WO1999048137A3 - Verfahren und vorrichtung zum behandeln von wafern mit bauelementen beim abdünnen des wafers und beim vereinzeln der bauelemente - Google Patents

Verfahren und vorrichtung zum behandeln von wafern mit bauelementen beim abdünnen des wafers und beim vereinzeln der bauelemente Download PDF

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Publication number
WO1999048137A3
WO1999048137A3 PCT/EP1999/001602 EP9901602W WO9948137A3 WO 1999048137 A3 WO1999048137 A3 WO 1999048137A3 EP 9901602 W EP9901602 W EP 9901602W WO 9948137 A3 WO9948137 A3 WO 9948137A3
Authority
WO
WIPO (PCT)
Prior art keywords
components
wafer
separation
presenting
during thinning
Prior art date
Application number
PCT/EP1999/001602
Other languages
English (en)
French (fr)
Other versions
WO1999048137A2 (de
Inventor
Michael Stromberg
Original Assignee
Michael Stromberg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19811115A external-priority patent/DE19811115A1/de
Application filed by Michael Stromberg filed Critical Michael Stromberg
Priority to DE19980448T priority Critical patent/DE19980448D2/de
Priority to AU31448/99A priority patent/AU3144899A/en
Publication of WO1999048137A2 publication Critical patent/WO1999048137A2/de
Publication of WO1999048137A3 publication Critical patent/WO1999048137A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

Es werden ein Verfahren und eine Vorrichtung zum Behandeln von Wafern mit Bauelementen beim Abdünnen des Wafers und dem Vereinzeln der Bauelemente und den dazwischenliegenden Fertigungsschritten zur Verfügung gestellt. Die Vorderseite des Wafers mit den Bauelementen wird mit einer Schicht überzogen, die beim Abdünnen, den weiteren Fertigungsschritten und dem Vereinzeln auf der Wafervorderseite verbleibt. Die Vorteile der Erfindung liegen in einem wirksamen Schutz der Bauelemente beim Abdünnen und Vereinzeln sowie weiteren Fertigungsschritten, in einer hohen Dichte bzw. kleinerer Abmessung von Bauelementen auf einem Wafer und im Erreichen von sehr dünnen Bauelementen.
PCT/EP1999/001602 1998-03-14 1999-03-11 Verfahren und vorrichtung zum behandeln von wafern mit bauelementen beim abdünnen des wafers und beim vereinzeln der bauelemente WO1999048137A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE19980448T DE19980448D2 (de) 1998-03-14 1999-03-11 Verfahren und Vorrichtung zum Behandeln von Wafern mit Bauelementen beim Abdünnen des Wafers und beim Vereinzeln der Bauelemente
AU31448/99A AU3144899A (en) 1998-03-14 1999-03-11 Method and device for treating wafers presenting components during thinning of the wafer and separation of the components

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE19811115A DE19811115A1 (de) 1998-03-14 1998-03-14 Verfahren zur Behandlung von Wafern beim Dünnen und Sägen
DE19811115.0 1998-03-14
DE19812120.2 1998-03-19
DE19812120 1998-03-19

Publications (2)

Publication Number Publication Date
WO1999048137A2 WO1999048137A2 (de) 1999-09-23
WO1999048137A3 true WO1999048137A3 (de) 1999-11-04

Family

ID=26044623

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1999/001602 WO1999048137A2 (de) 1998-03-14 1999-03-11 Verfahren und vorrichtung zum behandeln von wafern mit bauelementen beim abdünnen des wafers und beim vereinzeln der bauelemente

Country Status (3)

Country Link
AU (1) AU3144899A (de)
DE (1) DE19980448D2 (de)
WO (1) WO1999048137A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19921230B4 (de) * 1999-05-07 2009-04-02 Giesecke & Devrient Gmbh Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten
JP2003151924A (ja) 2001-08-28 2003-05-23 Tokyo Seimitsu Co Ltd ダイシング方法およびダイシング装置
AU2002362491A1 (en) * 2001-10-01 2003-04-14 Xsil Technology Limited Method of machining substrates
KR101180497B1 (ko) 2002-11-29 2012-09-06 안드레아스 야콥 중간층 및 지지층을 갖는 웨이퍼 및 웨이퍼를 처리하기위한 방법 및 장치
FR2878076B1 (fr) * 2004-11-17 2007-02-23 St Microelectronics Sa Amincissement d'une plaquette semiconductrice
CN101894763B (zh) * 2009-05-19 2011-09-07 中芯国际集成电路制造(上海)有限公司 一种芯片装配方法
DE102011100608B4 (de) 2011-03-03 2024-03-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Suspension zum Schutz eines Halbleitermaterials und Verfahren zur Herstellung eines Halbleiterkörpers
US10186458B2 (en) * 2012-07-05 2019-01-22 Infineon Technologies Ag Component and method of manufacturing a component using an ultrathin carrier

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5268065A (en) * 1992-12-21 1993-12-07 Motorola, Inc. Method for thinning a semiconductor wafer
US5641416A (en) * 1995-10-25 1997-06-24 Micron Display Technology, Inc. Method for particulate-free energy beam cutting of a wafer of die assemblies

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5268065A (en) * 1992-12-21 1993-12-07 Motorola, Inc. Method for thinning a semiconductor wafer
US5641416A (en) * 1995-10-25 1997-06-24 Micron Display Technology, Inc. Method for particulate-free energy beam cutting of a wafer of die assemblies

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
WONG E H ET AL: "Laser chip separation method for GaAs MMIC wafers", IEEE 1988 MICROWAVE AND MILLIMETER-WAVE MONOLITHIC CIRCUITS SYMPOSIUM. DIGEST OF PAPERS (CAT. NO.88CH2591-6), NEW YORK, NY, USA, 24-25 MAY 1988, 1988, New York, NY, USA, IEEE, USA, pages 113 - 116, XP002114964 *

Also Published As

Publication number Publication date
WO1999048137A2 (de) 1999-09-23
DE19980448D2 (de) 2004-12-09
AU3144899A (en) 1999-10-11

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