ATE527091T1 - Verfahren zum teilen eines substrats und ein verfahren zur herstellung eines panels - Google Patents

Verfahren zum teilen eines substrats und ein verfahren zur herstellung eines panels

Info

Publication number
ATE527091T1
ATE527091T1 AT03811902T AT03811902T ATE527091T1 AT E527091 T1 ATE527091 T1 AT E527091T1 AT 03811902 T AT03811902 T AT 03811902T AT 03811902 T AT03811902 T AT 03811902T AT E527091 T1 ATE527091 T1 AT E527091T1
Authority
AT
Austria
Prior art keywords
broken
scribe lines
substrate
lines
scribed
Prior art date
Application number
AT03811902T
Other languages
German (de)
English (en)
Inventor
Yoshitaka Nishio
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Application granted granted Critical
Publication of ATE527091T1 publication Critical patent/ATE527091T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
AT03811902T 2002-11-22 2003-11-19 Verfahren zum teilen eines substrats und ein verfahren zur herstellung eines panels ATE527091T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002340051 2002-11-22
PCT/JP2003/014772 WO2004048058A1 (ja) 2002-11-22 2003-11-19 基板分断方法およびその方法を用いたパネル製造方法

Publications (1)

Publication Number Publication Date
ATE527091T1 true ATE527091T1 (de) 2011-10-15

Family

ID=32375802

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03811902T ATE527091T1 (de) 2002-11-22 2003-11-19 Verfahren zum teilen eines substrats und ein verfahren zur herstellung eines panels

Country Status (9)

Country Link
US (1) US7717311B2 (enExample)
EP (1) EP1579971B1 (enExample)
JP (1) JP4167227B2 (enExample)
KR (1) KR100657197B1 (enExample)
CN (1) CN100418718C (enExample)
AT (1) ATE527091T1 (enExample)
AU (1) AU2003302413A1 (enExample)
TW (1) TW200416205A (enExample)
WO (1) WO2004048058A1 (enExample)

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US20080286943A1 (en) * 2004-05-20 2008-11-20 Mitsuboshi Diamond Industrial Co., Ltd. Motherboard Cutting Method, Motherboard Scribing Apparatus, Program and Recording Medium
CN102276139B (zh) * 2004-07-16 2014-08-06 三星钻石工业股份有限公司 刀轮及其制造方法、手动划线工具及划线装置
KR101164847B1 (ko) * 2005-07-06 2012-07-11 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료용 스크라이빙 휠, 및 이를 이용한 스크라이브 방법, 스크라이브 장치 및 스크라이브 공구
JP2007208230A (ja) * 2006-02-01 2007-08-16 Seiko Npc Corp 貼り合わせ基板のダイシング方法
DE102007045383A1 (de) * 2007-09-22 2008-07-17 Bohle Ag Verfahren zur Herstellung von Schneidrädchen
WO2009060691A1 (ja) * 2007-11-05 2009-05-14 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板の加工方法およびスクライブ装置
CN102046346B (zh) * 2008-05-30 2014-04-09 三星钻石工业股份有限公司 脆性材料基板的倒角方法
ITTO20080497A1 (it) * 2008-06-25 2009-12-26 Bottero Spa Metodo e macchina per il troncaggio di una lastra di vetro
KR101651557B1 (ko) 2009-04-10 2016-08-26 반도키코 가부시키가이샤 유리판 선긋기 장치
JP5777849B2 (ja) * 2009-05-29 2015-09-09 三星ダイヤモンド工業株式会社 ブレイク装置及びブレイク方法
JP5118736B2 (ja) * 2010-09-28 2013-01-16 三星ダイヤモンド工業株式会社 スクライブ方法及びスクライビングホイール
KR20160078514A (ko) * 2011-01-07 2016-07-04 반도키코 가부시키가이샤 탄화 규소판의 스크라이브 방법 및 스크라이브 장치
JP5643737B2 (ja) * 2011-10-04 2014-12-17 三星ダイヤモンド工業株式会社 マザー基板のスクライブ方法
JP2013079170A (ja) * 2011-10-04 2013-05-02 Mitsuboshi Diamond Industrial Co Ltd スクライブ方法
US20130112058A1 (en) * 2011-11-09 2013-05-09 James William Brown Methods of manufacturing a glass substrate
JP6344787B2 (ja) * 2012-11-30 2018-06-20 三星ダイヤモンド工業株式会社 セラミックス基板の分断方法及びスクライブ装置
JP6207307B2 (ja) * 2013-09-03 2017-10-04 三星ダイヤモンド工業株式会社 ブレイク装置
JP6119550B2 (ja) * 2013-10-16 2017-04-26 三星ダイヤモンド工業株式会社 エキスパンダ、破断装置及び分断方法
CN106458690B (zh) * 2014-05-30 2020-01-14 三星钻石工业股份有限公司 脆性基板的分断方法
CN106458691B (zh) * 2014-05-30 2020-01-14 三星钻石工业股份有限公司 脆性基板的分断方法
JP6432245B2 (ja) * 2014-09-26 2018-12-05 三星ダイヤモンド工業株式会社 基板分断方法
CN107108322B (zh) * 2014-10-29 2020-01-14 三星钻石工业股份有限公司 脆性衬底的分断方法
JP6589362B2 (ja) * 2015-05-08 2019-10-16 三星ダイヤモンド工業株式会社 薄膜太陽電池の加工装置、および、薄膜太陽電池の加工方法
KR101819608B1 (ko) 2015-07-31 2018-01-17 코닝정밀소재 주식회사 유리 접합체 커팅 방법 및 커팅 장치
TWI609754B (zh) * 2015-09-29 2018-01-01 三星鑽石工業股份有限公司 脆性基板之分斷方法
JP6547556B2 (ja) 2015-09-29 2019-07-24 三星ダイヤモンド工業株式会社 脆性基板の分断方法
WO2017190060A1 (en) * 2016-04-29 2017-11-02 Flir Systems, Inc. Methods for singulation and packaging
US10919796B2 (en) * 2016-10-14 2021-02-16 Nippon Electric Glass Co., Ltd. Method for producing glass plate
JP6970554B2 (ja) * 2017-08-21 2021-11-24 株式会社ディスコ 加工方法
CN109164621A (zh) * 2018-09-12 2019-01-08 东莞通华液晶有限公司 一种高平整度液晶显示结构制作方法
JP2022178459A (ja) * 2021-05-20 2022-12-02 日本電気硝子株式会社 板材の製造方法

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US3593899A (en) * 1969-10-02 1971-07-20 Ppg Industries Inc Glass-scoring process
US4213550A (en) * 1978-10-06 1980-07-22 Ppg Industries, Inc. Method of and apparatus for initiating a damage-free score in a refractory material
US4225070A (en) * 1979-05-09 1980-09-30 Ppg Industries, Inc. Method of simultaneously opening two scores transverse to one another
US4459888A (en) * 1979-12-03 1984-07-17 Beloit Corporation Non-contacting slitter
US4487350A (en) * 1983-04-07 1984-12-11 Ppg Industries, Inc. Method and apparatus for cutting pattern shaped holes in glass sheets
JP3042192B2 (ja) 1992-07-29 2000-05-15 三星ダイヤモンド工業株式会社 貼り合せガラス基板の裁断方法及びその装置
EP0678904A1 (en) * 1994-04-12 1995-10-25 Lsi Logic Corporation Multicut wafer saw process
JP3074143B2 (ja) * 1995-11-06 2000-08-07 三星ダイヤモンド工業株式会社 ガラスカッターホイール
JP4058542B2 (ja) * 1997-05-30 2008-03-12 三星ダイヤモンド工業株式会社 基板ブレイク装置、基板ブレイク方法、基板分断装置および基板分断システム
TW544442B (en) * 2000-08-11 2003-08-01 Mitsuboshi Diamond Ind Co Ltd Cutter wheel for brittle material substrate and scriber
JP3792508B2 (ja) * 2000-12-19 2006-07-05 三星ダイヤモンド工業株式会社 貼り合わせ脆性基板の分断方法
KR100789454B1 (ko) 2002-02-09 2007-12-31 엘지.필립스 엘시디 주식회사 액정 패널의 절단 장치 및 그 방법
US8074551B2 (en) * 2002-02-26 2011-12-13 Lg Display Co., Ltd. Cutting wheel for liquid crystal display panel

Also Published As

Publication number Publication date
CN1741879A (zh) 2006-03-01
US20060126200A1 (en) 2006-06-15
EP1579971A1 (en) 2005-09-28
EP1579971A4 (en) 2010-05-05
JPWO2004048058A1 (ja) 2006-03-23
CN100418718C (zh) 2008-09-17
KR100657197B1 (ko) 2006-12-14
KR20050083967A (ko) 2005-08-26
US7717311B2 (en) 2010-05-18
TW200416205A (en) 2004-09-01
WO2004048058A1 (ja) 2004-06-10
EP1579971B1 (en) 2011-10-05
TWI323727B (enExample) 2010-04-21
JP4167227B2 (ja) 2008-10-15
AU2003302413A1 (en) 2004-06-18

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