TW200730834A - Electronic component test device and method for installing performance board of the electronic component test device - Google Patents

Electronic component test device and method for installing performance board of the electronic component test device

Info

Publication number
TW200730834A
TW200730834A TW095140200A TW95140200A TW200730834A TW 200730834 A TW200730834 A TW 200730834A TW 095140200 A TW095140200 A TW 095140200A TW 95140200 A TW95140200 A TW 95140200A TW 200730834 A TW200730834 A TW 200730834A
Authority
TW
Taiwan
Prior art keywords
test device
electronic component
component test
probe card
performance board
Prior art date
Application number
TW095140200A
Other languages
English (en)
Other versions
TWI314650B (zh
Inventor
Katsuhiko Namiki
Shigeaki Naito
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200730834A publication Critical patent/TW200730834A/zh
Application granted granted Critical
Publication of TWI314650B publication Critical patent/TWI314650B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
TW095140200A 2005-11-15 2006-10-31 Electronic component test device and method for installing performance board of the electronic component test device TW200730834A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2005/020971 WO2007057944A1 (ja) 2005-11-15 2005-11-15 電子部品試験装置及び電子部品試験装置へのパフォーマンスボードの装着方法
PCT/JP2006/304755 WO2007057990A1 (ja) 2005-11-15 2006-03-10 電子部品試験装置及び電子部品試験装置へのパフォーマンスボードの装着方法

Publications (2)

Publication Number Publication Date
TW200730834A true TW200730834A (en) 2007-08-16
TWI314650B TWI314650B (zh) 2009-09-11

Family

ID=38048336

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140200A TW200730834A (en) 2005-11-15 2006-10-31 Electronic component test device and method for installing performance board of the electronic component test device

Country Status (5)

Country Link
US (2) US8013624B2 (zh)
KR (1) KR101015397B1 (zh)
DE (1) DE112006003034T5 (zh)
TW (1) TW200730834A (zh)
WO (2) WO2007057944A1 (zh)

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WO2007057944A1 (ja) 2005-11-15 2007-05-24 Advantest Corporation 電子部品試験装置及び電子部品試験装置へのパフォーマンスボードの装着方法
JP4941169B2 (ja) * 2007-08-15 2012-05-30 横河電機株式会社 プローブカード機構
JP2009128216A (ja) * 2007-11-26 2009-06-11 Yazaki Corp 導通検査治具、該導通検査治具を備えた導通検査装置、及び導通検査方法
JP2009260040A (ja) * 2008-04-16 2009-11-05 Powerchip Semiconductor Corp プローブシステム
JP2010050437A (ja) * 2008-07-25 2010-03-04 Yokogawa Electric Corp Ｉｃテスタ
JP2010175507A (ja) 2009-02-02 2010-08-12 Micronics Japan Co Ltd 電気的接続装置
JPWO2011013231A1 (ja) * 2009-07-30 2013-01-07 株式会社アドバンテスト プローブカード保持装置及びプローバ
JP2011086880A (ja) * 2009-10-19 2011-04-28 Advantest Corp 電子部品実装装置および電子部品の実装方法
US8648616B2 (en) * 2009-12-22 2014-02-11 Ltx-Credence Corporation Loaded printed circuit board test fixture and method for manufacturing the same
JP5557547B2 (ja) 2010-02-10 2014-07-23 株式会社アドバンテスト テストヘッド及びそれを備えた半導体ウェハ試験装置
US8278956B2 (en) * 2010-04-08 2012-10-02 Advantest America, Inc Probecard system and method
US8476918B2 (en) * 2010-04-28 2013-07-02 Tsmc Solid State Lighting Ltd. Apparatus and method for wafer level classification of light emitting device
TW201209419A (en) * 2010-08-25 2012-03-01 Pleader Yamaichi Co Ltd Probe card structure
US9134357B1 (en) * 2011-03-25 2015-09-15 Maxim Integrated, Inc. Universal direct docking at probe test
KR20130136794A (ko) * 2012-06-05 2013-12-13 삼성전자주식회사 반도체 테스트 장비 및 이를 이용한 반도체 소자 테스트 방법
WO2014009542A2 (de) 2012-07-12 2014-01-16 Konrad Gmbh Vorrichtung zum herstellen und/oder bearbeiten eines werkstücks
DE102012111216A1 (de) 2012-11-21 2014-05-22 Konrad Gmbh Verfahren zum Bewegen eines Gegenstandes
US9739826B2 (en) 2012-11-21 2017-08-22 Konrad Gmbh Method and device for testing a workpiece
DE102012111215A1 (de) 2012-11-21 2014-06-05 Konrad Gmbh Verfahren und Vorrichtung zum Prüfen eines Werkstücks
KR102123989B1 (ko) 2013-12-17 2020-06-26 삼성전자주식회사 테스터 및 이를 구비하는 반도체 소자 검사 장치
TWI505051B (zh) * 2014-01-28 2015-10-21 Hon Tech Inc A plurality of electronic components can be positioned at the same time positioning device and its application of the operating equipment
JP6276053B2 (ja) * 2014-02-13 2018-02-07 東京エレクトロン株式会社 プローバ
JP6525831B2 (ja) * 2015-09-15 2019-06-05 株式会社ヨコオ コンタクトユニット及び検査治具
KR102566685B1 (ko) 2016-07-18 2023-08-14 삼성전자주식회사 프로브 카드용 클램핑 장치 및 이를 포함하는 프로브 카드
US10613137B2 (en) * 2017-12-01 2020-04-07 Xilinx, Inc. Probe head securing mechanism for probe assembly
TWI771805B (zh) * 2020-11-18 2022-07-21 致茂電子股份有限公司 探針頭連接方法
CN115166319B (zh) * 2022-09-08 2022-12-02 苏州尚实豪精密机械科技有限公司 一种实插测试治具

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JPH0515431A (ja) 1991-07-15 1993-01-26 Tsujikawa Sangyo Kk タフテツドカーペツトおよびその製造法
JPH0936188A (ja) * 1995-07-14 1997-02-07 Tokyo Electron Ltd プローブ装置に用いられるプローブカードデバイス
JPH09153528A (ja) * 1995-11-30 1997-06-10 Tokyo Electron Ltd プローブカードデバイス
TW300954B (en) 1995-07-14 1997-03-21 Tokyo Electron Co Ltd The probe card used in prober
US5923180A (en) 1997-02-04 1999-07-13 Hewlett-Packard Company Compliant wafer prober docking adapter
US6798224B1 (en) * 1997-02-11 2004-09-28 Micron Technology, Inc. Method for testing semiconductor wafers
JPH1123615A (ja) * 1997-05-09 1999-01-29 Hitachi Ltd 接続装置および検査システム
JPH11186348A (ja) 1997-12-24 1999-07-09 Sony Corp 半導体集積回路試験装置
US6078186A (en) * 1997-12-31 2000-06-20 Micron Technology, Inc. Force applying probe card and test system for semiconductor wafers
US6114869A (en) * 1998-05-21 2000-09-05 Cerprobe Corporation Method and apparatus for interfacing between automatic wafer probe machines, automatic testers, and probe cards
US6166553A (en) * 1998-06-29 2000-12-26 Xandex, Inc. Prober-tester electrical interface for semiconductor test
JP4037726B2 (ja) * 2002-10-02 2008-01-23 東京エレクトロン株式会社 真空プローブ装置及び真空プローブ方法
JP2004205487A (ja) 2002-11-01 2004-07-22 Tokyo Electron Ltd プローブカードの固定機構
KR101181639B1 (ko) 2003-07-28 2012-09-13 넥스테스트 시스템즈 코포레이션 프로브 카드를 평탄화하는 장치 및 상기 장치를 사용하는방법
JP2005251813A (ja) * 2004-03-02 2005-09-15 Matsushita Electric Ind Co Ltd ウエハレベルバーンインアライメント装置およびウエハレベルバーンインアライメント方法
DE102004027887B4 (de) 2004-05-28 2010-07-29 Feinmetall Gmbh Prüfeinrichtung zur elektrischen Prüfung eines Prüflings
CN1954202A (zh) 2004-06-08 2007-04-25 株式会社爱德万测试 图像传感器用试验装置
DE112005001501T5 (de) 2004-06-28 2007-05-16 Advantest Corp Messgerät, Verfahren, Programm, Speichermedium,Netzwerkanalysator und Halbleitertestgerät zum Messen von Charakteristiken eines Verbindungselements
US7919974B2 (en) 2004-07-23 2011-04-05 Advantest Corporation Electronic device test apparatus and method of configuring electronic device test apparatus
WO2007057944A1 (ja) 2005-11-15 2007-05-24 Advantest Corporation 電子部品試験装置及び電子部品試験装置へのパフォーマンスボードの装着方法
WO2007094034A1 (ja) 2006-02-13 2007-08-23 Advantest Corporation コンタクトプッシャ、コンタクトアーム及び電子部品試験装置

Also Published As

Publication number Publication date
WO2007057944A1 (ja) 2007-05-24
US8710855B2 (en) 2014-04-29
WO2007057990A1 (ja) 2007-05-24
DE112006003034T5 (de) 2008-10-09
TWI314650B (zh) 2009-09-11
US8013624B2 (en) 2011-09-06
US20090237100A1 (en) 2009-09-24
KR20080077172A (ko) 2008-08-21
KR101015397B1 (ko) 2011-02-22
US20120025858A1 (en) 2012-02-02

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