JPS6458617A - Method and apparatus for continuous and automatic formation of resin sealed package - Google Patents

Method and apparatus for continuous and automatic formation of resin sealed package

Info

Publication number
JPS6458617A
JPS6458617A JP20599587A JP20599587A JPS6458617A JP S6458617 A JPS6458617 A JP S6458617A JP 20599587 A JP20599587 A JP 20599587A JP 20599587 A JP20599587 A JP 20599587A JP S6458617 A JPS6458617 A JP S6458617A
Authority
JP
Japan
Prior art keywords
resin
hoop material
heat resisting
engageable
dies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20599587A
Other languages
Japanese (ja)
Inventor
Michio Osada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP20599587A priority Critical patent/JPS6458617A/en
Publication of JPS6458617A publication Critical patent/JPS6458617A/en
Pending legal-status Critical Current

Links

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To permit a continuous formation of a highly reliable resin sealed packages by application of locking pressure between two dies wherein a heat resisting sheet is fed for each of the top and back side of a hoop material including article resin sealing areas, with the mating engageable depressions of these dies in engagement. CONSTITUTION:The formation of resin sealed packages is effected with a heat resisting sheet 10 placed in contact with each of the top and back side of a hoop material 9 including resin sealing area for articles 6. Since both heat resisting sheets 10 undergo locking pressure in a resin forming portion defined between the engageable depressions 11 of dies 1 and 2, said sheet 10 is firmly attached to the top and back sides of the hoop material 9 by the pressure application created between the top inner surface of the engageable depression 11 and the top side surface of the hoop material 9 and between the bottom inner surface of said depression and the back side surface of said hoop material. The resin flash can be easily and surely removed from the inner surfaces of the engageable depressions 11 and the top and back sides of the hoop material 9 by removing the heat resisting sheets 10 from both sides of the hoop material 9 after formation into the resin sealed configuration, whereby a plurality of articles can be automatically sealed by resin material continuously and effectively.
JP20599587A 1987-08-18 1987-08-18 Method and apparatus for continuous and automatic formation of resin sealed package Pending JPS6458617A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20599587A JPS6458617A (en) 1987-08-18 1987-08-18 Method and apparatus for continuous and automatic formation of resin sealed package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20599587A JPS6458617A (en) 1987-08-18 1987-08-18 Method and apparatus for continuous and automatic formation of resin sealed package

Publications (1)

Publication Number Publication Date
JPS6458617A true JPS6458617A (en) 1989-03-06

Family

ID=16516166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20599587A Pending JPS6458617A (en) 1987-08-18 1987-08-18 Method and apparatus for continuous and automatic formation of resin sealed package

Country Status (1)

Country Link
JP (1) JPS6458617A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0747942A3 (en) * 1995-05-02 1998-07-29 Texas Instruments Incorporated Improvements in or relating to integrated circuits
EP0933808A3 (en) * 1998-01-23 2000-03-22 Apic Yamada Corporation Resin sealing method and apparatus for a semiconductor device
SG96162A1 (en) * 1995-08-23 2003-05-23 Apic Yamada Corp Automatic molding machine using release film

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0747942A3 (en) * 1995-05-02 1998-07-29 Texas Instruments Incorporated Improvements in or relating to integrated circuits
US5891377A (en) * 1995-05-02 1999-04-06 Texas Instruments Incorporated Dambarless leadframe for molded component encapsulation
SG96162A1 (en) * 1995-08-23 2003-05-23 Apic Yamada Corp Automatic molding machine using release film
EP0933808A3 (en) * 1998-01-23 2000-03-22 Apic Yamada Corporation Resin sealing method and apparatus for a semiconductor device
US6459159B1 (en) 1998-01-23 2002-10-01 Apic Yamada Corporation Apparatus for sealing a semiconductor device utilizing a release film

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