KR20050075340A - 내 균열성 상호 접속 모듈 - Google Patents

내 균열성 상호 접속 모듈 Download PDF

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Publication number
KR20050075340A
KR20050075340A KR1020057005266A KR20057005266A KR20050075340A KR 20050075340 A KR20050075340 A KR 20050075340A KR 1020057005266 A KR1020057005266 A KR 1020057005266A KR 20057005266 A KR20057005266 A KR 20057005266A KR 20050075340 A KR20050075340 A KR 20050075340A
Authority
KR
South Korea
Prior art keywords
chip
layer
substrate
adhesive surface
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020057005266A
Other languages
English (en)
Korean (ko)
Inventor
로빈 이. 고렐
마크 에프. 실베스터
도널드 알. 뱅크스
마이클 디. 홀콤브
윌리암 브이. 발라드
고우이찌 히로사와
사다노부 사또우
데루히꼬 기무라
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
엔이씨 일렉트로닉스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니, 엔이씨 일렉트로닉스 가부시키가이샤 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20050075340A publication Critical patent/KR20050075340A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1020057005266A 2002-09-27 2003-09-24 내 균열성 상호 접속 모듈 Withdrawn KR20050075340A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US41446102P 2002-09-27 2002-09-27
US60/414,461 2002-09-27
US10/668,881 2003-09-23
US10/668,881 US20040104463A1 (en) 2002-09-27 2003-09-23 Crack resistant interconnect module

Publications (1)

Publication Number Publication Date
KR20050075340A true KR20050075340A (ko) 2005-07-20

Family

ID=32045287

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057005266A Withdrawn KR20050075340A (ko) 2002-09-27 2003-09-24 내 균열성 상호 접속 모듈

Country Status (8)

Country Link
US (1) US20040104463A1 (https=)
EP (1) EP1543559A2 (https=)
JP (1) JP2006501652A (https=)
KR (1) KR20050075340A (https=)
CN (1) CN1685505A (https=)
AU (1) AU2003275208A1 (https=)
TW (1) TW200421563A (https=)
WO (1) WO2004030096A2 (https=)

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JP2003298196A (ja) * 2002-04-03 2003-10-17 Japan Gore Tex Inc プリント配線板用誘電体フィルム、多層プリント基板および半導体装置
CN100401486C (zh) * 2002-08-09 2008-07-09 富士通株式会社 半导体装置及其制造方法
JP2006120935A (ja) * 2004-10-22 2006-05-11 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
FI20051228L (sv) * 2005-12-01 2007-07-27 Zipic Oy Komponentlåda med mikrokrets
US20090223700A1 (en) * 2008-03-05 2009-09-10 Honeywell International Inc. Thin flexible circuits
JP5733781B2 (ja) 2010-03-31 2015-06-10 国立研究開発法人農業・食品産業技術総合研究機構 コーヒー粕あるいは茶殻を原料とするフェントン反応触媒
KR101184375B1 (ko) * 2010-05-10 2012-09-20 매그나칩 반도체 유한회사 패드 영역의 크랙 발생을 방지하는 반도체 장치 및 그 제조 방법
US20130027894A1 (en) * 2011-07-27 2013-01-31 Harris Corporation Stiffness enhancement of electronic substrates using circuit components
JP7506619B2 (ja) * 2021-02-19 2024-06-26 テルモ株式会社 ステントの製造方法およびステント

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US6210862B1 (en) * 1989-03-03 2001-04-03 International Business Machines Corporation Composition for photoimaging
JP2656416B2 (ja) * 1991-12-16 1997-09-24 三菱電機株式会社 半導体装置および半導体装置の製造方法、並びに半導体装置に用いられる複合基板および複合基板の製造方法
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JP3112059B2 (ja) * 1995-07-05 2000-11-27 株式会社日立製作所 薄膜多層配線基板及びその製法
EP0797084B1 (de) * 1996-03-23 2001-01-17 Endress + Hauser GmbH + Co. Verfahren zum Herstellen von kapazitiven, in Nullpunkt-Langzeit-Fehlerklassen sortierten Keramik-Absolutdruck-Sensoren
MY123146A (en) * 1996-03-28 2006-05-31 Intel Corp Perimeter matrix ball grid array circuit package with a populated center
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WO1998020528A1 (en) * 1996-11-08 1998-05-14 W.L. Gore & Associates, Inc. METHOD FOR IMPROVING RELIABILITY OF THIN CIRCUIT SUBSTRATES BY INCREASING THE Tg OF THE SUBSTRATE
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JP2001525120A (ja) * 1996-11-08 2001-12-04 ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティド ブラインドおよびスルーの両マイクロ―ヴァイアの入口の品質を向上するために吸光コーティングを用いる方法
US5868950A (en) * 1996-11-08 1999-02-09 W. L. Gore & Associates, Inc. Method to correct astigmatism of fourth yag to enable formation of sub 25 micron micro-vias using masking techniques
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US5973337A (en) * 1997-08-25 1999-10-26 Motorola, Inc. Ball grid device with optically transmissive coating
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Also Published As

Publication number Publication date
AU2003275208A8 (en) 2004-04-19
WO2004030096A2 (en) 2004-04-08
EP1543559A2 (en) 2005-06-22
TW200421563A (en) 2004-10-16
CN1685505A (zh) 2005-10-19
JP2006501652A (ja) 2006-01-12
US20040104463A1 (en) 2004-06-03
AU2003275208A1 (en) 2004-04-19
WO2004030096A3 (en) 2004-06-17

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000