ATE511705T1 - Leuchtdioden mit modifikationen zur subträger bonding - Google Patents

Leuchtdioden mit modifikationen zur subträger bonding

Info

Publication number
ATE511705T1
ATE511705T1 AT02752514T AT02752514T ATE511705T1 AT E511705 T1 ATE511705 T1 AT E511705T1 AT 02752514 T AT02752514 T AT 02752514T AT 02752514 T AT02752514 T AT 02752514T AT E511705 T1 ATE511705 T1 AT E511705T1
Authority
AT
Austria
Prior art keywords
layer
opposite
epitaxial region
substrate
bonding
Prior art date
Application number
AT02752514T
Other languages
English (en)
Inventor
David Slater
Bradley Williams
Peter Andrews
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/057,821 external-priority patent/US6791119B2/en
Application filed by Cree Inc filed Critical Cree Inc
Application granted granted Critical
Publication of ATE511705T1 publication Critical patent/ATE511705T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/835—Reflective materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12032—Schottky diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Die Bonding (AREA)
AT02752514T 2001-07-23 2002-07-23 Leuchtdioden mit modifikationen zur subträger bonding ATE511705T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US30723401P 2001-07-23 2001-07-23
US30731101P 2001-07-23 2001-07-23
US10/057,821 US6791119B2 (en) 2001-02-01 2002-01-25 Light emitting diodes including modifications for light extraction
US35294102P 2002-01-30 2002-01-30
PCT/US2002/023266 WO2003010817A2 (en) 2001-07-23 2002-07-23 Light emitting diodes including modifications for submount bonding and manufacturing methods therefor

Publications (1)

Publication Number Publication Date
ATE511705T1 true ATE511705T1 (de) 2011-06-15

Family

ID=27489930

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02752514T ATE511705T1 (de) 2001-07-23 2002-07-23 Leuchtdioden mit modifikationen zur subträger bonding

Country Status (10)

Country Link
US (2) US6740906B2 (de)
EP (2) EP2320484A1 (de)
JP (1) JP4654372B2 (de)
KR (1) KR101028965B1 (de)
CN (1) CN1330008C (de)
AT (1) ATE511705T1 (de)
AU (1) AU2002355138A1 (de)
CA (1) CA2453581A1 (de)
TW (1) TW563262B (de)
WO (1) WO2003010817A2 (de)

Families Citing this family (181)

* Cited by examiner, † Cited by third party
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