TW200632134A - Electrically conductive fine particles, anisotropic electrically conductive material, and electrically conductive connection method - Google Patents
Electrically conductive fine particles, anisotropic electrically conductive material, and electrically conductive connection methodInfo
- Publication number
- TW200632134A TW200632134A TW095104141A TW95104141A TW200632134A TW 200632134 A TW200632134 A TW 200632134A TW 095104141 A TW095104141 A TW 095104141A TW 95104141 A TW95104141 A TW 95104141A TW 200632134 A TW200632134 A TW 200632134A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrically conductive
- fine particles
- conductive fine
- plating film
- anisotropic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
Abstract
This invention provides electrically conductive fine particles, which, even when used particularly in plasma display panels, have low connection resistance and is large in current capacity at the time of connection, further can prevent migration upon heating, and can realize high connection reliability, and anisotropic electrically conductive materials using the electrically conductive fine particles and an electrically conductive connection method. The electrically conductive fine particles (2) comprise particles (2) and films formed by electroless plating on the surface of the particles, that is, a nickel plating film (3), a tin plating film (4), and a bismuth plating film (5) provided in that order, and a silver plating film (6) provided on the outermost surface. The anisotropic electrically conductive material comprises the above electrically conductive fine particles dispersed in a resin binder. The electrically conductive connection method comprises heating the above electrically conductive fine particles on the surface of an electrode to cause metal heat diffusion to form a silver-bismuth-tin alloy film and to allow a part of the softened alloy film to flow on the surface of the electrode, thereby increasing the contact area.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005033497 | 2005-02-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200632134A true TW200632134A (en) | 2006-09-16 |
Family
ID=36793055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095104141A TW200632134A (en) | 2005-02-09 | 2006-02-08 | Electrically conductive fine particles, anisotropic electrically conductive material, and electrically conductive connection method |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4922916B2 (en) |
KR (1) | KR20070100967A (en) |
CN (1) | CN101111903A (en) |
TW (1) | TW200632134A (en) |
WO (1) | WO2006085481A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI623604B (en) * | 2013-02-19 | 2018-05-11 | 迪睿合股份有限公司 | Anisotropic conductive adhesive, lighting device and method for producing anisotropic conductive adhesive |
TWI826476B (en) * | 2018-06-26 | 2023-12-21 | 日商力森諾科股份有限公司 | Anisotropic conductive film, method for manufacturing same, and method for manufacturing connected structure |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4821396B2 (en) * | 2006-03-27 | 2011-11-24 | 住友金属鉱山株式会社 | Conductive composition and method for forming conductive film |
JP5212462B2 (en) | 2008-03-07 | 2013-06-19 | 富士通株式会社 | Conductive material, conductive paste, circuit board, and semiconductor device |
KR101219139B1 (en) * | 2009-12-24 | 2013-01-07 | 제일모직주식회사 | Anisotropic conductive paste and film, circuit connecting structure body comprising the same |
JP5485122B2 (en) * | 2010-12-10 | 2014-05-07 | 株式会社ノリタケカンパニーリミテド | Sulfur-containing nickel particles and method for producing the same |
JP5636118B2 (en) * | 2012-10-02 | 2014-12-03 | 積水化学工業株式会社 | Conductive particles, conductive materials, and connection structures |
CN103215575A (en) * | 2013-04-26 | 2013-07-24 | 中国矿业大学(北京) | Novel welding method for metal nanowire |
JP5585750B1 (en) * | 2014-01-30 | 2014-09-10 | 千住金属工業株式会社 | Cu core ball, solder joint, foam solder, and solder paste |
JP6481777B2 (en) | 2016-02-01 | 2019-03-13 | 株式会社村田製作所 | Electronic component and manufacturing method thereof |
CN109727701A (en) * | 2017-10-27 | 2019-05-07 | 玮锋科技股份有限公司 | Eutectic formula anisotropic conductive film and production method |
KR102388958B1 (en) * | 2017-12-22 | 2022-04-22 | 엑카르트 게엠베하 | Electrically Conductive Particles, Compositions, Articles and Methods of Making Electrically Conductive Particles |
CN111261316B (en) * | 2020-02-25 | 2021-08-10 | 轻工业部南京电光源材料科学研究所 | Conductive particle and ultraviolet light curing conductive silver paste containing same |
CN113573498A (en) * | 2021-06-21 | 2021-10-29 | 深圳市信维通信股份有限公司 | Low-melting-point conductive paste and preparation method thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2495732A3 (en) * | 2000-08-04 | 2014-04-16 | Sekisui Chemical Co., Ltd. | Conductive fine particles, method for plating fine particles, and substrate structure |
JP4864195B2 (en) * | 2000-08-30 | 2012-02-01 | 三井金属鉱業株式会社 | Coated copper powder |
JP2003068145A (en) * | 2001-08-23 | 2003-03-07 | Sekisui Chem Co Ltd | Conductive fine particle and conductive connection structure |
JP4026812B2 (en) * | 2002-07-15 | 2007-12-26 | 宇部日東化成株式会社 | Conductive particles and method for producing the same |
JP4022750B2 (en) * | 2002-10-31 | 2007-12-19 | 信越化学工業株式会社 | Conductive powder, method for producing the same, and conductive silicone rubber composition |
-
2006
- 2006-02-03 CN CNA2006800034849A patent/CN101111903A/en active Pending
- 2006-02-03 JP JP2007502581A patent/JP4922916B2/en active Active
- 2006-02-03 WO PCT/JP2006/301836 patent/WO2006085481A1/en not_active Application Discontinuation
- 2006-02-03 KR KR1020077018198A patent/KR20070100967A/en not_active Application Discontinuation
- 2006-02-08 TW TW095104141A patent/TW200632134A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI623604B (en) * | 2013-02-19 | 2018-05-11 | 迪睿合股份有限公司 | Anisotropic conductive adhesive, lighting device and method for producing anisotropic conductive adhesive |
TWI826476B (en) * | 2018-06-26 | 2023-12-21 | 日商力森諾科股份有限公司 | Anisotropic conductive film, method for manufacturing same, and method for manufacturing connected structure |
Also Published As
Publication number | Publication date |
---|---|
JP4922916B2 (en) | 2012-04-25 |
WO2006085481A1 (en) | 2006-08-17 |
KR20070100967A (en) | 2007-10-15 |
CN101111903A (en) | 2008-01-23 |
JPWO2006085481A1 (en) | 2008-06-26 |
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