WO2009126010A3 - 발광 소자 - Google Patents
발광 소자 Download PDFInfo
- Publication number
- WO2009126010A3 WO2009126010A3 PCT/KR2009/001886 KR2009001886W WO2009126010A3 WO 2009126010 A3 WO2009126010 A3 WO 2009126010A3 KR 2009001886 W KR2009001886 W KR 2009001886W WO 2009126010 A3 WO2009126010 A3 WO 2009126010A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- emitting device
- conductive semiconductor
- semiconductor layer
- layer formed
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 abstract 4
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/14—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/937,453 US9543467B2 (en) | 2008-04-12 | 2009-04-13 | Light emitting device |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080033966A KR101428068B1 (ko) | 2008-04-12 | 2008-04-12 | 그룹 3족 질화물계 반도체 발광다이오드 소자 및 이의 제조방법 |
KR10-2008-0033966 | 2008-04-12 | ||
KR10-2008-0033967 | 2008-04-12 | ||
KR20080033967A KR101480552B1 (ko) | 2008-04-12 | 2008-04-12 | 그룹 3족 질화물계 반도체 발광다이오드 소자 및 이의 제조방법 |
KR1020080033987A KR101449032B1 (ko) | 2008-04-13 | 2008-04-13 | 플립칩 구조의 그룹 3족 질화물계 반도체 발광다이오드소자 및 이의 제조 방법 |
KR1020080033986A KR101428069B1 (ko) | 2008-04-13 | 2008-04-13 | 플립칩 구조의 그룹 3족 질화물계 반도체 발광다이오드소자 및 이의 제조 방법 |
KR10-2008-0033987 | 2008-04-13 | ||
KR10-2008-0033986 | 2008-04-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009126010A2 WO2009126010A2 (ko) | 2009-10-15 |
WO2009126010A3 true WO2009126010A3 (ko) | 2010-01-14 |
Family
ID=41162419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2009/001886 WO2009126010A2 (ko) | 2008-04-12 | 2009-04-13 | 발광 소자 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9543467B2 (ko) |
WO (1) | WO2009126010A2 (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101054984B1 (ko) * | 2010-03-26 | 2011-08-05 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
US9330911B2 (en) * | 2011-08-22 | 2016-05-03 | Invenlux Limited | Light emitting device having group III-nitride current spreading layer doped with transition metal or comprising transition metal nitride |
KR20130035658A (ko) * | 2011-09-30 | 2013-04-09 | 서울옵토디바이스주식회사 | 발광 다이오드 소자용 기판 제조 방법 |
US9576868B2 (en) * | 2012-07-30 | 2017-02-21 | General Electric Company | Semiconductor device and method for reduced bias temperature instability (BTI) in silicon carbide devices |
CN103367581A (zh) * | 2013-07-26 | 2013-10-23 | 东南大学 | 一种具有电子阻挡层结构的发光二极管 |
CN103474538B (zh) * | 2013-09-25 | 2016-06-22 | 湘能华磊光电股份有限公司 | Led外延片、其制作方法及包含其的led芯片 |
TWI536602B (zh) * | 2013-10-25 | 2016-06-01 | 隆達電子股份有限公司 | 發光二極體 |
CN104241468A (zh) * | 2014-08-27 | 2014-12-24 | 迪源光电股份有限公司 | 一种高外量子效率GaN基LED外延片及其制作方法 |
JP2016192527A (ja) * | 2015-03-31 | 2016-11-10 | ウシオ電機株式会社 | 半導体発光素子及びその製造方法 |
DE102017104719A1 (de) * | 2017-03-07 | 2018-09-13 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterkörper und Halbleiterchip |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11340509A (ja) * | 1998-05-25 | 1999-12-10 | Nichia Chem Ind Ltd | 窒化物半導体素子 |
JP2006128227A (ja) * | 2004-10-26 | 2006-05-18 | Mitsubishi Cable Ind Ltd | 窒化物半導体発光素子 |
KR20070015709A (ko) * | 2005-08-01 | 2007-02-06 | 엘지이노텍 주식회사 | 질화물 발광 소자 및 그 제조 방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1450415A3 (en) * | 1993-04-28 | 2005-05-04 | Nichia Corporation | Gallium nitride-based III-V group compound semiconductor device |
EP2273572B1 (en) * | 1998-03-12 | 2015-04-29 | Nichia Corporation | A nitride semiconductor device |
WO2003005459A1 (fr) | 2001-07-04 | 2003-01-16 | Nichia Corporation | Dispositif a semi-conducteurs a base de nitrure |
KR100571818B1 (ko) * | 2003-10-08 | 2006-04-17 | 삼성전자주식회사 | 질화물계 발광소자 및 그 제조방법 |
KR100601945B1 (ko) * | 2004-03-10 | 2006-07-14 | 삼성전자주식회사 | 탑에미트형 질화물계 발광소자 및 그 제조방법 |
JP2006269759A (ja) * | 2005-03-24 | 2006-10-05 | Sharp Corp | 窓構造半導体レーザ装置およびその製造方法 |
KR20070028095A (ko) | 2005-09-07 | 2007-03-12 | 엘지전자 주식회사 | 저저항 발광 다이오드 |
JP2008060331A (ja) | 2006-08-31 | 2008-03-13 | Rohm Co Ltd | 半導体発光素子 |
TWI338387B (en) * | 2007-05-28 | 2011-03-01 | Delta Electronics Inc | Current spreading layer with micro/nano structure, light-emitting diode apparatus and its manufacturing method |
-
2009
- 2009-04-13 WO PCT/KR2009/001886 patent/WO2009126010A2/ko active Application Filing
- 2009-04-13 US US12/937,453 patent/US9543467B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11340509A (ja) * | 1998-05-25 | 1999-12-10 | Nichia Chem Ind Ltd | 窒化物半導体素子 |
JP2006128227A (ja) * | 2004-10-26 | 2006-05-18 | Mitsubishi Cable Ind Ltd | 窒化物半導体発光素子 |
KR20070015709A (ko) * | 2005-08-01 | 2007-02-06 | 엘지이노텍 주식회사 | 질화물 발광 소자 및 그 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
US9543467B2 (en) | 2017-01-10 |
US20110140077A1 (en) | 2011-06-16 |
WO2009126010A2 (ko) | 2009-10-15 |
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