TW200536618A - Surface treatment device for substrate - Google Patents

Surface treatment device for substrate Download PDF

Info

Publication number
TW200536618A
TW200536618A TW93115206A TW93115206A TW200536618A TW 200536618 A TW200536618 A TW 200536618A TW 93115206 A TW93115206 A TW 93115206A TW 93115206 A TW93115206 A TW 93115206A TW 200536618 A TW200536618 A TW 200536618A
Authority
TW
Taiwan
Prior art keywords
base plate
grooves
surface treatment
conveying
conveying roller
Prior art date
Application number
TW93115206A
Other languages
English (en)
Chinese (zh)
Inventor
Kisaburo Niiyama
Original Assignee
Tokyo Kakoki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Kakoki Co Ltd filed Critical Tokyo Kakoki Co Ltd
Publication of TW200536618A publication Critical patent/TW200536618A/zh

Links

Landscapes

  • Manufacturing Of Printed Circuit Boards (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW93115206A 2004-05-10 2004-05-28 Surface treatment device for substrate TW200536618A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004139708A JP2005322779A (ja) 2004-05-10 2004-05-10 基板材の表面処理装置

Publications (1)

Publication Number Publication Date
TW200536618A true TW200536618A (en) 2005-11-16

Family

ID=35350067

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93115206A TW200536618A (en) 2004-05-10 2004-05-28 Surface treatment device for substrate

Country Status (3)

Country Link
JP (1) JP2005322779A (ja)
CN (1) CN1697597A (ja)
TW (1) TW200536618A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI776780B (zh) * 2022-02-11 2022-09-01 金協鑫科技股份有限公司 表面處理設備

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005055731B4 (de) * 2005-11-23 2020-01-02 Volkswagen Ag Tragrollenanordnung und Transporteinrichtung
JP5260370B2 (ja) * 2009-03-19 2013-08-14 住友精密工業株式会社 基板処理装置
CN102161261A (zh) * 2010-12-18 2011-08-24 江苏锐毕利实业有限公司 挠性印刷电路板多工位喷印系统
CN105252818A (zh) * 2015-09-15 2016-01-20 无锡鼎茂机械制造有限公司 制袋机用塑料薄膜导料机构
CN107333395B (zh) * 2017-08-17 2023-05-05 广东省华锐高新材料股份有限公司 一种铝基板清洁铺装生产线
CN108495461B (zh) * 2018-02-10 2019-10-25 嘉兴市上村电子有限公司 一种旋转平移顶出式的线路板热压机
CN109648999B (zh) * 2018-12-13 2021-03-26 杭州国瑞印务有限公司 一种门票的印刷系统
KR102031743B1 (ko) * 2019-03-26 2019-10-15 비욘드솔루션 주식회사 기판 이송을 위한 브릿지 어셈블리
KR102041324B1 (ko) * 2019-03-26 2019-11-07 비욘드솔루션 주식회사 기판 이송을 위한 가이드 핀
KR102031747B1 (ko) * 2019-04-05 2019-10-15 비욘드솔루션 주식회사 기판 이송을 위한 가이드 핀 및 브릿지를 구비한 기판 이송 시스템
JP7056972B2 (ja) * 2020-06-04 2022-04-19 株式会社ケミトロン 基板処理装置
CN112607300B (zh) * 2020-12-22 2023-04-14 惠州市富丽电子有限公司 一种八字输送带分离错位收集设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI776780B (zh) * 2022-02-11 2022-09-01 金協鑫科技股份有限公司 表面處理設備

Also Published As

Publication number Publication date
JP2005322779A (ja) 2005-11-17
CN1697597A (zh) 2005-11-16

Similar Documents

Publication Publication Date Title
TW200536618A (en) Surface treatment device for substrate
JP3518676B2 (ja) プリント配線基板材の表面処理装置
JP2008085119A (ja) 薬液処理装置
TWI280990B (en) Etching device for electroplating substrate
TWI327450B (en) Conveyer for surface treatment
JP2006222117A (ja) 基板材の搬送装置
TW556459B (en) Substrate processing equipment
TWI301820B (en) Conveyance device for thin substrate
TWI299007B (en) Processing device for substrate surface
TWI229048B (en) Transportation device for substrate materials
TW200412261A (en) Cleaning device
TW595285B (en) The substrate treating device
KR20140132743A (ko) 연속 패턴 도금 전사 시스템 및 연속 패턴 도금 전사물 제조 방법
TW457133B (en) A conveying mechanism for printed wiring substrates
TWI280216B (en) An apparatus for transporting printed circuit board
TWI230569B (en) Liquid solution processing apparatus
JP3908242B2 (ja) 基板材の搬送機構
JP3576467B2 (ja) プリント配線基板材の搬送機構
JP2920525B1 (ja) 薄板材の液切り装置
JP2001096208A (ja) 薬液噴射装置
JP2007109987A (ja) 基板のエッチング装置
JP3566900B2 (ja) 薬液処理装置
JP3389321B2 (ja) 基板搬送装置およびそれを用いた混成集積回路装置の製造方法
JP2000212774A (ja) 薬液処理装置
KR20210002849U (ko) 솔더 레지스트층의 박막화 장치