TW200420193A - Composite sputter target and phosphor deposition method - Google Patents

Composite sputter target and phosphor deposition method

Info

Publication number
TW200420193A
TW200420193A TW092135575A TW92135575A TW200420193A TW 200420193 A TW200420193 A TW 200420193A TW 092135575 A TW092135575 A TW 092135575A TW 92135575 A TW92135575 A TW 92135575A TW 200420193 A TW200420193 A TW 200420193A
Authority
TW
Taiwan
Prior art keywords
phases
phosphor
reactive species
sputtering
matrix
Prior art date
Application number
TW092135575A
Other languages
English (en)
Inventor
Alexander Kosyachkov
Original Assignee
Ifire Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ifire Technology Inc filed Critical Ifire Technology Inc
Publication of TW200420193A publication Critical patent/TW200420193A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7729—Chalcogenides
    • C09K11/7731—Chalcogenides with alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7729—Chalcogenides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0623—Sulfides, selenides or tellurides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/548—Controlling the composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Luminescent Compositions (AREA)
  • Physical Vapour Deposition (AREA)
  • Materials For Medical Uses (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
TW092135575A 2002-12-16 2003-12-16 Composite sputter target and phosphor deposition method TW200420193A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US43357602P 2002-12-16 2002-12-16

Publications (1)

Publication Number Publication Date
TW200420193A true TW200420193A (en) 2004-10-01

Family

ID=32595213

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092135575A TW200420193A (en) 2002-12-16 2003-12-16 Composite sputter target and phosphor deposition method

Country Status (11)

Country Link
US (1) US7282123B2 (zh)
EP (1) EP1573084B1 (zh)
JP (1) JP2006509911A (zh)
KR (1) KR20050092703A (zh)
CN (1) CN1726299A (zh)
AT (1) ATE340277T1 (zh)
AU (1) AU2003291866A1 (zh)
CA (1) CA2508523A1 (zh)
DE (1) DE60308550T2 (zh)
TW (1) TW200420193A (zh)
WO (1) WO2004055231A2 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD202101S (zh) 2018-03-09 2020-01-11 美商應用材料股份有限公司 用於物理氣相沉積腔室靶材的靶材輪廓
TWD207532S (zh) 2018-12-17 2020-10-01 美商應用材料股份有限公司 Pvd腔的沉積環
TWD214766S (zh) 2019-08-26 2021-10-21 美商應用材料股份有限公司 用於物理氣相沉積腔室的濺射靶

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2590400A1 (en) 2004-10-29 2006-05-04 Ifire Ip Corporation Novel thiosilicate phosphor compositions and deposition methods using barium-silicon vacuum deposition sources for deposition of thiosilicate phosphor films
JP2007153996A (ja) * 2005-12-02 2007-06-21 Nippon Hoso Kyokai <Nhk> 蛍光体の製造方法およびそれにより製造された蛍光体
JP5580972B2 (ja) * 2008-06-06 2014-08-27 デクセリアルズ株式会社 スパッタリング複合ターゲット
USD836572S1 (en) 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US11961723B2 (en) 2018-12-17 2024-04-16 Applied Materials, Inc. Process kit having tall deposition ring for PVD chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
CN113444520B (zh) * 2021-06-25 2022-03-25 佛山安亿纳米材料有限公司 具有包覆层的硫化物荧光体及制备具有包覆层的硫化物荧光体的磁控溅射法
USD1004393S1 (en) * 2021-11-09 2023-11-14 Ehwa Diamond Industrial Co., Ltd. Grinding pad
USD1000928S1 (en) * 2022-06-03 2023-10-10 Beng Youl Cho Polishing pad
WO2024003344A1 (en) * 2022-07-01 2024-01-04 Danmarks Tekniske Universitet Production of the radionuclide lanthanum-135

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US3803438A (en) * 1973-04-19 1974-04-09 Rca Corp Electroluminescent film and method for preparing same
US4172020A (en) * 1978-05-24 1979-10-23 Gould Inc. Method and apparatus for monitoring and controlling sputter deposition processes
US4675092A (en) 1986-03-27 1987-06-23 Gte Laboratories Incorporated Method of producing thin film electroluminescent structures
US4725344A (en) 1986-06-20 1988-02-16 Rca Corporation Method of making electroluminescent phosphor films
US5432015A (en) 1992-05-08 1995-07-11 Westaim Technologies, Inc. Electroluminescent laminate with thick film dielectric
JPH06163157A (ja) * 1992-09-24 1994-06-10 Fuji Electric Co Ltd 薄膜ｅｌ素子の製造方法
US5518432A (en) * 1992-09-24 1996-05-21 Fuji Electric Company, Ltd. Method for manufacturing thin-film EL device
US5853552A (en) 1993-09-09 1998-12-29 Nippondenso Co., Ltd. Process for the production of electroluminescence element, electroluminescence element
JP2940477B2 (ja) 1995-08-11 1999-08-25 株式会社デンソー 誘電体薄膜と透明導電膜との積層膜および誘電体薄膜を用いた薄膜ｅｌ素子
US6338908B1 (en) 1998-06-26 2002-01-15 Tdk Corporation Organic electroluminescent device
US6295784B1 (en) * 1999-10-28 2001-10-02 Danny J. Richard Mobile home foundation
US6228555B1 (en) 1999-12-28 2001-05-08 3M Innovative Properties Company Thermal mass transfer donor element
US20010043043A1 (en) 2000-01-07 2001-11-22 Megumi Aoyama Organic electroluminescent display panel and organic electroluminescent device used therefor
US6610352B2 (en) 2000-12-22 2003-08-26 Ifire Technology, Inc. Multiple source deposition process
US6447654B1 (en) * 2001-05-29 2002-09-10 Ifire Technology Inc. Single source sputtering of thioaluminate phosphor films
US6793782B2 (en) 2001-12-21 2004-09-21 Ifire Technology Inc. Sputter deposition process for electroluminescent phosphors

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD202101S (zh) 2018-03-09 2020-01-11 美商應用材料股份有限公司 用於物理氣相沉積腔室靶材的靶材輪廓
TWD203691S (zh) 2018-03-09 2020-04-01 美商應用材料股份有限公司 用於物理氣相沉積腔室靶材的靶材輪廓
TWD207532S (zh) 2018-12-17 2020-10-01 美商應用材料股份有限公司 Pvd腔的沉積環
TWD209650S (zh) 2018-12-17 2021-02-01 美商應用材料股份有限公司 Pvd腔的沉積環
TWD214766S (zh) 2019-08-26 2021-10-21 美商應用材料股份有限公司 用於物理氣相沉積腔室的濺射靶

Also Published As

Publication number Publication date
AU2003291866A8 (en) 2004-07-09
DE60308550T2 (de) 2007-06-06
CA2508523A1 (en) 2004-07-01
DE60308550D1 (de) 2006-11-02
US20040149567A1 (en) 2004-08-05
WO2004055231A2 (en) 2004-07-01
EP1573084A2 (en) 2005-09-14
JP2006509911A (ja) 2006-03-23
AU2003291866A1 (en) 2004-07-09
ATE340277T1 (de) 2006-10-15
US7282123B2 (en) 2007-10-16
KR20050092703A (ko) 2005-09-22
WO2004055231A3 (en) 2004-11-18
EP1573084B1 (en) 2006-09-20
CN1726299A (zh) 2006-01-25

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