. 6.

The adhesive layer 50 uses the super bonding sheet (brand name) which semi-hardened the epoxy resin with glass cross. The sheet-shaped super bonding sheet is punched into a portion where the electrode of the mounting substrate 11 is exposed from the through hole 31 of the reflector substrate 34 by the NC machine. At this time, if the position bonding hole (not shown) is formed in the super bonding sheet at the same position as the mounting substrate 10 and the reflector substrate 34 mentioned above, positioning can be performed automatically by a guide pin etc.

Subsequently, the superbonding sheet and reflector substrate 34 made of the mounting substrate 10 and the adhesive layer 50 described above are superimposed and pressurized at a pressure of 3 to 5 MPa with a hydraulic press for about 1 hour at 160 to 170 ° C. to form an adhesive layer. 50 is hardened | cured, and the mounting board | substrate 10, the reflector board | substrate 34, and the adhesive layer 50 of thickness about 50 micrometers are integrally adhere | attached, and the mounting board with a reflector is completed.

Since the conductive foil 36 on the lower surface of the reflector substrate 34 is removed in the manufacturing process of the reflector substrate 34, the common electrode 11 and the individual electrodes 12a, 12b, 12c of the mounting substrate 10 are removed. 12d) and the lower surface of the reflector substrate 34 are integrally provided with only the adhesive layer 50 interposed therebetween, so that when the adhesive layer 50 has a pinhole, it is prevented from being shorted by moisture or the like.

In addition, if the adhesive layer 50 can be made thicker to prevent the occurrence of pinholes, the removal of the conductive foil 36 on the lower surface of the reflector substrate 34 is omitted, and the reflective plated film is formed on the entire surface of the reflector substrate 34. 33) may be formed. In this case, the electrically conductive foil removal process of the lower surface of the reflector substrate 34 can be skipped, and process shortening can be performed.

In the mounting substrate with a reflector completed in the above process, a light emitting element is first built on the common electrode 11, and then the anode electrode and the individual electrodes 12a, 12b, 12c, and 12d of the light emitting element are bonded by a thin metal wire. It connects and coats a light emitting element and a metal fine wire with transparent protective resin.

Thereafter, the mounting substrate with the reflector is cut on the through-hole electrode in the vertical direction by the dicing apparatus, and is cut on the basis of the triangular mark (see FIG. 5B) formed in the reflector substrate in the horizontal direction, respectively. Separated into the light emitting device.

In the present invention, the mounting substrate 10 forms through-holes 18 for through-holes with an NC machine on glass epoxy substrates having conductive foils on both sides, forms through-hole electrodes 19 by plating, and forms respective electrodes. After that, silver plating is performed. In addition, the reflector substrate 34 is also selectively plated with silver or chromium after through hole plating, after the through hole 31 is formed on the glass epoxy substrate having conductive foils on both surfaces by the NC machine. That is, since the mounting board | substrate 10 and the reflector board | substrate 34 pass through substantially the same manufacturing line, common production line can be aimed at. Therefore, it is not necessary to expand the production line of the reflector substrate on purpose.

According to the present invention, by mounting a mounting substrate and a reflector substrate and bonding both substrates with an adhesive, there is an advantage that a mounting substrate with a reflector having a plurality of electrodes can be realized by a very simple manufacturing method.

Moreover, according to this invention, there exists an advantage which can implement a mounting board by connecting the electrode which mounts a light emitting element and an external electrode through the through-hole using the conductive foil provided in both surfaces of a mounting board.

Moreover, according to this invention, since a mounting board | substrate and a reflector board | substrate are comprised with the printed board material, there exists an advantage that a curvature etc. do not generate | occur | produce, even when joining both board | substrates. In particular, by using a substrate material formed of any one of a BT resin, a glass epoxy resin, a composite, a glass polyimide resin, or a paper phenol resin, the solder reflow temperature is sufficiently heat resistant even at a temperature of 250 ° C. or higher as in a normal printed circuit board. Does not occur.

In the present invention, all the through holes provided in the reflector substrate are mechanically processed, such as drill, end mill, or lima processing, so that there is no heat treatment. Therefore, the reflector substrate does not require any mold, unlike conventional resins. The size of the through hole can be freely set by selection of a drill or the like, and the size of the inclined surface can also be corresponding by selecting the thickness of the reflector substrate. Since the reflector substrate is completed only by machining, there is no warping due to overheating during manufacturing. Therefore, since there is no warp when joining a mounting board and a reflector board with an adhesive agent, the space | interval with adjacent through-holes becomes narrow and the output amount of a reflector can be enlarged.

In addition, in the present invention, since the reflective plated film of the reflector substrate is formed at the same time by immersing the entire reflector substrate in a plating solution bath, it can be easily manufactured without a mask.

In addition, in this invention, since a mounting board | substrate and a reflector board | substrate are integrally bonded by heat-hardening with an adhesive bond layer interposed, it can be handled as one board | substrate, and deformation of a reflector can also be prevented.

In addition, in this invention, since a mounting board | substrate and a reflector board | substrate pass through substantially the same manufacturing line, commonization of a manufacturing line can be aimed at. Therefore, it is not necessary to expand the production line of the reflector substrate on purpose.

Claims

A plurality of common electrodes for mounting a plurality of light emitting elements and a plurality of individual electrodes for individually connecting to other electrodes of the plurality of light emitting elements are formed on the conductive foil on the upper side of the first printed substrate material having conductive foils on both sides thereof. And forming a mounting substrate by forming a plurality of extraction electrodes connected to the corresponding common electrodes or the individual electrodes through the through-hole electrodes on the lower conductive foil,

A second printed circuit board material having conductive foil affixed on both sides thereof is prepared, and a plurality of through holes arranged in a matrix state with an inclined surface on the inner wall of the second printed circuit board material are formed by mechanical processing, and all of the through holes Forming a reflector substrate by through-hole plating on the inclined surface of the reflector;

And a step of adhering the mounting substrate and the reflector substrate with an adhesive layer.

The method of claim 1,

The first printed circuit board material and the second printed circuit board material are formed of any one of a BT resin, a glass epoxy resin, a composite, a glass polyimide resin, or a paper phenol resin. .

The method of claim 1,

A step of forming the through hole electrode of the mounting substrate and a step of forming the through hole plating of the reflector substrate are performed in the same production line.

The method of claim 1,

After the reflection plating film is formed on the entire surface of the reflector substrate, and selectively remains on the top surface of the reflector substrate and the inclined surface of the through hole, and the step of removing the conductive foil on the back surface of the reflector substrate. The manufacturing method of the mounting board with a reflector characterized by the above-mentioned.

The method of claim 1,

In the step of adhering the mounting substrate and the reflector substrate with an adhesive layer, the mounting substrate and the reflector substrate are integrally bonded by heating and curing with an adhesive layer interposed therebetween, wherein the mounting substrate is a method of manufacturing a mounting substrate with a reflector. .

The method of claim 5,

The said adhesive bond layer uses semi-hardened resin, The manufacturing method of the mounting board with a reflector characterized by the above-mentioned.

The method of claim 1,

The conductive foil on the lower surface of the reflector substrate is selectively removed, and then the reflective plating film is formed, wherein the reflector substrate is manufactured.

The method of claim 1,

In the process of forming a plurality of through-holes arranged in a matrix state with an inclined surface on the inner wall of the second printed circuit board material by mechanical processing, after selecting the inclination angle of the grinding surface of the drill, end mill or reamer cutting blade And a through hole having an inclined surface corresponding to an inclination angle of the grinding surface of the blade in the second printed circuit board material, wherein the through hole is mechanically formed.

delete