TW200421563A - Crack resistant interconnect module - Google Patents

Crack resistant interconnect module Download PDF

Info

Publication number
TW200421563A
TW200421563A TW092126641A TW92126641A TW200421563A TW 200421563 A TW200421563 A TW 200421563A TW 092126641 A TW092126641 A TW 092126641A TW 92126641 A TW92126641 A TW 92126641A TW 200421563 A TW200421563 A TW 200421563A
Authority
TW
Taiwan
Prior art keywords
wafer
substrate
attachment surface
metal
layer
Prior art date
Application number
TW092126641A
Other languages
English (en)
Chinese (zh)
Inventor
Robin Eugene Gorrell
Donald Ray Banks
Mark Frederick Sylvester
Michael Dean Holcomb
William Vern Ballard
Kirosawa Kouichi
Satou Sadanobu
Kimura Teruhiko
Original Assignee
3M Innovative Properties Co
Nec Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co, Nec Electronics Corp filed Critical 3M Innovative Properties Co
Publication of TW200421563A publication Critical patent/TW200421563A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW092126641A 2002-09-27 2003-09-26 Crack resistant interconnect module TW200421563A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41446102P 2002-09-27 2002-09-27
US10/668,881 US20040104463A1 (en) 2002-09-27 2003-09-23 Crack resistant interconnect module

Publications (1)

Publication Number Publication Date
TW200421563A true TW200421563A (en) 2004-10-16

Family

ID=32045287

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092126641A TW200421563A (en) 2002-09-27 2003-09-26 Crack resistant interconnect module

Country Status (8)

Country Link
US (1) US20040104463A1 (https=)
EP (1) EP1543559A2 (https=)
JP (1) JP2006501652A (https=)
KR (1) KR20050075340A (https=)
CN (1) CN1685505A (https=)
AU (1) AU2003275208A1 (https=)
TW (1) TW200421563A (https=)
WO (1) WO2004030096A2 (https=)

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KR101184375B1 (ko) * 2010-05-10 2012-09-20 매그나칩 반도체 유한회사 패드 영역의 크랙 발생을 방지하는 반도체 장치 및 그 제조 방법
US20130027894A1 (en) * 2011-07-27 2013-01-31 Harris Corporation Stiffness enhancement of electronic substrates using circuit components
JP7506619B2 (ja) * 2021-02-19 2024-06-26 テルモ株式会社 ステントの製造方法およびステント

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Also Published As

Publication number Publication date
AU2003275208A8 (en) 2004-04-19
WO2004030096A2 (en) 2004-04-08
EP1543559A2 (en) 2005-06-22
KR20050075340A (ko) 2005-07-20
CN1685505A (zh) 2005-10-19
JP2006501652A (ja) 2006-01-12
US20040104463A1 (en) 2004-06-03
AU2003275208A1 (en) 2004-04-19
WO2004030096A3 (en) 2004-06-17

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