TW200518215A - Sheet-peeling apparatus and method of peeling - Google Patents

Sheet-peeling apparatus and method of peeling

Info

Publication number
TW200518215A
TW200518215A TW093127894A TW93127894A TW200518215A TW 200518215 A TW200518215 A TW 200518215A TW 093127894 A TW093127894 A TW 093127894A TW 93127894 A TW93127894 A TW 93127894A TW 200518215 A TW200518215 A TW 200518215A
Authority
TW
Taiwan
Prior art keywords
peeling
sheet
glued
adhesive tape
condition
Prior art date
Application number
TW093127894A
Other languages
English (en)
Chinese (zh)
Other versions
TWI376738B (https=
Inventor
Masaki Tsujimoto
Takahisa Yoshioka
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200518215A publication Critical patent/TW200518215A/zh
Application granted granted Critical
Publication of TWI376738B publication Critical patent/TWI376738B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H10P72/7446—Separation by peeling using a peeling wheel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/195—Delaminating roller means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW093127894A 2003-10-27 2004-09-15 Sheet-peeling apparatus and method of peeling TW200518215A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003365859A JP4494753B2 (ja) 2003-10-27 2003-10-27 シート剥離装置及び剥離方法

Publications (2)

Publication Number Publication Date
TW200518215A true TW200518215A (en) 2005-06-01
TWI376738B TWI376738B (https=) 2012-11-11

Family

ID=34510197

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093127894A TW200518215A (en) 2003-10-27 2004-09-15 Sheet-peeling apparatus and method of peeling

Country Status (8)

Country Link
US (1) US7686916B2 (https=)
EP (1) EP1679739B1 (https=)
JP (1) JP4494753B2 (https=)
KR (1) KR101059430B1 (https=)
CN (1) CN1871692B (https=)
SG (1) SG147455A1 (https=)
TW (1) TW200518215A (https=)
WO (1) WO2005041282A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI850701B (zh) * 2021-10-14 2024-08-01 日商日本東京精密股份有限公司 工件加工裝置

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4541237B2 (ja) * 2005-06-29 2010-09-08 リンテック株式会社 半導体ウエハ処理テープ巻装体およびそれを用いた半導体ウエハ処理テープ貼着装置ならびに半導体ウエハ加工処理装置
JP4697014B2 (ja) * 2006-04-06 2011-06-08 株式会社デンソー 半導体装置の製造方法および半導体製造装置。
JP2011116486A (ja) * 2009-12-02 2011-06-16 Sharp Corp フィルム剥離装置
JP5563349B2 (ja) * 2010-03-30 2014-07-30 日本板硝子株式会社 転写体の製造方法
KR101929527B1 (ko) * 2012-09-17 2018-12-17 삼성디스플레이 주식회사 필름 박리 장치
KR101981639B1 (ko) * 2012-11-13 2019-05-27 삼성디스플레이 주식회사 시트 커팅 장치 및 그것을 이용한 시트 커팅 방법
JP2017537857A (ja) * 2014-11-19 2017-12-21 コーニング インコーポレイテッド 剥離を含む加工の方法
JP2016160072A (ja) * 2015-03-04 2016-09-05 株式会社ジャパンディスプレイ 剥離装置及び剥離ヘッド
WO2017043862A1 (ko) * 2015-09-07 2017-03-16 주식회사 엘지화학 판상 물질의 박리 장치
JP2017224671A (ja) * 2016-06-14 2017-12-21 株式会社ディスコ 剥離装置
TWI685905B (zh) * 2017-07-12 2020-02-21 日商新川股份有限公司 接合裝置和接合方法
JP6954611B2 (ja) * 2017-11-13 2021-10-27 Uht株式会社 テープ貼付装置及びテープ貼付方法
JP7033310B2 (ja) * 2018-04-27 2022-03-10 三星ダイヤモンド工業株式会社 端材除去機構並びに端材除去方法
US11889742B2 (en) * 2020-11-04 2024-01-30 Samsung Display Co., Ltd. Apparatus of manufacturing display device and method of manufacturing display device
JP2022074816A (ja) * 2020-11-05 2022-05-18 三菱電機株式会社 清掃装置および清掃方法
CN113183235B (zh) * 2021-03-31 2022-05-17 苏州壬和控股有限公司 一种保护膜的零损伤式加工工艺
US11505457B2 (en) * 2021-04-16 2022-11-22 Xintec Inc. Semiconductor removing apparatus and operation method thereof
TWI803340B (zh) * 2022-06-07 2023-05-21 精材科技股份有限公司 撕膠設備及其操作方法
CN115876689B (zh) * 2022-12-30 2024-04-05 浙江京华激光科技股份有限公司 一种剥离性能检测设备及剥离检测方法
KR20260029605A (ko) * 2024-08-23 2026-03-05 한화솔루션 주식회사 막전극접합체 제조장치 및 이를 이용하는 막전극접합체 제조방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04336428A (ja) * 1991-05-13 1992-11-24 Nitto Denko Corp ウエハのテープ貼合わせ剥離装置
JPH06302572A (ja) * 1993-04-12 1994-10-28 Hitachi Ltd 半導体装置の製造方法及びテープ貼付剥離装置
JP4204653B2 (ja) * 1997-06-20 2009-01-07 リンテック株式会社 シート剥離装置および方法
US6149758A (en) * 1997-06-20 2000-11-21 Lintec Corporation Sheet removing apparatus and method
US6500291B1 (en) * 1998-09-11 2002-12-31 Hitachi Chemical Co. Ltd. Device and method for lamination
DE19845624C1 (de) 1998-10-05 2000-05-11 Duerkopp Adler Ag Nähanlage zur Herstellung einer paspelierten Taschenöffnung
JP2001291760A (ja) * 2000-01-31 2001-10-19 Hitachi Chem Co Ltd 剥離方法及び剥離用テープ
JP4166920B2 (ja) * 2000-02-24 2008-10-15 リンテック株式会社 シート剥離装置および方法
JP4502547B2 (ja) * 2000-08-07 2010-07-14 日東電工株式会社 半導体ウエハの保護テープ除去方法およびその装置
JP3892703B2 (ja) * 2001-10-19 2007-03-14 富士通株式会社 半導体基板用治具及びこれを用いた半導体装置の製造方法
JP3880397B2 (ja) 2001-12-27 2007-02-14 日東電工株式会社 保護テープの貼付・剥離方法
JP3990264B2 (ja) 2002-12-10 2007-10-10 富士フイルム株式会社 保護シート剥離装置
JP2004349591A (ja) * 2003-05-26 2004-12-09 Shinko Electric Ind Co Ltd 接着剤付きウェーハの製造方法及び製造装置
JP4538242B2 (ja) 2004-01-23 2010-09-08 株式会社東芝 剥離装置及び剥離方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI850701B (zh) * 2021-10-14 2024-08-01 日商日本東京精密股份有限公司 工件加工裝置

Also Published As

Publication number Publication date
CN1871692A (zh) 2006-11-29
US20090014124A1 (en) 2009-01-15
SG147455A1 (en) 2008-11-28
WO2005041282A1 (ja) 2005-05-06
EP1679739A1 (en) 2006-07-12
EP1679739A4 (en) 2010-01-13
TWI376738B (https=) 2012-11-11
KR101059430B1 (ko) 2011-08-25
EP1679739B1 (en) 2015-06-24
KR20060121917A (ko) 2006-11-29
US7686916B2 (en) 2010-03-30
JP4494753B2 (ja) 2010-06-30
CN1871692B (zh) 2010-06-09
JP2005129829A (ja) 2005-05-19

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Legal Events

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