DE19980448D2 - Verfahren und Vorrichtung zum Behandeln von Wafern mit Bauelementen beim Abdünnen des Wafers und beim Vereinzeln der Bauelemente - Google Patents

Verfahren und Vorrichtung zum Behandeln von Wafern mit Bauelementen beim Abdünnen des Wafers und beim Vereinzeln der Bauelemente

Info

Publication number
DE19980448D2
DE19980448D2 DE19980448T DE19980448T DE19980448D2 DE 19980448 D2 DE19980448 D2 DE 19980448D2 DE 19980448 T DE19980448 T DE 19980448T DE 19980448 T DE19980448 T DE 19980448T DE 19980448 D2 DE19980448 D2 DE 19980448D2
Authority
DE
Germany
Prior art keywords
components
thinning
wafer
separating
treating wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19980448T
Other languages
English (en)
Inventor
Andreas Jakob
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19811115A external-priority patent/DE19811115A1/de
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of DE19980448D2 publication Critical patent/DE19980448D2/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
DE19980448T 1998-03-14 1999-03-11 Verfahren und Vorrichtung zum Behandeln von Wafern mit Bauelementen beim Abdünnen des Wafers und beim Vereinzeln der Bauelemente Ceased DE19980448D2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19811115A DE19811115A1 (de) 1998-03-14 1998-03-14 Verfahren zur Behandlung von Wafern beim Dünnen und Sägen
DE19812120 1998-03-19
PCT/EP1999/001602 WO1999048137A2 (de) 1998-03-14 1999-03-11 Verfahren und vorrichtung zum behandeln von wafern mit bauelementen beim abdünnen des wafers und beim vereinzeln der bauelemente

Publications (1)

Publication Number Publication Date
DE19980448D2 true DE19980448D2 (de) 2004-12-09

Family

ID=26044623

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19980448T Ceased DE19980448D2 (de) 1998-03-14 1999-03-11 Verfahren und Vorrichtung zum Behandeln von Wafern mit Bauelementen beim Abdünnen des Wafers und beim Vereinzeln der Bauelemente

Country Status (3)

Country Link
AU (1) AU3144899A (de)
DE (1) DE19980448D2 (de)
WO (1) WO1999048137A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19921230B4 (de) * 1999-05-07 2009-04-02 Giesecke & Devrient Gmbh Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten
JP2003151924A (ja) 2001-08-28 2003-05-23 Tokyo Seimitsu Co Ltd ダイシング方法およびダイシング装置
CN100369235C (zh) * 2001-10-01 2008-02-13 埃克赛尔技术有限公司 加工衬底的方法及系统
PT1568071T (pt) * 2002-11-29 2019-06-17 Fraunhofer Ges Forschung Pastilha com camada de separação e camada de suporte e seu processo de fabrico
FR2878076B1 (fr) * 2004-11-17 2007-02-23 St Microelectronics Sa Amincissement d'une plaquette semiconductrice
CN101894763B (zh) * 2009-05-19 2011-09-07 中芯国际集成电路制造(上海)有限公司 一种芯片装配方法
DE102011100608B4 (de) 2011-03-03 2024-03-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Suspension zum Schutz eines Halbleitermaterials und Verfahren zur Herstellung eines Halbleiterkörpers
US10186458B2 (en) * 2012-07-05 2019-01-22 Infineon Technologies Ag Component and method of manufacturing a component using an ultrathin carrier

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5268065A (en) * 1992-12-21 1993-12-07 Motorola, Inc. Method for thinning a semiconductor wafer
US5641416A (en) * 1995-10-25 1997-06-24 Micron Display Technology, Inc. Method for particulate-free energy beam cutting of a wafer of die assemblies

Also Published As

Publication number Publication date
WO1999048137A3 (de) 1999-11-04
AU3144899A (en) 1999-10-11
WO1999048137A2 (de) 1999-09-23

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Legal Events

Date Code Title Description
8141 Disposal/no request for examination
8110 Request for examination paragraph 44
8170 Reinstatement of the former position
8131 Rejection