TW200614548A - Light-emitting device - Google Patents

Light-emitting device

Info

Publication number
TW200614548A
TW200614548A TW094121749A TW94121749A TW200614548A TW 200614548 A TW200614548 A TW 200614548A TW 094121749 A TW094121749 A TW 094121749A TW 94121749 A TW94121749 A TW 94121749A TW 200614548 A TW200614548 A TW 200614548A
Authority
TW
Taiwan
Prior art keywords
light
sealing layer
emitting element
covering
emitting device
Prior art date
Application number
TW094121749A
Other languages
English (en)
Chinese (zh)
Inventor
Toshifumi Ogata
Noriyasu Tanimoto
Hideo Nagai
Kiyoshi Takahashi
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of TW200614548A publication Critical patent/TW200614548A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
TW094121749A 2004-07-09 2005-06-29 Light-emitting device TW200614548A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004203486 2004-07-09
JP2005049321 2005-02-24

Publications (1)

Publication Number Publication Date
TW200614548A true TW200614548A (en) 2006-05-01

Family

ID=34971925

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121749A TW200614548A (en) 2004-07-09 2005-06-29 Light-emitting device

Country Status (5)

Country Link
US (1) US20070182323A1 (https=)
EP (1) EP1766696B1 (https=)
JP (1) JP2008506246A (https=)
TW (1) TW200614548A (https=)
WO (1) WO2006006544A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400819B (zh) * 2006-07-24 2013-07-01 三星電子股份有限公司 用於線光源之發光二極體模組
TWI418053B (zh) * 2006-08-09 2013-12-01 松下電器產業股份有限公司 發光裝置
TWI455364B (en) * 2011-06-01 2014-10-01 Light emitting diode package with filter
TWI880586B (zh) * 2024-01-12 2025-04-11 榮創能源科技股份有限公司 Led封裝結構及顯示設備

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WO2006059828A1 (en) 2004-09-10 2006-06-08 Seoul Semiconductor Co., Ltd. Light emitting diode package having multiple molding resins
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JP2007201354A (ja) * 2006-01-30 2007-08-09 Matsushita Electric Ind Co Ltd 発光モジュール
JP5268082B2 (ja) * 2006-02-22 2013-08-21 シチズン電子株式会社 光半導体装置
KR100738933B1 (ko) * 2006-03-17 2007-07-12 (주)대신엘이디 조명용 ｌｅｄ 모듈
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US7989823B2 (en) * 2006-06-08 2011-08-02 Hong-Yuan Technology Co., Ltd. Light emitting system, light emitting apparatus and forming method thereof
KR101258227B1 (ko) 2006-08-29 2013-04-25 서울반도체 주식회사 발광 소자
KR100828900B1 (ko) 2006-09-04 2008-05-09 엘지이노텍 주식회사 발광 다이오드 패키지 및 그 제조방법
DE102006045704A1 (de) 2006-09-27 2008-04-03 Osram Opto Semiconductors Gmbh Optisches Element und optoelektronisches Bauelement mit solch einem optischen Element
WO2008043207A1 (fr) * 2006-10-08 2008-04-17 Hong-Yuan Technology Co., Ltd. Système électroluminescent, appareil électroluminescent et procédé de formation associé
JP2008159708A (ja) * 2006-12-21 2008-07-10 Matsushita Electric Works Ltd 発光装置
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DE102008021661A1 (de) * 2008-04-30 2009-11-05 Ledon Lighting Jennersdorf Gmbh LED-Modul mit Rahmen und Leiterplatte
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TWI363907B (en) 2008-08-05 2012-05-11 Au Optronics Corp Backlight module and light emitting diode thereof
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JP5404009B2 (ja) * 2008-11-20 2014-01-29 シャープ株式会社 発光装置
JP5418592B2 (ja) * 2009-06-22 2014-02-19 日亜化学工業株式会社 発光装置
US20110031516A1 (en) * 2009-08-07 2011-02-10 Koninklijke Philips Electronics N.V. Led with silicone layer and laminated remote phosphor layer
KR101039930B1 (ko) * 2009-10-23 2011-06-09 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
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KR101020998B1 (ko) * 2009-11-12 2011-03-09 엘지이노텍 주식회사 발광소자 및 그 제조방법
JP2011155187A (ja) * 2010-01-28 2011-08-11 Konica Minolta Opto Inc 発光ダイオードユニットの製造方法
JP2011155188A (ja) * 2010-01-28 2011-08-11 Konica Minolta Opto Inc 発光ダイオードユニットの製造方法
WO2011149052A1 (ja) * 2010-05-27 2011-12-01 京セラ株式会社 発光装置および照明装置
JP5917796B2 (ja) * 2010-07-14 2016-05-18 三菱電機株式会社 Ｌｅｄパッケージ装置
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US8664624B2 (en) 2010-09-30 2014-03-04 Performance Indicator Llc Illumination delivery system for generating sustained secondary emission
WO2012044887A1 (en) * 2010-09-30 2012-04-05 Performance Indicator, Llc. Photolytically and environmentally stable multilayer structure for high efficiency electromagentic energy conversion and sustained secondary emission
US20120097985A1 (en) * 2010-10-21 2012-04-26 Wen-Huang Liu Light Emitting Diode (LED) Package And Method Of Fabrication
WO2012147650A1 (ja) * 2011-04-27 2012-11-01 シャープ株式会社 Ｌｅｄモジュール、バックライトユニット及び液晶表示装置
DE102011100028A1 (de) * 2011-04-29 2012-10-31 Osram Opto Semiconductors Gmbh Bauelement und Verfahren zur Herstellung eines Bauelements
US9269878B2 (en) 2011-05-27 2016-02-23 Lg Innotek Co., Ltd. Light emitting device and light emitting apparatus
DE102011105010A1 (de) * 2011-06-20 2012-12-20 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
US10686107B2 (en) * 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
TW201312807A (zh) 2011-07-21 2013-03-16 克里股份有限公司 光發射器元件封裝與部件及改良化學抵抗性的方法與相關方法
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JP6221418B2 (ja) * 2013-07-01 2017-11-01 セイコーエプソン株式会社 発光装置および電子機器
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400819B (zh) * 2006-07-24 2013-07-01 三星電子股份有限公司 用於線光源之發光二極體模組
TWI418053B (zh) * 2006-08-09 2013-12-01 松下電器產業股份有限公司 發光裝置
TWI455364B (en) * 2011-06-01 2014-10-01 Light emitting diode package with filter
TWI880586B (zh) * 2024-01-12 2025-04-11 榮創能源科技股份有限公司 Led封裝結構及顯示設備

Also Published As

Publication number Publication date
EP1766696A1 (en) 2007-03-28
JP2008506246A (ja) 2008-02-28
EP1766696B1 (en) 2014-03-05
US20070182323A1 (en) 2007-08-09
WO2006006544A1 (en) 2006-01-19

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