KR100791186B1 - 광 도파로, 광전기 혼재 기판 및 이 광전기 혼재 기판의제조 방법 - Google Patents

광 도파로, 광전기 혼재 기판 및 이 광전기 혼재 기판의제조 방법 Download PDF

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Publication number
KR100791186B1
KR100791186B1 KR1020057019895A KR20057019895A KR100791186B1 KR 100791186 B1 KR100791186 B1 KR 100791186B1 KR 1020057019895 A KR1020057019895 A KR 1020057019895A KR 20057019895 A KR20057019895 A KR 20057019895A KR 100791186 B1 KR100791186 B1 KR 100791186B1
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KR
South Korea
Prior art keywords
optical waveguide
clad
core
solder resist
refractive index
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KR1020057019895A
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English (en)
Korean (ko)
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KR20050109628A (ko
Inventor
겐 이또가와
히데아끼 고지마
나오끼 요네다
노부히또 이또
Original Assignee
다이요 잉키 세이조 가부시키가이샤
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Application filed by 다이요 잉키 세이조 가부시키가이샤 filed Critical 다이요 잉키 세이조 가부시키가이샤
Publication of KR20050109628A publication Critical patent/KR20050109628A/ko
Application granted granted Critical
Publication of KR100791186B1 publication Critical patent/KR100791186B1/ko

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Optical Integrated Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
KR1020057019895A 2003-04-23 2004-04-20 광 도파로, 광전기 혼재 기판 및 이 광전기 혼재 기판의제조 방법 KR100791186B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00118882 2003-04-23
JP2003118882 2003-04-23

Publications (2)

Publication Number Publication Date
KR20050109628A KR20050109628A (ko) 2005-11-21
KR100791186B1 true KR100791186B1 (ko) 2008-01-02

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KR1020057019895A KR100791186B1 (ko) 2003-04-23 2004-04-20 광 도파로, 광전기 혼재 기판 및 이 광전기 혼재 기판의제조 방법

Country Status (5)

Country Link
JP (1) JPWO2004095093A1 (ja)
KR (1) KR100791186B1 (ja)
CN (1) CN100346184C (ja)
TW (1) TW200502606A (ja)
WO (1) WO2004095093A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008023517A1 (fr) * 2006-07-20 2008-02-28 Hitachi Chemical Company, Ltd. Substrat de montage mixte optique/électrique
KR20090058511A (ko) * 2006-09-22 2009-06-09 히다치 가세고교 가부시끼가이샤 광도파로의 제조방법
JP5269449B2 (ja) * 2007-03-24 2013-08-21 株式会社ダイセル ナノインプリント用硬化性樹脂組成物
JP5444696B2 (ja) * 2007-11-22 2014-03-19 大日本印刷株式会社 異種部材一括形成用ネガ型レジスト組成物
WO2009116421A1 (ja) * 2008-03-18 2009-09-24 日立化成工業株式会社 光導波路の製造方法
JP2010256877A (ja) 2009-03-31 2010-11-11 Panasonic Electric Works Co Ltd 光導波路コアの製造方法、光導波路の製造方法、光導波路、及び光電気複合配線板
KR20110029881A (ko) * 2009-09-16 2011-03-23 한국전자통신연구원 플라스틱 기판 및 이의 제조방법
CN102316662A (zh) * 2010-06-29 2012-01-11 欣兴电子股份有限公司 光电线路板及其制造方法
JP5767540B2 (ja) * 2011-09-14 2015-08-19 積水化学工業株式会社 エピスルフィド樹脂材料であるｂステージフィルム、多層基板及び積層フィルム

Citations (1)

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Publication number Priority date Publication date Assignee Title
JPH06258537A (ja) * 1993-03-08 1994-09-16 Mitsubishi Rayon Co Ltd ドライフィルムレジストおよびそれを用いたプリント配線板

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JP3254572B2 (ja) * 1996-06-28 2002-02-12 バンティコ株式会社 光重合性熱硬化性樹脂組成物
JP4095163B2 (ja) * 1998-05-01 2008-06-04 太陽インキ製造株式会社 プリント配線板用感光性樹脂組成物並びにそれから形成されるソルダーレジスト皮膜や樹脂絶縁層を有するプリント配線板
JP3491677B2 (ja) * 1999-06-24 2004-01-26 日本電気株式会社 光電気混載基板およびその製造方法
JP2000356720A (ja) * 1999-06-16 2000-12-26 Sony Corp 光導波路用材料並びに光導波路およびその製造方法
WO2001072857A1 (fr) * 2000-03-29 2001-10-04 Kanagawa University Resines durcissables aux radiations actiniques, leur procede de preparation et composition de resines thermodurcissables
DE60103529T2 (de) * 2000-03-29 2005-06-02 Kanagawa University, Yokohama Durch licht und wärme aushärtbare harzzusammensetzung, aus dieser hergestellte lichtempfindliche trockenfolie und verfahren zur bildung eines musters damit
JP2002107562A (ja) * 2000-09-28 2002-04-10 Mitsubishi Paper Mills Ltd 高分子光導波路の製造方法
JP2002289911A (ja) * 2000-12-06 2002-10-04 Ibiden Co Ltd 光通信用デバイス
JP4789381B2 (ja) * 2000-12-06 2011-10-12 イビデン株式会社 多層プリント配線板
JP2002236228A (ja) * 2000-12-06 2002-08-23 Ibiden Co Ltd 多層プリント配線板
JP3771169B2 (ja) * 2000-12-06 2006-04-26 イビデン株式会社 光通信用デバイス
JP4036644B2 (ja) * 2000-12-22 2008-01-23 イビデン株式会社 Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス
JP2002341169A (ja) * 2001-03-15 2002-11-27 Sumitomo Bakelite Co Ltd プラスチック光導波路の製造方法
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JP2003048932A (ja) * 2001-08-07 2003-02-21 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2003048956A (ja) * 2001-08-09 2003-02-21 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2003113221A (ja) * 2001-10-05 2003-04-18 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06258537A (ja) * 1993-03-08 1994-09-16 Mitsubishi Rayon Co Ltd ドライフィルムレジストおよびそれを用いたプリント配線板

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
일본 공개특허공보 평6-258537호

Also Published As

Publication number Publication date
KR20050109628A (ko) 2005-11-21
TW200502606A (en) 2005-01-16
CN1777827A (zh) 2006-05-24
WO2004095093A1 (ja) 2004-11-04
CN100346184C (zh) 2007-10-31
JPWO2004095093A1 (ja) 2006-07-13
TWI340262B (ja) 2011-04-11

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