TW200609263A - Epoxy resin composition and semiconductor device - Google Patents
Epoxy resin composition and semiconductor deviceInfo
- Publication number
- TW200609263A TW200609263A TW094107659A TW94107659A TW200609263A TW 200609263 A TW200609263 A TW 200609263A TW 094107659 A TW094107659 A TW 094107659A TW 94107659 A TW94107659 A TW 94107659A TW 200609263 A TW200609263 A TW 200609263A
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- resin composition
- semiconductor device
- organopolysiloxane
- carboxyl group
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 5
- 229920000647 polyepoxide Polymers 0.000 title abstract 5
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000000203 mixture Substances 0.000 title abstract 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 abstract 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 2
- 238000005538 encapsulation Methods 0.000 abstract 2
- 229920001296 polysiloxane Polymers 0.000 abstract 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- 239000000194 fatty acid Substances 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
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- H01L2924/01078—Platinum [Pt]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004075414 | 2004-03-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200609263A true TW200609263A (en) | 2006-03-16 |
TWI398461B TWI398461B (zh) | 2013-06-11 |
Family
ID=34975543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94107659A TWI398461B (zh) | 2004-03-16 | 2005-03-14 | 環氧樹脂組成物及半導體裝置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20070196664A1 (zh) |
JP (1) | JP5338028B2 (zh) |
KR (1) | KR101149453B1 (zh) |
CN (1) | CN100519619C (zh) |
MY (1) | MY159179A (zh) |
SG (2) | SG151268A1 (zh) |
TW (1) | TWI398461B (zh) |
WO (1) | WO2005087834A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI637470B (zh) * | 2016-04-19 | 2018-10-01 | 東芝股份有限公司 | 半導體封裝及其之製造方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4590899B2 (ja) * | 2004-03-30 | 2010-12-01 | 住友ベークライト株式会社 | 金型離型回復樹脂組成物及び半導体装置の製造方法 |
JP4765310B2 (ja) * | 2004-12-24 | 2011-09-07 | 住友ベークライト株式会社 | 樹脂封止型半導体装置の製造方法 |
JP4973146B2 (ja) * | 2006-11-20 | 2012-07-11 | 住友ベークライト株式会社 | エポキシ樹脂組成物、封止用エポキシ樹脂組成物及び電子部品装置 |
JP5024073B2 (ja) * | 2007-02-16 | 2012-09-12 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP4930145B2 (ja) * | 2007-03-28 | 2012-05-16 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP5157473B2 (ja) * | 2007-03-28 | 2013-03-06 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP4973322B2 (ja) * | 2007-06-04 | 2012-07-11 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP5169285B2 (ja) * | 2007-08-22 | 2013-03-27 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP5169287B2 (ja) * | 2007-09-21 | 2013-03-27 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP5169288B2 (ja) * | 2007-09-21 | 2013-03-27 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
KR101309820B1 (ko) * | 2010-12-29 | 2013-09-23 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 |
US9902851B2 (en) * | 2012-10-19 | 2018-02-27 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, laminate, and printed wiring board |
WO2014061811A1 (ja) * | 2012-10-19 | 2014-04-24 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、積層板、金属箔張積層板及びプリント配線板 |
KR102112865B1 (ko) * | 2017-11-06 | 2020-05-19 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6011973B2 (ja) * | 1981-10-21 | 1985-03-29 | ト−レ・シリコ−ン株式会社 | 成形用エポキシ樹脂組成物 |
JPH01319529A (ja) * | 1988-06-20 | 1989-12-25 | Denki Kagaku Kogyo Kk | エポキシ樹脂組成物 |
JP2987180B2 (ja) * | 1990-08-29 | 1999-12-06 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性エポキシ樹脂組成物 |
JP3012358B2 (ja) * | 1991-04-30 | 2000-02-21 | 東レ・ダウコーニング・シリコーン株式会社 | 加熱硬化性エポキシ樹脂組成物 |
JPH0669379A (ja) * | 1991-05-13 | 1994-03-11 | Nitto Denko Corp | 半導体装置 |
JP2000044774A (ja) * | 1998-07-28 | 2000-02-15 | Toray Ind Inc | 半導体封止用エポキシ樹脂組成物および半導体装置 |
JP2000103938A (ja) * | 1998-09-25 | 2000-04-11 | Matsushita Electric Works Ltd | 封止用のエポキシ樹脂組成物および半導体装置 |
US6610406B2 (en) * | 2000-03-23 | 2003-08-26 | Henkel Locktite Corporation | Flame retardant molding compositions |
JP4411760B2 (ja) * | 2000-09-06 | 2010-02-10 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP4770024B2 (ja) * | 2001-01-17 | 2011-09-07 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP5008222B2 (ja) * | 2001-01-26 | 2012-08-22 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP2003105057A (ja) * | 2001-09-28 | 2003-04-09 | Toray Ind Inc | エポキシ樹脂組成物及び半導体装置 |
JP2003252960A (ja) * | 2002-03-05 | 2003-09-10 | Toray Ind Inc | エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置 |
-
2005
- 2005-03-14 TW TW94107659A patent/TWI398461B/zh not_active IP Right Cessation
- 2005-03-14 MY MYPI20051065A patent/MY159179A/en unknown
- 2005-03-15 CN CNB2005800084595A patent/CN100519619C/zh active Active
- 2005-03-15 SG SG200901749-2A patent/SG151268A1/en unknown
- 2005-03-15 WO PCT/JP2005/004555 patent/WO2005087834A1/ja active Application Filing
- 2005-03-15 US US10/592,643 patent/US20070196664A1/en not_active Abandoned
- 2005-03-15 SG SG2012066528A patent/SG184731A1/en unknown
- 2005-03-15 KR KR1020067019468A patent/KR101149453B1/ko active IP Right Grant
- 2005-03-15 JP JP2006511039A patent/JP5338028B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI637470B (zh) * | 2016-04-19 | 2018-10-01 | 東芝股份有限公司 | 半導體封裝及其之製造方法 |
US10163765B2 (en) | 2016-04-19 | 2018-12-25 | Kabushiki Kaisha Toshiba | Semiconductor device that includes a molecular bonding layer for bonding of elements |
Also Published As
Publication number | Publication date |
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WO2005087834A1 (ja) | 2005-09-22 |
JPWO2005087834A1 (ja) | 2008-01-24 |
KR101149453B1 (ko) | 2012-05-25 |
US20070196664A1 (en) | 2007-08-23 |
JP5338028B2 (ja) | 2013-11-13 |
SG184731A1 (en) | 2012-10-30 |
MY159179A (en) | 2016-12-30 |
SG151268A1 (en) | 2009-04-30 |
CN1934156A (zh) | 2007-03-21 |
KR20070012655A (ko) | 2007-01-26 |
TWI398461B (zh) | 2013-06-11 |
CN100519619C (zh) | 2009-07-29 |
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