CN100418718C - 基板分断方法以及采用该方法的面板制造方法 - Google Patents

基板分断方法以及采用该方法的面板制造方法 Download PDF

Info

Publication number
CN100418718C
CN100418718C CNB2003801091489A CN200380109148A CN100418718C CN 100418718 C CN100418718 C CN 100418718C CN B2003801091489 A CNB2003801091489 A CN B2003801091489A CN 200380109148 A CN200380109148 A CN 200380109148A CN 100418718 C CN100418718 C CN 100418718C
Authority
CN
China
Prior art keywords
substrate
score line
line
main
mentioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2003801091489A
Other languages
English (en)
Chinese (zh)
Other versions
CN1741879A (zh
Inventor
西尾仁孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN1741879A publication Critical patent/CN1741879A/zh
Application granted granted Critical
Publication of CN100418718C publication Critical patent/CN100418718C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
CNB2003801091489A 2002-11-22 2003-11-19 基板分断方法以及采用该方法的面板制造方法 Expired - Fee Related CN100418718C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP340051/2002 2002-11-22
JP2002340051 2002-11-22
PCT/JP2003/014772 WO2004048058A1 (ja) 2002-11-22 2003-11-19 基板分断方法およびその方法を用いたパネル製造方法

Publications (2)

Publication Number Publication Date
CN1741879A CN1741879A (zh) 2006-03-01
CN100418718C true CN100418718C (zh) 2008-09-17

Family

ID=32375802

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2003801091489A Expired - Fee Related CN100418718C (zh) 2002-11-22 2003-11-19 基板分断方法以及采用该方法的面板制造方法

Country Status (9)

Country Link
US (1) US7717311B2 (enExample)
EP (1) EP1579971B1 (enExample)
JP (1) JP4167227B2 (enExample)
KR (1) KR100657197B1 (enExample)
CN (1) CN100418718C (enExample)
AT (1) ATE527091T1 (enExample)
AU (1) AU2003302413A1 (enExample)
TW (1) TW200416205A (enExample)
WO (1) WO2004048058A1 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080286943A1 (en) * 2004-05-20 2008-11-20 Mitsuboshi Diamond Industrial Co., Ltd. Motherboard Cutting Method, Motherboard Scribing Apparatus, Program and Recording Medium
CN102276139B (zh) * 2004-07-16 2014-08-06 三星钻石工业股份有限公司 刀轮及其制造方法、手动划线工具及划线装置
KR101164847B1 (ko) * 2005-07-06 2012-07-11 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료용 스크라이빙 휠, 및 이를 이용한 스크라이브 방법, 스크라이브 장치 및 스크라이브 공구
JP2007208230A (ja) * 2006-02-01 2007-08-16 Seiko Npc Corp 貼り合わせ基板のダイシング方法
DE102007045383A1 (de) * 2007-09-22 2008-07-17 Bohle Ag Verfahren zur Herstellung von Schneidrädchen
WO2009060691A1 (ja) * 2007-11-05 2009-05-14 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板の加工方法およびスクライブ装置
CN102046346B (zh) * 2008-05-30 2014-04-09 三星钻石工业股份有限公司 脆性材料基板的倒角方法
ITTO20080497A1 (it) * 2008-06-25 2009-12-26 Bottero Spa Metodo e macchina per il troncaggio di una lastra di vetro
KR101651557B1 (ko) 2009-04-10 2016-08-26 반도키코 가부시키가이샤 유리판 선긋기 장치
JP5777849B2 (ja) * 2009-05-29 2015-09-09 三星ダイヤモンド工業株式会社 ブレイク装置及びブレイク方法
JP5118736B2 (ja) * 2010-09-28 2013-01-16 三星ダイヤモンド工業株式会社 スクライブ方法及びスクライビングホイール
KR20160078514A (ko) * 2011-01-07 2016-07-04 반도키코 가부시키가이샤 탄화 규소판의 스크라이브 방법 및 스크라이브 장치
JP5643737B2 (ja) * 2011-10-04 2014-12-17 三星ダイヤモンド工業株式会社 マザー基板のスクライブ方法
JP2013079170A (ja) * 2011-10-04 2013-05-02 Mitsuboshi Diamond Industrial Co Ltd スクライブ方法
US20130112058A1 (en) * 2011-11-09 2013-05-09 James William Brown Methods of manufacturing a glass substrate
JP6344787B2 (ja) * 2012-11-30 2018-06-20 三星ダイヤモンド工業株式会社 セラミックス基板の分断方法及びスクライブ装置
JP6207307B2 (ja) * 2013-09-03 2017-10-04 三星ダイヤモンド工業株式会社 ブレイク装置
JP6119550B2 (ja) * 2013-10-16 2017-04-26 三星ダイヤモンド工業株式会社 エキスパンダ、破断装置及び分断方法
CN106458690B (zh) * 2014-05-30 2020-01-14 三星钻石工业股份有限公司 脆性基板的分断方法
CN106458691B (zh) * 2014-05-30 2020-01-14 三星钻石工业股份有限公司 脆性基板的分断方法
JP6432245B2 (ja) * 2014-09-26 2018-12-05 三星ダイヤモンド工業株式会社 基板分断方法
CN107108322B (zh) * 2014-10-29 2020-01-14 三星钻石工业股份有限公司 脆性衬底的分断方法
JP6589362B2 (ja) * 2015-05-08 2019-10-16 三星ダイヤモンド工業株式会社 薄膜太陽電池の加工装置、および、薄膜太陽電池の加工方法
KR101819608B1 (ko) 2015-07-31 2018-01-17 코닝정밀소재 주식회사 유리 접합체 커팅 방법 및 커팅 장치
TWI609754B (zh) * 2015-09-29 2018-01-01 三星鑽石工業股份有限公司 脆性基板之分斷方法
JP6547556B2 (ja) 2015-09-29 2019-07-24 三星ダイヤモンド工業株式会社 脆性基板の分断方法
WO2017190060A1 (en) * 2016-04-29 2017-11-02 Flir Systems, Inc. Methods for singulation and packaging
US10919796B2 (en) * 2016-10-14 2021-02-16 Nippon Electric Glass Co., Ltd. Method for producing glass plate
JP6970554B2 (ja) * 2017-08-21 2021-11-24 株式会社ディスコ 加工方法
CN109164621A (zh) * 2018-09-12 2019-01-08 东莞通华液晶有限公司 一种高平整度液晶显示结构制作方法
JP2022178459A (ja) * 2021-05-20 2022-12-02 日本電気硝子株式会社 板材の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09188534A (ja) * 1995-11-06 1997-07-22 Mitsuboshi Daiyamondo Kogyo Kk ガラスカッターホイール
JPH10330125A (ja) * 1997-05-30 1998-12-15 Mitsuboshi Daiyamondo Kogyo Kk ブレイクマシン及びテーブルマット
CN1359784A (zh) * 2000-12-19 2002-07-24 三星钻石工业股份有限公司 脆性基板的分割方法及其装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3593899A (en) * 1969-10-02 1971-07-20 Ppg Industries Inc Glass-scoring process
US4213550A (en) * 1978-10-06 1980-07-22 Ppg Industries, Inc. Method of and apparatus for initiating a damage-free score in a refractory material
US4225070A (en) * 1979-05-09 1980-09-30 Ppg Industries, Inc. Method of simultaneously opening two scores transverse to one another
US4459888A (en) * 1979-12-03 1984-07-17 Beloit Corporation Non-contacting slitter
US4487350A (en) * 1983-04-07 1984-12-11 Ppg Industries, Inc. Method and apparatus for cutting pattern shaped holes in glass sheets
JP3042192B2 (ja) 1992-07-29 2000-05-15 三星ダイヤモンド工業株式会社 貼り合せガラス基板の裁断方法及びその装置
EP0678904A1 (en) * 1994-04-12 1995-10-25 Lsi Logic Corporation Multicut wafer saw process
TW544442B (en) * 2000-08-11 2003-08-01 Mitsuboshi Diamond Ind Co Ltd Cutter wheel for brittle material substrate and scriber
KR100789454B1 (ko) 2002-02-09 2007-12-31 엘지.필립스 엘시디 주식회사 액정 패널의 절단 장치 및 그 방법
US8074551B2 (en) * 2002-02-26 2011-12-13 Lg Display Co., Ltd. Cutting wheel for liquid crystal display panel

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09188534A (ja) * 1995-11-06 1997-07-22 Mitsuboshi Daiyamondo Kogyo Kk ガラスカッターホイール
JPH10330125A (ja) * 1997-05-30 1998-12-15 Mitsuboshi Daiyamondo Kogyo Kk ブレイクマシン及びテーブルマット
CN1359784A (zh) * 2000-12-19 2002-07-24 三星钻石工业股份有限公司 脆性基板的分割方法及其装置

Also Published As

Publication number Publication date
CN1741879A (zh) 2006-03-01
US20060126200A1 (en) 2006-06-15
EP1579971A1 (en) 2005-09-28
EP1579971A4 (en) 2010-05-05
JPWO2004048058A1 (ja) 2006-03-23
KR100657197B1 (ko) 2006-12-14
ATE527091T1 (de) 2011-10-15
KR20050083967A (ko) 2005-08-26
US7717311B2 (en) 2010-05-18
TW200416205A (en) 2004-09-01
WO2004048058A1 (ja) 2004-06-10
EP1579971B1 (en) 2011-10-05
TWI323727B (enExample) 2010-04-21
JP4167227B2 (ja) 2008-10-15
AU2003302413A1 (en) 2004-06-18

Similar Documents

Publication Publication Date Title
CN100418718C (zh) 基板分断方法以及采用该方法的面板制造方法
CN102161218B (zh) 刀轮、使用其的脆性材料基板的划线方法及分割方法、刀轮的制造方法
CN102057314B (zh) 基板加工系统
TWI424224B (zh) 母板之基板加工方法
KR102205577B1 (ko) 접합 기판의 브레이크 방법
TWI320031B (en) Method of cutting a glass substrate
JP5171522B2 (ja) 脆性材料基板のスクライブ方法
EP2174762A1 (en) Method for scribing bonded substrates
US6576149B1 (en) Method and device for parting laminated substrate for liquid crystal cell
JP2015221739A (ja) 表示装置の製造方法
JPWO2009154013A1 (ja) マザー基板からの単位表示パネルの取り出し方法
JP2003114420A (ja) 液晶表示パネルの製造方法
JP2002031806A (ja) 液晶表示素子の製造方法
TWI667515B (zh) 液晶顯示面板之製造方法
CN102375260B (zh) 面板制造方法、面板与显示面板结构
JP3753636B2 (ja) 液晶表示パネルの製造方法
CN111718117A (zh) 基板分断方法及基板分断装置
JP6297192B2 (ja) 貼り合わせ基板のブレイク装置
TWI690401B (zh) 裂斷裝置、裂斷系統及裂斷單元
JP2653447B2 (ja) 液晶表示素子の製造方法
KR100720438B1 (ko) 액정표시장치의 컷팅 방법
JP6959734B2 (ja) セル
JP2008003388A (ja) フラットパネルディスプレイおよびその製造方法
JP2017100924A (ja) 分断装置
CN104635963A (zh) 触控显示装置与其制造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080917

Termination date: 20211119