AU2003275208A1 - Crack resistant interconnect module - Google Patents

Crack resistant interconnect module

Info

Publication number
AU2003275208A1
AU2003275208A1 AU2003275208A AU2003275208A AU2003275208A1 AU 2003275208 A1 AU2003275208 A1 AU 2003275208A1 AU 2003275208 A AU2003275208 A AU 2003275208A AU 2003275208 A AU2003275208 A AU 2003275208A AU 2003275208 A1 AU2003275208 A1 AU 2003275208A1
Authority
AU
Australia
Prior art keywords
interconnect module
crack resistant
resistant interconnect
crack
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003275208A
Other languages
English (en)
Other versions
AU2003275208A8 (en
Inventor
William V. Ballard
Donald R. Banks
Robin E. Gorrell
Kouichi Hirosawa
Michael D. Holcomb
Teruhiko Kimura
Sadanobu Satou
Mark F. Sylvester
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU2003275208A8 publication Critical patent/AU2003275208A8/xx
Publication of AU2003275208A1 publication Critical patent/AU2003275208A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
AU2003275208A 2002-09-27 2003-09-24 Crack resistant interconnect module Abandoned AU2003275208A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US41446102P 2002-09-27 2002-09-27
US60/414,461 2002-09-27
US10/668,881 2003-09-23
US10/668,881 US20040104463A1 (en) 2002-09-27 2003-09-23 Crack resistant interconnect module
PCT/US2003/030060 WO2004030096A2 (en) 2002-09-27 2003-09-24 Crack resistant interconnect module

Publications (2)

Publication Number Publication Date
AU2003275208A8 AU2003275208A8 (en) 2004-04-19
AU2003275208A1 true AU2003275208A1 (en) 2004-04-19

Family

ID=32045287

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003275208A Abandoned AU2003275208A1 (en) 2002-09-27 2003-09-24 Crack resistant interconnect module

Country Status (8)

Country Link
US (1) US20040104463A1 (https=)
EP (1) EP1543559A2 (https=)
JP (1) JP2006501652A (https=)
KR (1) KR20050075340A (https=)
CN (1) CN1685505A (https=)
AU (1) AU2003275208A1 (https=)
TW (1) TW200421563A (https=)
WO (1) WO2004030096A2 (https=)

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JP5733781B2 (ja) 2010-03-31 2015-06-10 国立研究開発法人農業・食品産業技術総合研究機構 コーヒー粕あるいは茶殻を原料とするフェントン反応触媒
KR101184375B1 (ko) * 2010-05-10 2012-09-20 매그나칩 반도체 유한회사 패드 영역의 크랙 발생을 방지하는 반도체 장치 및 그 제조 방법
US20130027894A1 (en) * 2011-07-27 2013-01-31 Harris Corporation Stiffness enhancement of electronic substrates using circuit components
JP7506619B2 (ja) * 2021-02-19 2024-06-26 テルモ株式会社 ステントの製造方法およびステント

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Also Published As

Publication number Publication date
AU2003275208A8 (en) 2004-04-19
WO2004030096A2 (en) 2004-04-08
EP1543559A2 (en) 2005-06-22
TW200421563A (en) 2004-10-16
KR20050075340A (ko) 2005-07-20
CN1685505A (zh) 2005-10-19
JP2006501652A (ja) 2006-01-12
US20040104463A1 (en) 2004-06-03
WO2004030096A3 (en) 2004-06-17

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase