TW200614419A - Semiconductor devices including high-k dielectric materials and methods of forming the same - Google Patents

Semiconductor devices including high-k dielectric materials and methods of forming the same

Info

Publication number
TW200614419A
TW200614419A TW094132215A TW94132215A TW200614419A TW 200614419 A TW200614419 A TW 200614419A TW 094132215 A TW094132215 A TW 094132215A TW 94132215 A TW94132215 A TW 94132215A TW 200614419 A TW200614419 A TW 200614419A
Authority
TW
Taiwan
Prior art keywords
layer
conductive layer
dielectric
methods
forming
Prior art date
Application number
TW094132215A
Other languages
English (en)
Other versions
TWI378530B (en
Inventor
Sun-Pil Youn
Chang-Won Lee
Woong-Hee Sohn
Gil-Heyun Choi
Jong-Ryeol Yoo
Dong-Chan Lim
Jae-Hwa Park
Byung-Hak Lee
Hee-Sook Park
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of TW200614419A publication Critical patent/TW200614419A/zh
Application granted granted Critical
Publication of TWI378530B publication Critical patent/TWI378530B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/823437—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
    • H01L21/82345—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes gate conductors with different gate conductor materials or different gate conductor implants, e.g. dual gate structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
    • H10B41/42—Simultaneous manufacture of periphery and memory cells
    • H10B41/49—Simultaneous manufacture of periphery and memory cells comprising different types of peripheral transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
TW094132215A 2004-09-16 2005-09-16 Semiconductor devices including high-k dielectric materials and methods of forming the same TWI378530B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040074074A KR100647482B1 (ko) 2004-09-16 2004-09-16 반도체 장치 및 그 제조 방법

Publications (2)

Publication Number Publication Date
TW200614419A true TW200614419A (en) 2006-05-01
TWI378530B TWI378530B (en) 2012-12-01

Family

ID=36164723

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094132215A TWI378530B (en) 2004-09-16 2005-09-16 Semiconductor devices including high-k dielectric materials and methods of forming the same

Country Status (5)

Country Link
US (1) US7696552B2 (zh)
JP (1) JP4981285B2 (zh)
KR (1) KR100647482B1 (zh)
CN (1) CN1767205A (zh)
TW (1) TWI378530B (zh)

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JP4744885B2 (ja) * 2005-01-18 2011-08-10 株式会社東芝 半導体装置の製造方法
JP5032145B2 (ja) 2006-04-14 2012-09-26 株式会社東芝 半導体装置
KR100843055B1 (ko) * 2006-08-17 2008-07-01 주식회사 하이닉스반도체 플래쉬 메모리 소자 및 그의 제조방법
KR100800379B1 (ko) * 2006-08-29 2008-02-01 삼성전자주식회사 비휘발성 메모리 소자의 게이트 제조방법
KR100971430B1 (ko) * 2006-09-28 2010-07-21 주식회사 하이닉스반도체 반도체 소자의 캐패시터 및 그 제조 방법
KR100757323B1 (ko) * 2006-09-29 2007-09-11 삼성전자주식회사 전하 트랩형 비휘발성 메모리 장치 및 그 제조 방법
KR100762260B1 (ko) * 2006-10-20 2007-10-01 삼성전자주식회사 비휘발성 메모리 장치 및 그 형성 방법
JP4564511B2 (ja) * 2007-04-16 2010-10-20 株式会社東芝 半導体装置及びその製造方法
US8120091B2 (en) 2007-05-29 2012-02-21 Samsung Electronics Co., Ltd. Non-volatile memory devices including a floating gate and methods of manufacturing the same
KR100871545B1 (ko) * 2007-06-25 2008-12-01 주식회사 동부하이텍 플래쉬 메모리 소자 및 그 제조 방법
JP2009283827A (ja) * 2008-05-26 2009-12-03 Toshiba Corp 半導体記憶装置およびその製造方法
US8008707B2 (en) 2007-12-14 2011-08-30 Kabushiki Kaisha Toshiba Nonvolatile semiconductor memory device provided with charge storage layer in memory cell
US8692310B2 (en) * 2009-02-09 2014-04-08 Spansion Llc Gate fringing effect based channel formation for semiconductor device
JP2010199320A (ja) * 2009-02-25 2010-09-09 Tdk Corp シリコンスピン伝導素子の製造方法及びシリコンスピン伝導素子
KR101627509B1 (ko) * 2010-03-04 2016-06-08 삼성전자주식회사 식각액, 식각액을 사용한 게이트 절연막의 형성 방법 및 식각액을 사용한 반도체 소자의 제조 방법
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US8846485B2 (en) * 2010-07-15 2014-09-30 Powerchip Technology Corporation Method for fabricating bottom electrode of capacitors of DRAM
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WO2019084883A1 (zh) * 2017-11-02 2019-05-09 成都锐成芯微科技股份有限公司 非挥发性存储器的制造方法

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Also Published As

Publication number Publication date
KR100647482B1 (ko) 2006-11-23
US7696552B2 (en) 2010-04-13
JP2006086525A (ja) 2006-03-30
TWI378530B (en) 2012-12-01
US20060057794A1 (en) 2006-03-16
KR20060025326A (ko) 2006-03-21
JP4981285B2 (ja) 2012-07-18
CN1767205A (zh) 2006-05-03

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Legal Events

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