TW200630506A - Electrically conductive fine particles and anisotropic electrically conductive material - Google Patents
Electrically conductive fine particles and anisotropic electrically conductive materialInfo
- Publication number
- TW200630506A TW200630506A TW095102864A TW95102864A TW200630506A TW 200630506 A TW200630506 A TW 200630506A TW 095102864 A TW095102864 A TW 095102864A TW 95102864 A TW95102864 A TW 95102864A TW 200630506 A TW200630506 A TW 200630506A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrically conductive
- fine particles
- conductive fine
- gold plating
- conductive material
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005017441 | 2005-01-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200630506A true TW200630506A (en) | 2006-09-01 |
Family
ID=36740319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095102864A TW200630506A (en) | 2005-01-25 | 2006-01-25 | Electrically conductive fine particles and anisotropic electrically conductive material |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2006080288A1 (ja) |
TW (1) | TW200630506A (ja) |
WO (1) | WO2006080288A1 (ja) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06108102A (ja) * | 1992-09-30 | 1994-04-19 | Mitsubishi Materials Corp | Au被覆Cu粉末およびその製造方法 |
JP2905121B2 (ja) * | 1995-07-19 | 1999-06-14 | ソニーケミカル株式会社 | 異方性導電接着フィルム |
JPH09184077A (ja) * | 1996-01-08 | 1997-07-15 | Mitsubishi Materials Corp | 粉末のめっき方法 |
JP4113403B2 (ja) * | 2002-09-17 | 2008-07-09 | 積水化学工業株式会社 | 導電性微粒子、異方性導電材料及び導電性微粒子の製造方法 |
JP4022750B2 (ja) * | 2002-10-31 | 2007-12-19 | 信越化学工業株式会社 | 導電性粉体及びその製造方法並びに導電性シリコーンゴム組成物 |
JP3978727B2 (ja) * | 2003-03-27 | 2007-09-19 | 三菱マテリアル株式会社 | 耐食性および低温焼結性に優れた銀粘土用金被覆銀粉末および変色することのない低温焼結性に優れた銀粘土 |
JP4247039B2 (ja) * | 2003-04-28 | 2009-04-02 | 日本化学工業株式会社 | 導電性無電解めっき粉体の製造方法 |
JP4261973B2 (ja) * | 2003-04-28 | 2009-05-13 | 日本化学工業株式会社 | 導電性無電解めっき粉体の製造方法 |
-
2006
- 2006-01-24 JP JP2007500505A patent/JPWO2006080288A1/ja active Pending
- 2006-01-24 WO PCT/JP2006/301012 patent/WO2006080288A1/ja not_active Application Discontinuation
- 2006-01-25 TW TW095102864A patent/TW200630506A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2006080288A1 (ja) | 2006-08-03 |
JPWO2006080288A1 (ja) | 2008-06-19 |
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