TW200632134A - Electrically conductive fine particles, anisotropic electrically conductive material, and electrically conductive connection method - Google Patents

Electrically conductive fine particles, anisotropic electrically conductive material, and electrically conductive connection method

Info

Publication number
TW200632134A
TW200632134A TW095104141A TW95104141A TW200632134A TW 200632134 A TW200632134 A TW 200632134A TW 095104141 A TW095104141 A TW 095104141A TW 95104141 A TW95104141 A TW 95104141A TW 200632134 A TW200632134 A TW 200632134A
Authority
TW
Taiwan
Prior art keywords
electrically conductive
fine particles
conductive fine
plating film
anisotropic
Prior art date
Application number
TW095104141A
Other languages
Chinese (zh)
Inventor
Takashi Kubota
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200632134A publication Critical patent/TW200632134A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
  • Chemically Coating (AREA)

Abstract

This invention provides electrically conductive fine particles, which, even when used particularly in plasma display panels, have low connection resistance and is large in current capacity at the time of connection, further can prevent migration upon heating, and can realize high connection reliability, and anisotropic electrically conductive materials using the electrically conductive fine particles and an electrically conductive connection method. The electrically conductive fine particles (2) comprise particles (2) and films formed by electroless plating on the surface of the particles, that is, a nickel plating film (3), a tin plating film (4), and a bismuth plating film (5) provided in that order, and a silver plating film (6) provided on the outermost surface. The anisotropic electrically conductive material comprises the above electrically conductive fine particles dispersed in a resin binder. The electrically conductive connection method comprises heating the above electrically conductive fine particles on the surface of an electrode to cause metal heat diffusion to form a silver-bismuth-tin alloy film and to allow a part of the softened alloy film to flow on the surface of the electrode, thereby increasing the contact area.
TW095104141A 2005-02-09 2006-02-08 Electrically conductive fine particles, anisotropic electrically conductive material, and electrically conductive connection method TW200632134A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005033497 2005-02-09

Publications (1)

Publication Number Publication Date
TW200632134A true TW200632134A (en) 2006-09-16

Family

ID=36793055

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104141A TW200632134A (en) 2005-02-09 2006-02-08 Electrically conductive fine particles, anisotropic electrically conductive material, and electrically conductive connection method

Country Status (5)

Country Link
JP (1) JP4922916B2 (en)
KR (1) KR20070100967A (en)
CN (1) CN101111903A (en)
TW (1) TW200632134A (en)
WO (1) WO2006085481A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI623604B (en) * 2013-02-19 2018-05-11 迪睿合股份有限公司 Anisotropic conductive adhesive, lighting device and method for producing anisotropic conductive adhesive
TWI826476B (en) * 2018-06-26 2023-12-21 日商力森諾科股份有限公司 Anisotropic conductive film, method for manufacturing same, and method for manufacturing connected structure

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4821396B2 (en) * 2006-03-27 2011-11-24 住友金属鉱山株式会社 Conductive composition and method for forming conductive film
JP5212462B2 (en) * 2008-03-07 2013-06-19 富士通株式会社 Conductive material, conductive paste, circuit board, and semiconductor device
KR101219139B1 (en) * 2009-12-24 2013-01-07 제일모직주식회사 Anisotropic conductive paste and film, circuit connecting structure body comprising the same
JP5485122B2 (en) * 2010-12-10 2014-05-07 株式会社ノリタケカンパニーリミテド Sulfur-containing nickel particles and method for producing the same
WO2014054572A1 (en) * 2012-10-02 2014-04-10 積水化学工業株式会社 Conductive particle, conductive material and connecting structure
CN103215575A (en) * 2013-04-26 2013-07-24 中国矿业大学(北京) Novel welding method for metal nanowire
WO2015114771A1 (en) * 2014-01-30 2015-08-06 千住金属工業株式会社 Cu CORE BALL, SOLDER JOINT, FOAM SOLDER, AND SOLDER PASTE
WO2017135058A1 (en) 2016-02-01 2017-08-10 株式会社村田製作所 Electronic component and method for producing same
CN109727701A (en) * 2017-10-27 2019-05-07 玮锋科技股份有限公司 Eutectic formula anisotropic conductive film and production method
JP7049459B2 (en) * 2017-12-22 2022-04-06 エッカルト ゲゼルシャフト ミット ベシュレンクテル ハフツング Methods for Producing Conductive Particles, Compositions, Articles, and Conductive Particles
CN111261316B (en) * 2020-02-25 2021-08-10 轻工业部南京电光源材料科学研究所 Conductive particle and ultraviolet light curing conductive silver paste containing same
CN113573498A (en) * 2021-06-21 2021-10-29 深圳市信维通信股份有限公司 Low-melting-point conductive paste and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2495732A3 (en) * 2000-08-04 2014-04-16 Sekisui Chemical Co., Ltd. Conductive fine particles, method for plating fine particles, and substrate structure
JP4864195B2 (en) * 2000-08-30 2012-02-01 三井金属鉱業株式会社 Coated copper powder
JP2003068145A (en) * 2001-08-23 2003-03-07 Sekisui Chem Co Ltd Conductive fine particle and conductive connection structure
JP4026812B2 (en) * 2002-07-15 2007-12-26 宇部日東化成株式会社 Conductive particles and method for producing the same
JP4022750B2 (en) * 2002-10-31 2007-12-19 信越化学工業株式会社 Conductive powder, method for producing the same, and conductive silicone rubber composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI623604B (en) * 2013-02-19 2018-05-11 迪睿合股份有限公司 Anisotropic conductive adhesive, lighting device and method for producing anisotropic conductive adhesive
TWI826476B (en) * 2018-06-26 2023-12-21 日商力森諾科股份有限公司 Anisotropic conductive film, method for manufacturing same, and method for manufacturing connected structure

Also Published As

Publication number Publication date
JP4922916B2 (en) 2012-04-25
CN101111903A (en) 2008-01-23
JPWO2006085481A1 (en) 2008-06-26
KR20070100967A (en) 2007-10-15
WO2006085481A1 (en) 2006-08-17

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