KR100657197B1 - 기판절단방법 및 그 방법을 이용한 패널제조방법 - Google Patents

기판절단방법 및 그 방법을 이용한 패널제조방법 Download PDF

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Publication number
KR100657197B1
KR100657197B1 KR1020057009268A KR20057009268A KR100657197B1 KR 100657197 B1 KR100657197 B1 KR 100657197B1 KR 1020057009268 A KR1020057009268 A KR 1020057009268A KR 20057009268 A KR20057009268 A KR 20057009268A KR 100657197 B1 KR100657197 B1 KR 100657197B1
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KR
South Korea
Prior art keywords
substrate
scribe line
main
cutting
line
Prior art date
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Expired - Fee Related
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KR1020057009268A
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English (en)
Korean (ko)
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KR20050083967A (ko
Inventor
요시타카 니시오
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20050083967A publication Critical patent/KR20050083967A/ko
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
KR1020057009268A 2002-11-22 2003-11-19 기판절단방법 및 그 방법을 이용한 패널제조방법 Expired - Fee Related KR100657197B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00340051 2002-11-22
JP2002340051 2002-11-22
PCT/JP2003/014772 WO2004048058A1 (ja) 2002-11-22 2003-11-19 基板分断方法およびその方法を用いたパネル製造方法

Publications (2)

Publication Number Publication Date
KR20050083967A KR20050083967A (ko) 2005-08-26
KR100657197B1 true KR100657197B1 (ko) 2006-12-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057009268A Expired - Fee Related KR100657197B1 (ko) 2002-11-22 2003-11-19 기판절단방법 및 그 방법을 이용한 패널제조방법

Country Status (9)

Country Link
US (1) US7717311B2 (enExample)
EP (1) EP1579971B1 (enExample)
JP (1) JP4167227B2 (enExample)
KR (1) KR100657197B1 (enExample)
CN (1) CN100418718C (enExample)
AT (1) ATE527091T1 (enExample)
AU (1) AU2003302413A1 (enExample)
TW (1) TW200416205A (enExample)
WO (1) WO2004048058A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170014738A (ko) 2015-07-31 2017-02-08 코닝정밀소재 주식회사 유리 접합체 커팅 방법 및 커팅 장치

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US20080286943A1 (en) * 2004-05-20 2008-11-20 Mitsuboshi Diamond Industrial Co., Ltd. Motherboard Cutting Method, Motherboard Scribing Apparatus, Program and Recording Medium
CN102276139B (zh) * 2004-07-16 2014-08-06 三星钻石工业股份有限公司 刀轮及其制造方法、手动划线工具及划线装置
KR101164847B1 (ko) * 2005-07-06 2012-07-11 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료용 스크라이빙 휠, 및 이를 이용한 스크라이브 방법, 스크라이브 장치 및 스크라이브 공구
JP2007208230A (ja) * 2006-02-01 2007-08-16 Seiko Npc Corp 貼り合わせ基板のダイシング方法
DE102007045383A1 (de) * 2007-09-22 2008-07-17 Bohle Ag Verfahren zur Herstellung von Schneidrädchen
WO2009060691A1 (ja) * 2007-11-05 2009-05-14 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板の加工方法およびスクライブ装置
CN102046346B (zh) * 2008-05-30 2014-04-09 三星钻石工业股份有限公司 脆性材料基板的倒角方法
ITTO20080497A1 (it) * 2008-06-25 2009-12-26 Bottero Spa Metodo e macchina per il troncaggio di una lastra di vetro
KR101651557B1 (ko) 2009-04-10 2016-08-26 반도키코 가부시키가이샤 유리판 선긋기 장치
JP5777849B2 (ja) * 2009-05-29 2015-09-09 三星ダイヤモンド工業株式会社 ブレイク装置及びブレイク方法
JP5118736B2 (ja) * 2010-09-28 2013-01-16 三星ダイヤモンド工業株式会社 スクライブ方法及びスクライビングホイール
KR20160078514A (ko) * 2011-01-07 2016-07-04 반도키코 가부시키가이샤 탄화 규소판의 스크라이브 방법 및 스크라이브 장치
JP5643737B2 (ja) * 2011-10-04 2014-12-17 三星ダイヤモンド工業株式会社 マザー基板のスクライブ方法
JP2013079170A (ja) * 2011-10-04 2013-05-02 Mitsuboshi Diamond Industrial Co Ltd スクライブ方法
US20130112058A1 (en) * 2011-11-09 2013-05-09 James William Brown Methods of manufacturing a glass substrate
JP6344787B2 (ja) * 2012-11-30 2018-06-20 三星ダイヤモンド工業株式会社 セラミックス基板の分断方法及びスクライブ装置
JP6207307B2 (ja) * 2013-09-03 2017-10-04 三星ダイヤモンド工業株式会社 ブレイク装置
JP6119550B2 (ja) * 2013-10-16 2017-04-26 三星ダイヤモンド工業株式会社 エキスパンダ、破断装置及び分断方法
CN106458690B (zh) * 2014-05-30 2020-01-14 三星钻石工业股份有限公司 脆性基板的分断方法
CN106458691B (zh) * 2014-05-30 2020-01-14 三星钻石工业股份有限公司 脆性基板的分断方法
JP6432245B2 (ja) * 2014-09-26 2018-12-05 三星ダイヤモンド工業株式会社 基板分断方法
CN107108322B (zh) * 2014-10-29 2020-01-14 三星钻石工业股份有限公司 脆性衬底的分断方法
JP6589362B2 (ja) * 2015-05-08 2019-10-16 三星ダイヤモンド工業株式会社 薄膜太陽電池の加工装置、および、薄膜太陽電池の加工方法
TWI609754B (zh) * 2015-09-29 2018-01-01 三星鑽石工業股份有限公司 脆性基板之分斷方法
JP6547556B2 (ja) 2015-09-29 2019-07-24 三星ダイヤモンド工業株式会社 脆性基板の分断方法
WO2017190060A1 (en) * 2016-04-29 2017-11-02 Flir Systems, Inc. Methods for singulation and packaging
US10919796B2 (en) * 2016-10-14 2021-02-16 Nippon Electric Glass Co., Ltd. Method for producing glass plate
JP6970554B2 (ja) * 2017-08-21 2021-11-24 株式会社ディスコ 加工方法
CN109164621A (zh) * 2018-09-12 2019-01-08 东莞通华液晶有限公司 一种高平整度液晶显示结构制作方法
JP2022178459A (ja) * 2021-05-20 2022-12-02 日本電気硝子株式会社 板材の製造方法

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Publication number Priority date Publication date Assignee Title
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Also Published As

Publication number Publication date
CN1741879A (zh) 2006-03-01
US20060126200A1 (en) 2006-06-15
EP1579971A1 (en) 2005-09-28
EP1579971A4 (en) 2010-05-05
JPWO2004048058A1 (ja) 2006-03-23
CN100418718C (zh) 2008-09-17
ATE527091T1 (de) 2011-10-15
KR20050083967A (ko) 2005-08-26
US7717311B2 (en) 2010-05-18
TW200416205A (en) 2004-09-01
WO2004048058A1 (ja) 2004-06-10
EP1579971B1 (en) 2011-10-05
TWI323727B (enExample) 2010-04-21
JP4167227B2 (ja) 2008-10-15
AU2003302413A1 (en) 2004-06-18

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