TW200718297A - Printed wiring board, electronic machine and power supply device - Google Patents

Printed wiring board, electronic machine and power supply device

Info

Publication number
TW200718297A
TW200718297A TW095123702A TW95123702A TW200718297A TW 200718297 A TW200718297 A TW 200718297A TW 095123702 A TW095123702 A TW 095123702A TW 95123702 A TW95123702 A TW 95123702A TW 200718297 A TW200718297 A TW 200718297A
Authority
TW
Taiwan
Prior art keywords
wiring board
printed wiring
power supply
supply device
electronic machine
Prior art date
Application number
TW095123702A
Other languages
English (en)
Other versions
TWI313148B (en
Inventor
Shingo Yamamoto
Hiroyuki Ishibashi
Katsumi Matsuda
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Publication of TW200718297A publication Critical patent/TW200718297A/zh
Application granted granted Critical
Publication of TWI313148B publication Critical patent/TWI313148B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Dc-Dc Converters (AREA)
TW095123702A 2005-07-04 2006-06-30 Switching power supply , electronic maching and power supply device TWI313148B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005195294 2005-07-04
JP2006154339A JP3972951B2 (ja) 2005-07-04 2006-06-02 スイッチング電源、電源装置および電子機器

Publications (2)

Publication Number Publication Date
TW200718297A true TW200718297A (en) 2007-05-01
TWI313148B TWI313148B (en) 2009-08-01

Family

ID=37075139

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095123702A TWI313148B (en) 2005-07-04 2006-06-30 Switching power supply , electronic maching and power supply device

Country Status (5)

Country Link
US (1) US20070047278A1 (zh)
EP (1) EP1742520A1 (zh)
JP (1) JP3972951B2 (zh)
KR (1) KR100868838B1 (zh)
TW (1) TWI313148B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009289986A (ja) * 2008-05-29 2009-12-10 Tdk Corp 電子部品の製造方法及びノイズ対策テーブル
JP5532554B2 (ja) * 2008-06-11 2014-06-25 富士電機株式会社 電力変換装置
TWI351237B (en) * 2009-02-06 2011-10-21 Tatung Co Circuit board structure
JP5131861B2 (ja) * 2009-08-25 2013-01-30 Ｎｅｃトーキン株式会社 リードフレーム及びインターポーザ
JP5872801B2 (ja) * 2011-06-22 2016-03-01 Ｎｅｃトーキン株式会社 インターポーザ
JP5993562B2 (ja) * 2011-10-13 2016-09-14 株式会社日立製作所 電力変換装置及びその製造方法
KR101399022B1 (ko) * 2012-12-27 2014-05-27 주식회사 아모센스 전자파 흡수시트 및 그의 제조방법과 이를 포함하는 전자기기
JP2015192555A (ja) * 2014-03-28 2015-11-02 株式会社東芝 半導体装置
US9955614B2 (en) * 2015-05-22 2018-04-24 Samsung Electro-Mechanics Co., Ltd. Sheet for shielding against electromagnetic waves and wireless power charging device
US10028420B2 (en) * 2015-05-22 2018-07-17 Samsung Electro-Mechanics Co., Ltd. Sheet for shielding against electromagnetic waves and wireless power charging device
US10796585B2 (en) * 2017-06-12 2020-10-06 United States Of America As Represented By The Administrator Of Nasa Device for providing real-time rotorcraft noise abatement information
EP4303917A1 (en) * 2022-07-06 2024-01-10 Infineon Technologies Austria AG A semiconductor package or a printed circuit board, both modified to one or more of reduce, inverse or utilize magnetic coupling caused by the load current of a semiconductor transistor

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3347426A1 (de) * 1983-06-29 1985-01-03 Parwenit Projekt AG, Frauenfeld Schlaeger fuer ein ballspiel, insbesondere fuer tennis
US4814546A (en) * 1987-11-25 1989-03-21 Minnesota Mining And Manufacturing Company Electromagnetic radiation suppression cover
JPH02172299A (ja) * 1988-12-23 1990-07-03 Mitsubishi Rayon Co Ltd シールド装置の製造方法
JPH02256291A (ja) * 1988-12-26 1990-10-17 Mitsubishi Rayon Co Ltd プリント配線板
JPH04352498A (ja) * 1991-05-30 1992-12-07 Mitsui Toatsu Chem Inc 高透磁率を有する電磁シールド用絶縁ペースト
KR930011548B1 (ko) * 1991-08-13 1993-12-10 한국과학기술연구원 적층형 전파흡수체
FI117224B (fi) * 1994-01-20 2006-07-31 Nec Tokin Corp Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti
JPH0817656A (ja) * 1994-06-29 1996-01-19 T I F:Kk 半導体装置の磁気シールド方式および磁気シールド膜形成方法
JP3725599B2 (ja) * 1995-09-07 2005-12-14 株式会社東芝 平面型磁気素子
JP3055464B2 (ja) * 1996-06-06 2000-06-26 日本電気株式会社 半導体集積回路の配線構造および形成方法
JPH1079593A (ja) * 1996-09-05 1998-03-24 Tokin Corp 磁性プリプレグとその製造方法及びそれを用いたプリント配線基板
JP3055488B2 (ja) * 1997-03-03 2000-06-26 日本電気株式会社 多層プリント基板及びその製造方法
JPH1154985A (ja) * 1997-08-05 1999-02-26 Tokin Corp 複合磁性ペースト
KR100348920B1 (ko) * 1998-09-03 2002-08-14 마쯔시다덴기산교 가부시키가이샤 자성막과 그 제조 방법
JP2001291989A (ja) * 2000-04-04 2001-10-19 Tokin Corp 金属筐体を備えた電子部品
NO20011677L (no) * 2000-04-04 2001-10-05 Tokin Corp Elektronisk komponent for demping av höy frekvens og forbindelsesledning for komponenten
JP4417521B2 (ja) * 2000-04-04 2010-02-17 Ｎｅｃトーキン株式会社 配線基板
JP2001284755A (ja) * 2000-04-04 2001-10-12 Tokin Corp 配線基板
JP4632336B2 (ja) * 2001-06-04 2011-02-16 Ｎｅｃトーキン株式会社 半導体回路基板およびその製造方法
JP2003092475A (ja) * 2001-09-19 2003-03-28 Nec Tokin Corp プラスチック積層プリント基板
JP4217438B2 (ja) * 2002-07-26 2009-02-04 Ｆｄｋ株式会社 マイクロコンバータ
JPWO2004045265A1 (ja) * 2002-11-11 2006-03-16 Ｎｅｃトーキン株式会社 Ｅｍｉ対策部品およびｅｍｉ対策方法
JP2004303825A (ja) * 2003-03-28 2004-10-28 Tdk Corp 積層軟磁性部材、電子機器
JP4115882B2 (ja) * 2003-05-14 2008-07-09 株式会社ルネサステクノロジ 半導体装置
US6972079B2 (en) * 2003-06-25 2005-12-06 Advanced Energy Industries Inc. Dual magnetron sputtering apparatus utilizing control means for delivering balanced power
US6970367B2 (en) * 2003-08-20 2005-11-29 Matsushita Electric Industrial Co., Ltd. Switching power supply
JP2005158921A (ja) 2003-11-25 2005-06-16 Aica Kogyo Co Ltd プリント配線板
JP2005158916A (ja) * 2003-11-25 2005-06-16 Aica Kogyo Co Ltd 多層プリント配線板
JP4381871B2 (ja) * 2004-04-09 2009-12-09 信越ポリマー株式会社 電磁波ノイズ抑制体、その製造方法、および電磁波ノイズ抑制機能付きプリント配線板
JP4241756B2 (ja) * 2005-05-13 2009-03-18 オムロン株式会社 部品実装基板構造

Also Published As

Publication number Publication date
JP3972951B2 (ja) 2007-09-05
TWI313148B (en) 2009-08-01
JP2007043096A (ja) 2007-02-15
EP1742520A1 (en) 2007-01-10
KR20070004426A (ko) 2007-01-09
KR100868838B1 (ko) 2008-11-14
US20070047278A1 (en) 2007-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees