SG96162A1 - Automatic molding machine using release film - Google Patents

Automatic molding machine using release film

Info

Publication number
SG96162A1
SG96162A1 SG9610470A SG1996010470A SG96162A1 SG 96162 A1 SG96162 A1 SG 96162A1 SG 9610470 A SG9610470 A SG 9610470A SG 1996010470 A SG1996010470 A SG 1996010470A SG 96162 A1 SG96162 A1 SG 96162A1
Authority
SG
Singapore
Prior art keywords
molding machine
release film
automatic molding
automatic
release
Prior art date
Application number
SG9610470A
Other languages
English (en)
Inventor
Miyajima Fumio
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP21507895A external-priority patent/JP3545507B2/ja
Priority claimed from JP24145695A external-priority patent/JP3557296B2/ja
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of SG96162A1 publication Critical patent/SG96162A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C45/1468—Plants therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5825—Measuring, controlling or regulating dimensions or shape, e.g. size, thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5891—Measuring, controlling or regulating using imaging devices, e.g. cameras
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/42—Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots
    • B29C2045/425—Single device for unloading moulded articles and loading inserts into the mould

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
SG9610470A 1995-08-23 1996-08-19 Automatic molding machine using release film SG96162A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP21507895A JP3545507B2 (ja) 1995-08-23 1995-08-23 リリースフィルムを用いる自動モールド装置
JP21508095 1995-08-23
JP24145695A JP3557296B2 (ja) 1995-09-20 1995-09-20 樹脂モールド装置の搬送ヘッド

Publications (1)

Publication Number Publication Date
SG96162A1 true SG96162A1 (en) 2003-05-23

Family

ID=27329715

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9610470A SG96162A1 (en) 1995-08-23 1996-08-19 Automatic molding machine using release film

Country Status (6)

Country Link
US (1) US5891483A (ko)
EP (1) EP0759349B1 (ko)
KR (1) KR100221110B1 (ko)
CN (1) CN1061927C (ko)
SG (1) SG96162A1 (ko)
TW (1) TW349903B (ko)

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* Cited by examiner, † Cited by third party
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JP3017470B2 (ja) * 1997-07-11 2000-03-06 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
EP0971401B1 (en) * 1998-07-10 2010-06-09 Apic Yamada Corporation Method of manufacturing semiconductor devices and a resin molding machine therefor
JP3494586B2 (ja) * 1999-03-26 2004-02-09 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP3578262B2 (ja) * 1999-04-06 2004-10-20 日東電工株式会社 半導体チップの樹脂封止方法及びその方法に使用する離型フィルム
US8141240B2 (en) 1999-08-04 2012-03-27 Super Talent Electronics, Inc. Manufacturing method for micro-SD flash memory card
US7941916B1 (en) 2004-07-08 2011-05-17 Super Talent Electronics, Inc. Manufacturing method for memory card
US6312976B1 (en) 1999-11-22 2001-11-06 Advanced Semiconductor Engineering, Inc. Method for manufacturing leadless semiconductor chip package
US20080286990A1 (en) * 2003-12-02 2008-11-20 Super Talent Electronics, Inc. Direct Package Mold Process For Single Chip SD Flash Cards
TW509615B (en) * 2000-04-21 2002-11-11 Apic Yamada Corp Resin molding machine and resin tablet feeding machine
US6770236B2 (en) * 2000-08-22 2004-08-03 Apic Yamada Corp. Method of resin molding
US8102657B2 (en) 2003-12-02 2012-01-24 Super Talent Electronics, Inc. Single shot molding method for COB USB/EUSB devices with contact pad ribs
US8998620B2 (en) * 2003-12-02 2015-04-07 Super Talent Technology, Corp. Molding method for COB-EUSB devices and metal housing package
US7673080B1 (en) 2004-02-12 2010-03-02 Super Talent Electronics, Inc. Differential data transfer for flash memory card
US7173826B1 (en) 2004-03-08 2007-02-06 Super Talent Electronics, Inc. PC card assembly with frame having longitudinal slot
US20050195581A1 (en) * 2004-03-08 2005-09-08 Super Talent Electronics, Inc. PC card assembly with panels having substantially identical connection structures
US7433196B1 (en) 2004-04-14 2008-10-07 Super Talent Electronics, Inc. Card-type electronic apparatus assembly using ultrasonic joining
US7008240B1 (en) 2004-04-16 2006-03-07 Super Talent Electronics, Inc. PC card assembly
US7261532B2 (en) * 2004-06-02 2007-08-28 Nissha Printing Co., Ltd. In-mold decoration apparatus and horizontal direction decorating sheet feeding machine
US20050281010A1 (en) * 2004-06-18 2005-12-22 Super Talent Electronics, Inc. Contact pad arrangement for integrated SD/MMC system
US7032827B2 (en) * 2004-06-18 2006-04-25 Super Talent Electronics, Inc. Combination SD/MMC flash memory card with thirteen contact pads
US20080195817A1 (en) * 2004-07-08 2008-08-14 Super Talent Electronics, Inc. SD Flash Memory Card Manufacturing Using Rigid-Flex PCB
US7009846B1 (en) 2004-07-30 2006-03-07 Super Talent Electronics, Inc. 13-Pin socket for combination SD/MMC flash memory system
US7235423B1 (en) 2004-11-05 2007-06-26 Super Talent Electronics, Inc. Molded memory card production using carrier strip
US8254134B2 (en) * 2007-05-03 2012-08-28 Super Talent Electronics, Inc. Molded memory card with write protection switch assembly
US8102658B2 (en) * 2007-07-05 2012-01-24 Super Talent Electronics, Inc. Micro-SD to secure digital adaptor card and manufacturing method
WO2011153528A1 (en) * 2010-06-04 2011-12-08 Woodbridge Corporation Process for producing a molded product
CN101950725A (zh) * 2010-07-20 2011-01-19 铜陵三佳科技股份有限公司 一种自动封装设备控制系统
CN102371646A (zh) * 2010-08-11 2012-03-14 联想(北京)有限公司 一种工件的制备方法
CN202062786U (zh) * 2011-06-02 2011-12-07 京东方科技集团股份有限公司 离型膜回收检测装置及离型膜回收设备
SG191479A1 (en) * 2011-12-27 2013-07-31 Apic Yamada Corp Method for resin molding and resin molding apparatus
US9040352B2 (en) 2012-06-28 2015-05-26 Freescale Semiconductor, Inc. Film-assist molded gel-fill cavity package with overflow reservoir
CN103465419A (zh) * 2013-09-16 2013-12-25 铜陵荣鑫机械有限公司 大功率led球形封装成型机
KR102504837B1 (ko) 2018-07-23 2023-02-28 삼성전자 주식회사 이형 필름 공급 장치를 포함하는 수지 성형 장치
CN111791417A (zh) * 2020-05-31 2020-10-20 石门县达韵电子有限公司 一种智能音模成型机
CN116061455B (zh) * 2023-04-06 2023-06-23 喜跃发国际环保新材料股份有限公司 网裂贴的加工工艺及加工系统

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Publication number Priority date Publication date Assignee Title
DE1504777A1 (de) * 1963-09-10 1969-11-13 Rogers Corp Verfahren und Vorrichtung zur Herstellung verstaerkter folienfoermiger Werkstoffe
JPS6458617A (en) * 1987-08-18 1989-03-06 Michio Osada Method and apparatus for continuous and automatic formation of resin sealed package
EP0665584A1 (en) * 1994-01-27 1995-08-02 " 3P" Licensing B.V. Method for encasing an electronic component with a hardening plastic, electronic components with plastic encasement obtained by this method, and mould for carrying out the method

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JPS59215847A (ja) * 1983-05-24 1984-12-05 Yokohama Rubber Co Ltd:The コンベヤベルトの製造方法
FR2546810B1 (fr) * 1983-05-30 1986-03-21 Saint Gobain Vitrage Procede et dispositif pour la fabrication de feuilles de matiere plastique de bonne qualite optique, par coulee
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JPS6248050A (ja) * 1985-08-28 1987-03-02 Seiei Kosan Kk 半導体デバイス等のパツケ−ジング方法
JPS6315715A (ja) * 1986-07-08 1988-01-22 Sanshin Kogyo Kk 自動封止成型装置
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JPH0629333A (ja) * 1992-07-08 1994-02-04 Hitachi Ltd 樹脂封止パッケージの成形装置
JPH0747596A (ja) * 1993-08-03 1995-02-21 Mitsubishi Heavy Ind Ltd 繊維強化熱可塑性樹脂系複合材料の曲げ成形法
US5478517A (en) * 1994-02-28 1995-12-26 Gennum Corporation Method for molding IC chips
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1504777A1 (de) * 1963-09-10 1969-11-13 Rogers Corp Verfahren und Vorrichtung zur Herstellung verstaerkter folienfoermiger Werkstoffe
JPS6458617A (en) * 1987-08-18 1989-03-06 Michio Osada Method and apparatus for continuous and automatic formation of resin sealed package
EP0665584A1 (en) * 1994-01-27 1995-08-02 " 3P" Licensing B.V. Method for encasing an electronic component with a hardening plastic, electronic components with plastic encasement obtained by this method, and mould for carrying out the method

Also Published As

Publication number Publication date
CN1061927C (zh) 2001-02-14
EP0759349B1 (en) 2002-06-05
US5891483A (en) 1999-04-06
EP0759349A3 (en) 1997-12-17
TW349903B (en) 1999-01-11
CN1149526A (zh) 1997-05-14
EP0759349A2 (en) 1997-02-26
KR100221110B1 (ko) 1999-09-15
KR970013249A (ko) 1997-03-29

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