TW200502606A - Optical waveguide, optoelectric hybrid substrate, and optoelectric hybrid substrate producing method - Google Patents

Optical waveguide, optoelectric hybrid substrate, and optoelectric hybrid substrate producing method

Info

Publication number
TW200502606A
TW200502606A TW093111262A TW93111262A TW200502606A TW 200502606 A TW200502606 A TW 200502606A TW 093111262 A TW093111262 A TW 093111262A TW 93111262 A TW93111262 A TW 93111262A TW 200502606 A TW200502606 A TW 200502606A
Authority
TW
Taiwan
Prior art keywords
hybrid substrate
optoelectric hybrid
optical waveguide
producing method
optoelectric
Prior art date
Application number
TW093111262A
Other languages
English (en)
Chinese (zh)
Other versions
TWI340262B (ja
Inventor
Gen Itokawa
Hideaki Kojima
Naoki Yoneda
Nobuhito Itoh
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200502606A publication Critical patent/TW200502606A/zh
Application granted granted Critical
Publication of TWI340262B publication Critical patent/TWI340262B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Optical Integrated Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
TW093111262A 2003-04-23 2004-04-22 Optical waveguide, optoelectric hybrid substrate, and optoelectric hybrid substrate producing method TW200502606A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003118882 2003-04-23

Publications (2)

Publication Number Publication Date
TW200502606A true TW200502606A (en) 2005-01-16
TWI340262B TWI340262B (ja) 2011-04-11

Family

ID=33308084

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111262A TW200502606A (en) 2003-04-23 2004-04-22 Optical waveguide, optoelectric hybrid substrate, and optoelectric hybrid substrate producing method

Country Status (5)

Country Link
JP (1) JPWO2004095093A1 (ja)
KR (1) KR100791186B1 (ja)
CN (1) CN100346184C (ja)
TW (1) TW200502606A (ja)
WO (1) WO2004095093A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9008480B2 (en) 2009-03-31 2015-04-14 Panasonic Intellectual Property Management Co., Ltd. Method of manufacturing optical waveguide core, method of manufacturing optical waveguide, optical waveguide, and optoelectric composite wiring board

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101422866B1 (ko) 2006-07-20 2014-07-23 히타치가세이가부시끼가이샤 광전기혼재기판
JPWO2008035658A1 (ja) * 2006-09-22 2010-01-28 日立化成工業株式会社 光導波路の製造方法
JP5269449B2 (ja) * 2007-03-24 2013-08-21 株式会社ダイセル ナノインプリント用硬化性樹脂組成物
JP5444696B2 (ja) * 2007-11-22 2014-03-19 大日本印刷株式会社 異種部材一括形成用ネガ型レジスト組成物
WO2009116421A1 (ja) * 2008-03-18 2009-09-24 日立化成工業株式会社 光導波路の製造方法
KR20110029881A (ko) * 2009-09-16 2011-03-23 한국전자통신연구원 플라스틱 기판 및 이의 제조방법
CN102316662A (zh) * 2010-06-29 2012-01-11 欣兴电子股份有限公司 光电线路板及其制造方法
JP5767540B2 (ja) * 2011-09-14 2015-08-19 積水化学工業株式会社 エピスルフィド樹脂材料であるｂステージフィルム、多層基板及び積層フィルム

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06258537A (ja) * 1993-03-08 1994-09-16 Mitsubishi Rayon Co Ltd ドライフィルムレジストおよびそれを用いたプリント配線板
JP3254572B2 (ja) * 1996-06-28 2002-02-12 バンティコ株式会社 光重合性熱硬化性樹脂組成物
JP4095163B2 (ja) * 1998-05-01 2008-06-04 太陽インキ製造株式会社 プリント配線板用感光性樹脂組成物並びにそれから形成されるソルダーレジスト皮膜や樹脂絶縁層を有するプリント配線板
JP3491677B2 (ja) * 1999-06-24 2004-01-26 日本電気株式会社 光電気混載基板およびその製造方法
JP2000356720A (ja) * 1999-06-16 2000-12-26 Sony Corp 光導波路用材料並びに光導波路およびその製造方法
EP1275665A4 (en) * 2000-03-29 2005-10-12 Univ Kanagawa ACTINICALLY RADIATION-CURABLE RESINS, PROCESS FOR THEIR PREPARATION AND COMPOSITION OF THERMOSETTING RESINS
WO2001073510A1 (fr) * 2000-03-29 2001-10-04 Kanagawa University Composition de resine photodurcissante/thermodurcissante, couche seche photosensible preparee au moyen de cette resine et procede de creation de configurations
JP2002107562A (ja) * 2000-09-28 2002-04-10 Mitsubishi Paper Mills Ltd 高分子光導波路の製造方法
JP2002289911A (ja) * 2000-12-06 2002-10-04 Ibiden Co Ltd 光通信用デバイス
JP4789381B2 (ja) * 2000-12-06 2011-10-12 イビデン株式会社 多層プリント配線板
JP2002236228A (ja) * 2000-12-06 2002-08-23 Ibiden Co Ltd 多層プリント配線板
JP3771169B2 (ja) * 2000-12-06 2006-04-26 イビデン株式会社 光通信用デバイス
JP4036644B2 (ja) * 2000-12-22 2008-01-23 イビデン株式会社 Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス
JP2002341169A (ja) * 2001-03-15 2002-11-27 Sumitomo Bakelite Co Ltd プラスチック光導波路の製造方法
JP2002277663A (ja) * 2001-03-21 2002-09-25 Sumitomo Bakelite Co Ltd 光導波路製造方法
JP2002327049A (ja) * 2001-04-27 2002-11-15 Jsr Corp 含フッ素共重合体、その製造方法、および光学用樹脂
JP2003020403A (ja) * 2001-07-10 2003-01-24 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2003040971A (ja) * 2001-07-31 2003-02-13 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2003048932A (ja) * 2001-08-07 2003-02-21 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2003048956A (ja) * 2001-08-09 2003-02-21 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2003113221A (ja) * 2001-10-05 2003-04-18 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9008480B2 (en) 2009-03-31 2015-04-14 Panasonic Intellectual Property Management Co., Ltd. Method of manufacturing optical waveguide core, method of manufacturing optical waveguide, optical waveguide, and optoelectric composite wiring board

Also Published As

Publication number Publication date
JPWO2004095093A1 (ja) 2006-07-13
CN1777827A (zh) 2006-05-24
CN100346184C (zh) 2007-10-31
TWI340262B (ja) 2011-04-11
KR100791186B1 (ko) 2008-01-02
KR20050109628A (ko) 2005-11-21
WO2004095093A1 (ja) 2004-11-04

Similar Documents

Publication Publication Date Title
US20100040327A1 (en) Optical waveguide and spot size converter using the same
EP1376180A9 (en) Light-reception/emission module with optical and electrical wiring combined therein, method for producing the module, and assembled member including the module
AU2002320167A1 (en) Laser diode chip with waveguide
MXPA05006114A (es) Fibra optica o lente guiaondas.
TW200625620A (en) Optical wiring board and photoelectric hybrid substrate
TW200712582A (en) Optical waveguide film and the manufacturing method thereof, and optical/electronic circuit film and electronic machine including that
TW200630655A (en) Photo-electricity combined-circuit mounted board and transmitting apparatus using the same
WO2003029847A3 (en) Optical, optoelectronic and electronic packaging platform
US20040145873A1 (en) Printed circuit board with opto-via holes and process of forming the opto-via holes
JP2006190978A (ja) 多波長用光素子モジュール及びその製造方法
TW200623993A (en) Methods of forming printed circuit boards
CA2534970A1 (en) Integrated optical waveguide structure with low coupling losses to an external optical field
TW200502606A (en) Optical waveguide, optoelectric hybrid substrate, and optoelectric hybrid substrate producing method
TW200519430A (en) Optical waveguide, light source module and optical information processing device
JP2007148087A (ja) 光電気集積配線基板及び光電気集積配線システム
TW200407573A (en) Daul-band bend tolerant optical waveguide
JP6319759B2 (ja) 光電気混載モジュール
TW200518647A (en) Printed wiring board and method of manufacturing same
WO2008117517A1 (ja) レーザーガイド用光ファイバ及びそれを備えたレーザーガイド
JP2005195651A (ja) 光接続基板、光伝送システム、及び製造方法
TW201144878A (en) Method of forming an optical waveguide structure
TWI263814B (en) Optical circuit package and method of making the same, and method of operating optical circuit
WO2014125713A1 (ja) 光電気混載モジュール
WO2003058288A3 (en) Lens coupling fiber attachment for polymer optical waveguide on polymer substrate
WO2003096499A3 (en) Semiconductor laser

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent