TW200630506A - Electrically conductive fine particles and anisotropic electrically conductive material - Google Patents

Electrically conductive fine particles and anisotropic electrically conductive material

Info

Publication number
TW200630506A
TW200630506A TW095102864A TW95102864A TW200630506A TW 200630506 A TW200630506 A TW 200630506A TW 095102864 A TW095102864 A TW 095102864A TW 95102864 A TW95102864 A TW 95102864A TW 200630506 A TW200630506 A TW 200630506A
Authority
TW
Taiwan
Prior art keywords
electrically conductive
fine particles
conductive fine
gold plating
conductive material
Prior art date
Application number
TW095102864A
Other languages
Chinese (zh)
Inventor
Takashi Kubota
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200630506A publication Critical patent/TW200630506A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
  • Chemically Coating (AREA)

Abstract

This invention provides electrically conductive fine particles, which, even when used particularly in plasma display panels, have low connection resistance, have high current capacity in a connected state, and have high connection reliability, and an anisotropic electrically conductive material using the electrically conductive fine particles. The electrically conductive fine particles comprise copper metal particles and a gold plating film formed directly on the surface of the copper metal particles by electroless plating, wherein, in the gold plating film, any alloy formed by diffusion does not exist. The gold plating film may be formed by reduction gold plating. The anisotropic electrically conductive material comprises the electrically conductive fine particles dispersed in the resin binder.
TW095102864A 2005-01-25 2006-01-25 Electrically conductive fine particles and anisotropic electrically conductive material TW200630506A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005017441 2005-01-25

Publications (1)

Publication Number Publication Date
TW200630506A true TW200630506A (en) 2006-09-01

Family

ID=36740319

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102864A TW200630506A (en) 2005-01-25 2006-01-25 Electrically conductive fine particles and anisotropic electrically conductive material

Country Status (3)

Country Link
JP (1) JPWO2006080288A1 (en)
TW (1) TW200630506A (en)
WO (1) WO2006080288A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06108102A (en) * 1992-09-30 1994-04-19 Mitsubishi Materials Corp Cu powder coated with au and its production
JP2905121B2 (en) * 1995-07-19 1999-06-14 ソニーケミカル株式会社 Anisotropic conductive adhesive film
JPH09184077A (en) * 1996-01-08 1997-07-15 Mitsubishi Materials Corp Plating method for powder
JP4113403B2 (en) * 2002-09-17 2008-07-09 積水化学工業株式会社 Conductive fine particles, anisotropic conductive material, and method for producing conductive fine particles
JP4022750B2 (en) * 2002-10-31 2007-12-19 信越化学工業株式会社 Conductive powder, method for producing the same, and conductive silicone rubber composition
JP3978727B2 (en) * 2003-03-27 2007-09-19 三菱マテリアル株式会社 Gold-coated silver powder for silver clay with excellent corrosion resistance and low temperature sinterability and silver clay with excellent low temperature sinterability without discoloration
JP4247039B2 (en) * 2003-04-28 2009-04-02 日本化学工業株式会社 Method for producing conductive electroless plating powder
JP4261973B2 (en) * 2003-04-28 2009-05-13 日本化学工業株式会社 Method for producing conductive electroless plating powder

Also Published As

Publication number Publication date
WO2006080288A1 (en) 2006-08-03
JPWO2006080288A1 (en) 2008-06-19

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