TW200705591A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
TW200705591A
TW200705591A TW095122889A TW95122889A TW200705591A TW 200705591 A TW200705591 A TW 200705591A TW 095122889 A TW095122889 A TW 095122889A TW 95122889 A TW95122889 A TW 95122889A TW 200705591 A TW200705591 A TW 200705591A
Authority
TW
Taiwan
Prior art keywords
semiconductor device
small
region
thick
drawn
Prior art date
Application number
TW095122889A
Other languages
English (en)
Inventor
Noriyuki Nagai
Tsuyoshi Hamatani
Tadaaki Mimura
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200705591A publication Critical patent/TW200705591A/zh

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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5225—Shielding layers formed together with wiring layers
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0504—14th Group
    • H01L2924/05042—Si3N4
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
TW095122889A 2005-07-26 2006-06-26 Semiconductor device TW200705591A (en)

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JP2005215166 2005-07-26
JP2006081823A JP2007059867A (ja) 2005-07-26 2006-03-24 半導体装置

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KR20100094504A (ko) * 2007-12-10 2010-08-26 에이저 시스템즈 인크 상부 금속층을 이용하는 칩 식별
JP5467736B2 (ja) 2008-06-23 2014-04-09 ルネサスエレクトロニクス株式会社 半導体集積回路
JP5908578B2 (ja) * 2012-03-14 2016-04-26 パナソニック株式会社 半導体装置
JP6355541B2 (ja) * 2014-12-04 2018-07-11 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

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JPS6080264A (ja) * 1983-10-07 1985-05-08 Toshiba Corp 半導体装置
JPH05283467A (ja) * 1992-03-30 1993-10-29 Nec Corp 半導体集積回路装置
JP2749241B2 (ja) * 1993-02-16 1998-05-13 ローム株式会社 半導体集積回路
JP2003179063A (ja) * 1997-04-24 2003-06-27 Sharp Corp 半導体装置
KR100295240B1 (ko) * 1997-04-24 2001-11-30 마찌다 가쯔히꼬 반도체장치
JP4216226B2 (ja) * 1997-08-29 2009-01-28 株式会社日立製作所 半導体集積回路装置
CN1146976C (zh) * 1997-10-30 2004-04-21 株式会社日产制作所 半导体装置及其制造方法
TW445616B (en) * 1998-12-04 2001-07-11 Koninkl Philips Electronics Nv An integrated circuit device
JP2000183104A (ja) * 1998-12-15 2000-06-30 Texas Instr Inc <Ti> 集積回路上でボンディングするためのシステム及び方法
JP2002016065A (ja) * 2000-06-29 2002-01-18 Toshiba Corp 半導体装置
JP2002016069A (ja) * 2000-06-29 2002-01-18 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2002151551A (ja) * 2000-11-10 2002-05-24 Hitachi Ltd フリップチップ実装構造、その実装構造を有する半導体装置及び実装方法
JP2002313930A (ja) * 2001-04-11 2002-10-25 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP3967199B2 (ja) * 2002-06-04 2007-08-29 シャープ株式会社 半導体装置及びその製造方法
JP2004014637A (ja) * 2002-06-04 2004-01-15 Sony Corp 半導体装置及びワイヤボンディング方法
DE10249192A1 (de) * 2002-10-22 2004-05-13 Infineon Technologies Ag Elektronisches Bauelement mit integriertem passiven elektronischen Bauelement und Verfahren zu dessen Herstellung
US7394161B2 (en) * 2003-12-08 2008-07-01 Megica Corporation Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto
US7425767B2 (en) * 2004-07-14 2008-09-16 Megica Corporation Chip structure with redistribution traces

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CN1905180A (zh) 2007-01-31
JP2007059867A (ja) 2007-03-08
CN1905180B (zh) 2011-02-23
KR20070014015A (ko) 2007-01-31
CN102176437A (zh) 2011-09-07
US20070023927A1 (en) 2007-02-01

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