TW200617098A - Method for manufacturing multilayer printed wiring board and multilayer printed wiring board obtained by the manufacturing method - Google Patents

Method for manufacturing multilayer printed wiring board and multilayer printed wiring board obtained by the manufacturing method

Info

Publication number
TW200617098A
TW200617098A TW094126954A TW94126954A TW200617098A TW 200617098 A TW200617098 A TW 200617098A TW 094126954 A TW094126954 A TW 094126954A TW 94126954 A TW94126954 A TW 94126954A TW 200617098 A TW200617098 A TW 200617098A
Authority
TW
Taiwan
Prior art keywords
wiring board
printed wiring
multilayer printed
conductivity type
type metal
Prior art date
Application number
TW094126954A
Other languages
English (en)
Other versions
TWI302159B (zh
Inventor
Kensuke Nakamura
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200617098A publication Critical patent/TW200617098A/zh
Application granted granted Critical
Publication of TWI302159B publication Critical patent/TWI302159B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW094126954A 2004-08-10 2005-08-09 Method for manufacturing multilayer printed wiring board and multilayer printed wiring board obtained by the manufacturing method TW200617098A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004233591 2004-08-10

Publications (2)

Publication Number Publication Date
TW200617098A true TW200617098A (en) 2006-06-01
TWI302159B TWI302159B (zh) 2008-10-21

Family

ID=35839355

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094126954A TW200617098A (en) 2004-08-10 2005-08-09 Method for manufacturing multilayer printed wiring board and multilayer printed wiring board obtained by the manufacturing method

Country Status (6)

Country Link
US (1) US8062539B2 (zh)
JP (1) JPWO2006016586A1 (zh)
KR (1) KR20070042560A (zh)
CN (1) CN101002516A (zh)
TW (1) TW200617098A (zh)
WO (1) WO2006016586A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8022311B2 (en) 2007-03-02 2011-09-20 Samsung Electro-Mechanics Co., Ltd. Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same
TWI622109B (zh) * 2016-07-07 2018-04-21 欣興電子股份有限公司 封裝基板及其製造方法
TWI731894B (zh) * 2015-11-19 2021-07-01 日商三井金屬鑛業股份有限公司 具有介電質層之印刷電路板之製造方法

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JP4736703B2 (ja) * 2005-10-14 2011-07-27 宇部興産株式会社 銅配線ポリイミドフィルムの製造方法
JP4755209B2 (ja) 2007-02-01 2011-08-24 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電磁気バンドギャップ構造物及び印刷回路基板
KR100851075B1 (ko) 2007-04-30 2008-08-12 삼성전기주식회사 전자기 밴드갭 구조물 및 인쇄회로기판
WO2009008471A1 (ja) * 2007-07-10 2009-01-15 Mitsui Mining & Smelting Co., Ltd. 誘電層付銅箔
KR100882266B1 (ko) * 2007-11-07 2009-02-06 삼성전기주식회사 캐패시터 내장형 인쇄회로기판의 제조방법
JP2009070938A (ja) * 2007-09-12 2009-04-02 Cmk Corp 部品内蔵型多層プリント配線板及びその製造方法
TW200919676A (en) * 2007-10-17 2009-05-01 Phoenix Prec Technology Corp Packaging substrate structure having capacitor embedded therein and method for manufacturing the same
US8510936B2 (en) * 2009-12-29 2013-08-20 Subtron Technology Co., Ltd. Manufacturing method of package carrier
KR20120026870A (ko) 2010-09-10 2012-03-20 삼성전자주식회사 회로 기판 및 이를 포함하는 반도체 모듈
CN103140050B (zh) * 2011-12-05 2015-07-15 深南电路有限公司 埋容线路板的加工方法
US8628636B2 (en) * 2012-01-13 2014-01-14 Advance Materials Corporation Method of manufacturing a package substrate
CN103298274B (zh) * 2012-02-24 2016-02-24 北大方正集团有限公司 一种埋容印制电路板的制作方法以及埋容印制电路板
CN105637987A (zh) * 2013-10-29 2016-06-01 京瓷株式会社 布线基板、使用了该布线基板的安装结构体以及层叠片
JP6649770B2 (ja) * 2014-02-21 2020-02-19 三井金属鉱業株式会社 内蔵キャパシタ層形成用銅張積層板、多層プリント配線板及び多層プリント配線板の製造方法
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
CN107507819B (zh) * 2017-08-11 2019-12-20 华进半导体封装先导技术研发中心有限公司 一种基于电容芯板的无源器件集成方法
JP7482602B2 (ja) * 2019-02-20 2024-05-14 Tdk株式会社 薄膜キャパシタ内蔵基板及びその製造方法
JP7455516B2 (ja) * 2019-03-29 2024-03-26 Tdk株式会社 素子内蔵基板およびその製造方法
CN110312366A (zh) * 2019-07-03 2019-10-08 安捷利电子科技（苏州）有限公司 埋容材料及其制备工艺、埋容电路板及其制作工艺
CN113012902B (zh) * 2021-02-25 2023-03-14 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) 一种平面电感器及其制造方法
CN112739041B (zh) * 2021-04-01 2021-07-02 武汉宏乔科技有限公司 一种基于向量乱流法的化学蚀刻装置及方法
CN113891546B (zh) * 2021-11-02 2023-05-16 中国电子科技集团公司第二十九研究所 一种嵌入增强结构微流道的印制电路板及其制备方法
WO2023189300A1 (ja) * 2022-03-29 2023-10-05 三井金属鉱業株式会社 キャパシタ内蔵型プリント配線板及び多層プリント配線板の製造方法
JP2023170250A (ja) * 2022-05-18 2023-12-01 日本発條株式会社 回路基板の製造方法

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JP2004134421A (ja) * 2002-10-08 2004-04-30 Nec Tokin Corp コンデンサ内蔵配線基板及びその製造方法
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8022311B2 (en) 2007-03-02 2011-09-20 Samsung Electro-Mechanics Co., Ltd. Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same
TWI731894B (zh) * 2015-11-19 2021-07-01 日商三井金屬鑛業股份有限公司 具有介電質層之印刷電路板之製造方法
TWI622109B (zh) * 2016-07-07 2018-04-21 欣興電子股份有限公司 封裝基板及其製造方法

Also Published As

Publication number Publication date
KR20070042560A (ko) 2007-04-23
US20080257480A1 (en) 2008-10-23
JPWO2006016586A1 (ja) 2008-05-01
CN101002516A (zh) 2007-07-18
TWI302159B (zh) 2008-10-21
US8062539B2 (en) 2011-11-22
WO2006016586A1 (ja) 2006-02-16

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