TW349903B - Automatic molding machine using release film - Google Patents

Automatic molding machine using release film

Info

Publication number
TW349903B
TW349903B TW085110064A TW85110064A TW349903B TW 349903 B TW349903 B TW 349903B TW 085110064 A TW085110064 A TW 085110064A TW 85110064 A TW85110064 A TW 85110064A TW 349903 B TW349903 B TW 349903B
Authority
TW
Taiwan
Prior art keywords
molding
work piece
release film
feeding
press mechanism
Prior art date
Application number
TW085110064A
Other languages
English (en)
Inventor
Fumio Miyajima
Original Assignee
Apic Yamada Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP21507895A external-priority patent/JP3545507B2/ja
Priority claimed from JP24145695A external-priority patent/JP3557296B2/ja
Application filed by Apic Yamada Kk filed Critical Apic Yamada Kk
Application granted granted Critical
Publication of TW349903B publication Critical patent/TW349903B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C45/1468—Plants therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5825—Measuring, controlling or regulating dimensions or shape, e.g. size, thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5891—Measuring, controlling or regulating using imaging devices, e.g. cameras
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/42—Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots
    • B29C2045/425—Single device for unloading moulded articles and loading inserts into the mould

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW085110064A 1995-08-23 1996-08-17 Automatic molding machine using release film TW349903B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP21507895A JP3545507B2 (ja) 1995-08-23 1995-08-23 リリースフィルムを用いる自動モールド装置
JP21508095 1995-08-23
JP24145695A JP3557296B2 (ja) 1995-09-20 1995-09-20 樹脂モールド装置の搬送ヘッド

Publications (1)

Publication Number Publication Date
TW349903B true TW349903B (en) 1999-01-11

Family

ID=27329715

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085110064A TW349903B (en) 1995-08-23 1996-08-17 Automatic molding machine using release film

Country Status (6)

Country Link
US (1) US5891483A (zh)
EP (1) EP0759349B1 (zh)
KR (1) KR100221110B1 (zh)
CN (1) CN1061927C (zh)
SG (1) SG96162A1 (zh)
TW (1) TW349903B (zh)

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JP3017470B2 (ja) * 1997-07-11 2000-03-06 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
DE69942479D1 (de) * 1998-07-10 2010-07-22 Apic Yamada Corp Verfahren zur Herstellung einer Halbleitervorrichtung und Harzformmaschine zu diesem Zweck
JP3494586B2 (ja) * 1999-03-26 2004-02-09 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP3578262B2 (ja) * 1999-04-06 2004-10-20 日東電工株式会社 半導体チップの樹脂封止方法及びその方法に使用する離型フィルム
US8141240B2 (en) 1999-08-04 2012-03-27 Super Talent Electronics, Inc. Manufacturing method for micro-SD flash memory card
US7941916B1 (en) 2004-07-08 2011-05-17 Super Talent Electronics, Inc. Manufacturing method for memory card
US6312976B1 (en) 1999-11-22 2001-11-06 Advanced Semiconductor Engineering, Inc. Method for manufacturing leadless semiconductor chip package
US20080286990A1 (en) * 2003-12-02 2008-11-20 Super Talent Electronics, Inc. Direct Package Mold Process For Single Chip SD Flash Cards
TW509615B (en) * 2000-04-21 2002-11-11 Apic Yamada Corp Resin molding machine and resin tablet feeding machine
US6770236B2 (en) * 2000-08-22 2004-08-03 Apic Yamada Corp. Method of resin molding
US8102657B2 (en) * 2003-12-02 2012-01-24 Super Talent Electronics, Inc. Single shot molding method for COB USB/EUSB devices with contact pad ribs
US8998620B2 (en) * 2003-12-02 2015-04-07 Super Talent Technology, Corp. Molding method for COB-EUSB devices and metal housing package
US7673080B1 (en) 2004-02-12 2010-03-02 Super Talent Electronics, Inc. Differential data transfer for flash memory card
US20050195581A1 (en) * 2004-03-08 2005-09-08 Super Talent Electronics, Inc. PC card assembly with panels having substantially identical connection structures
US7173826B1 (en) 2004-03-08 2007-02-06 Super Talent Electronics, Inc. PC card assembly with frame having longitudinal slot
US7433196B1 (en) 2004-04-14 2008-10-07 Super Talent Electronics, Inc. Card-type electronic apparatus assembly using ultrasonic joining
US7008240B1 (en) 2004-04-16 2006-03-07 Super Talent Electronics, Inc. PC card assembly
US7261532B2 (en) * 2004-06-02 2007-08-28 Nissha Printing Co., Ltd. In-mold decoration apparatus and horizontal direction decorating sheet feeding machine
US20050281010A1 (en) * 2004-06-18 2005-12-22 Super Talent Electronics, Inc. Contact pad arrangement for integrated SD/MMC system
US7032827B2 (en) * 2004-06-18 2006-04-25 Super Talent Electronics, Inc. Combination SD/MMC flash memory card with thirteen contact pads
US20080195817A1 (en) * 2004-07-08 2008-08-14 Super Talent Electronics, Inc. SD Flash Memory Card Manufacturing Using Rigid-Flex PCB
US7009846B1 (en) 2004-07-30 2006-03-07 Super Talent Electronics, Inc. 13-Pin socket for combination SD/MMC flash memory system
US7235423B1 (en) 2004-11-05 2007-06-26 Super Talent Electronics, Inc. Molded memory card production using carrier strip
US8254134B2 (en) * 2007-05-03 2012-08-28 Super Talent Electronics, Inc. Molded memory card with write protection switch assembly
US8102658B2 (en) * 2007-07-05 2012-01-24 Super Talent Electronics, Inc. Micro-SD to secure digital adaptor card and manufacturing method
CA2801216A1 (en) * 2010-06-04 2011-12-08 Woodbridge Corporation Process for producing a molded product
CN101950725A (zh) * 2010-07-20 2011-01-19 铜陵三佳科技股份有限公司 一种自动封装设备控制系统
CN102371646A (zh) * 2010-08-11 2012-03-14 联想(北京)有限公司 一种工件的制备方法
CN202062786U (zh) * 2011-06-02 2011-12-07 京东方科技集团股份有限公司 离型膜回收检测装置及离型膜回收设备
SG191479A1 (en) 2011-12-27 2013-07-31 Apic Yamada Corp Method for resin molding and resin molding apparatus
US9040352B2 (en) 2012-06-28 2015-05-26 Freescale Semiconductor, Inc. Film-assist molded gel-fill cavity package with overflow reservoir
CN103465419A (zh) * 2013-09-16 2013-12-25 铜陵荣鑫机械有限公司 大功率led球形封装成型机
KR102504837B1 (ko) 2018-07-23 2023-02-28 삼성전자 주식회사 이형 필름 공급 장치를 포함하는 수지 성형 장치
CN111791417A (zh) * 2020-05-31 2020-10-20 石门县达韵电子有限公司 一种智能音模成型机
CN116061455B (zh) * 2023-04-06 2023-06-23 喜跃发国际环保新材料股份有限公司 网裂贴的加工工艺及加工系统

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Also Published As

Publication number Publication date
CN1149526A (zh) 1997-05-14
EP0759349B1 (en) 2002-06-05
CN1061927C (zh) 2001-02-14
SG96162A1 (en) 2003-05-23
KR100221110B1 (ko) 1999-09-15
KR970013249A (ko) 1997-03-29
EP0759349A2 (en) 1997-02-26
US5891483A (en) 1999-04-06
EP0759349A3 (en) 1997-12-17

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Legal Events

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