TW200416205A - Method for dividing substrate and method for manufacturing substrate using such method - Google Patents

Method for dividing substrate and method for manufacturing substrate using such method Download PDF

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Publication number
TW200416205A
TW200416205A TW92132664A TW92132664A TW200416205A TW 200416205 A TW200416205 A TW 200416205A TW 92132664 A TW92132664 A TW 92132664A TW 92132664 A TW92132664 A TW 92132664A TW 200416205 A TW200416205 A TW 200416205A
Authority
TW
Taiwan
Prior art keywords
substrate
line
scribe line
dividing
main
Prior art date
Application number
TW92132664A
Other languages
English (en)
Chinese (zh)
Other versions
TWI323727B (enExample
Inventor
Yoshitaka Nishio
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW200416205A publication Critical patent/TW200416205A/zh
Application granted granted Critical
Publication of TWI323727B publication Critical patent/TWI323727B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
TW92132664A 2002-11-22 2003-11-21 Method for dividing substrate and method for manufacturing substrate using such method TW200416205A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002340051 2002-11-22

Publications (2)

Publication Number Publication Date
TW200416205A true TW200416205A (en) 2004-09-01
TWI323727B TWI323727B (enExample) 2010-04-21

Family

ID=32375802

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92132664A TW200416205A (en) 2002-11-22 2003-11-21 Method for dividing substrate and method for manufacturing substrate using such method

Country Status (9)

Country Link
US (1) US7717311B2 (enExample)
EP (1) EP1579971B1 (enExample)
JP (1) JP4167227B2 (enExample)
KR (1) KR100657197B1 (enExample)
CN (1) CN100418718C (enExample)
AT (1) ATE527091T1 (enExample)
AU (1) AU2003302413A1 (enExample)
TW (1) TW200416205A (enExample)
WO (1) WO2004048058A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI409233B (zh) * 2005-07-06 2013-09-21 Mitsuboshi Diamond Ind Co Ltd The brittle material is a scribing wheel, a scribing method using the scribing wheel and a scribing device, and a scribing tool

Families Citing this family (30)

* Cited by examiner, † Cited by third party
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US20080286943A1 (en) * 2004-05-20 2008-11-20 Mitsuboshi Diamond Industrial Co., Ltd. Motherboard Cutting Method, Motherboard Scribing Apparatus, Program and Recording Medium
EP1779988A4 (en) * 2004-07-16 2010-03-24 Mitsuboshi Diamond Ind Co Ltd CUTTING TOOL WHEEL AND MANUFACTURING METHOD THEREOF, ROLLING TOOL TOOL, AND TRACING DEVICE
JP2007208230A (ja) * 2006-02-01 2007-08-16 Seiko Npc Corp 貼り合わせ基板のダイシング方法
DE102007045383A1 (de) * 2007-09-22 2008-07-17 Bohle Ag Verfahren zur Herstellung von Schneidrädchen
WO2009060691A1 (ja) * 2007-11-05 2009-05-14 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板の加工方法およびスクライブ装置
US20110107894A1 (en) * 2008-05-30 2011-05-12 Mitsuboshi Diamond Industrial Co., Ltd Brittle Material Substrate Chamfering Method
ITTO20080497A1 (it) * 2008-06-25 2009-12-26 Bottero Spa Metodo e macchina per il troncaggio di una lastra di vetro
KR101651557B1 (ko) 2009-04-10 2016-08-26 반도키코 가부시키가이샤 유리판 선긋기 장치
JP5777849B2 (ja) * 2009-05-29 2015-09-09 三星ダイヤモンド工業株式会社 ブレイク装置及びブレイク方法
JP5118736B2 (ja) * 2010-09-28 2013-01-16 三星ダイヤモンド工業株式会社 スクライブ方法及びスクライビングホイール
CN106626106A (zh) * 2011-01-07 2017-05-10 坂东机工株式会社 用于刻划碳化硅板的方法和设备
JP2013079170A (ja) * 2011-10-04 2013-05-02 Mitsuboshi Diamond Industrial Co Ltd スクライブ方法
JP5643737B2 (ja) * 2011-10-04 2014-12-17 三星ダイヤモンド工業株式会社 マザー基板のスクライブ方法
US20130112058A1 (en) * 2011-11-09 2013-05-09 James William Brown Methods of manufacturing a glass substrate
JP6344787B2 (ja) * 2012-11-30 2018-06-20 三星ダイヤモンド工業株式会社 セラミックス基板の分断方法及びスクライブ装置
JP6207307B2 (ja) * 2013-09-03 2017-10-04 三星ダイヤモンド工業株式会社 ブレイク装置
JP6119550B2 (ja) * 2013-10-16 2017-04-26 三星ダイヤモンド工業株式会社 エキスパンダ、破断装置及び分断方法
CN106458691B (zh) * 2014-05-30 2020-01-14 三星钻石工业股份有限公司 脆性基板的分断方法
KR102317663B1 (ko) 2014-05-30 2021-10-25 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 기판의 분단 방법
JP6432245B2 (ja) * 2014-09-26 2018-12-05 三星ダイヤモンド工業株式会社 基板分断方法
WO2016067728A1 (ja) * 2014-10-29 2016-05-06 三星ダイヤモンド工業株式会社 脆性基板の分断方法
JP6589362B2 (ja) * 2015-05-08 2019-10-16 三星ダイヤモンド工業株式会社 薄膜太陽電池の加工装置、および、薄膜太陽電池の加工方法
KR101819608B1 (ko) 2015-07-31 2018-01-17 코닝정밀소재 주식회사 유리 접합체 커팅 방법 및 커팅 장치
JP6547556B2 (ja) 2015-09-29 2019-07-24 三星ダイヤモンド工業株式会社 脆性基板の分断方法
TWI609754B (zh) * 2015-09-29 2018-01-01 三星鑽石工業股份有限公司 脆性基板之分斷方法
US10818550B2 (en) * 2016-04-29 2020-10-27 Flir Systems, Inc. Methods for singulation and packaging
KR102355278B1 (ko) * 2016-10-14 2022-01-25 니폰 덴키 가라스 가부시키가이샤 유리판의 제조 방법
JP6970554B2 (ja) * 2017-08-21 2021-11-24 株式会社ディスコ 加工方法
CN109164621A (zh) * 2018-09-12 2019-01-08 东莞通华液晶有限公司 一种高平整度液晶显示结构制作方法
JP7868312B2 (ja) * 2021-05-20 2026-06-02 日本電気硝子株式会社 板材の製造方法

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US3593899A (en) * 1969-10-02 1971-07-20 Ppg Industries Inc Glass-scoring process
US4213550A (en) * 1978-10-06 1980-07-22 Ppg Industries, Inc. Method of and apparatus for initiating a damage-free score in a refractory material
US4225070A (en) * 1979-05-09 1980-09-30 Ppg Industries, Inc. Method of simultaneously opening two scores transverse to one another
US4459888A (en) * 1979-12-03 1984-07-17 Beloit Corporation Non-contacting slitter
US4487350A (en) * 1983-04-07 1984-12-11 Ppg Industries, Inc. Method and apparatus for cutting pattern shaped holes in glass sheets
JP3042192B2 (ja) 1992-07-29 2000-05-15 三星ダイヤモンド工業株式会社 貼り合せガラス基板の裁断方法及びその装置
EP0678904A1 (en) * 1994-04-12 1995-10-25 Lsi Logic Corporation Multicut wafer saw process
JP3074143B2 (ja) 1995-11-06 2000-08-07 三星ダイヤモンド工業株式会社 ガラスカッターホイール
JP4058542B2 (ja) * 1997-05-30 2008-03-12 三星ダイヤモンド工業株式会社 基板ブレイク装置、基板ブレイク方法、基板分断装置および基板分断システム
US6796212B2 (en) * 2000-08-11 2004-09-28 Mitsuboshi Diamond Industrial Co., Ltd. Scribing method for brittle materials, a cutter wheel used therefor and an apparatus provided therewith
JP3792508B2 (ja) * 2000-12-19 2006-07-05 三星ダイヤモンド工業株式会社 貼り合わせ脆性基板の分断方法
KR100789454B1 (ko) 2002-02-09 2007-12-31 엘지.필립스 엘시디 주식회사 액정 패널의 절단 장치 및 그 방법
US8074551B2 (en) * 2002-02-26 2011-12-13 Lg Display Co., Ltd. Cutting wheel for liquid crystal display panel

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI409233B (zh) * 2005-07-06 2013-09-21 Mitsuboshi Diamond Ind Co Ltd The brittle material is a scribing wheel, a scribing method using the scribing wheel and a scribing device, and a scribing tool
TWI409232B (zh) * 2005-07-06 2013-09-21 Mitsuboshi Diamond Ind Co Ltd Method for manufacturing scratches for brittle materials
TWI409231B (zh) * 2005-07-06 2013-09-21 Mitsuboshi Diamond Ind Co Ltd Method for manufacturing scratches for brittle materials
TWI454433B (zh) * 2005-07-06 2014-10-01 Mitsuboshi Diamond Ind Co Ltd A scribing material for a brittle material and a method for manufacturing the same, a scribing method using a scribing wheel, a scribing device, and a scribing tool
TWI466837B (zh) * 2005-07-06 2015-01-01 Mitsuboshi Diamond Ind Co Ltd The brittle material is a scribing wheel, a scribing method using the scribing wheel and a scribing device, and a scribing tool

Also Published As

Publication number Publication date
TWI323727B (enExample) 2010-04-21
CN100418718C (zh) 2008-09-17
CN1741879A (zh) 2006-03-01
JPWO2004048058A1 (ja) 2006-03-23
ATE527091T1 (de) 2011-10-15
EP1579971A1 (en) 2005-09-28
EP1579971A4 (en) 2010-05-05
KR100657197B1 (ko) 2006-12-14
WO2004048058A1 (ja) 2004-06-10
AU2003302413A1 (en) 2004-06-18
KR20050083967A (ko) 2005-08-26
US20060126200A1 (en) 2006-06-15
EP1579971B1 (en) 2011-10-05
US7717311B2 (en) 2010-05-18
JP4167227B2 (ja) 2008-10-15

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MM4A Annulment or lapse of patent due to non-payment of fees