SG88806A1 - Mram having semiconductor device integrated therein - Google Patents

Mram having semiconductor device integrated therein

Info

Publication number
SG88806A1
SG88806A1 SG200007284A SG200007284A SG88806A1 SG 88806 A1 SG88806 A1 SG 88806A1 SG 200007284 A SG200007284 A SG 200007284A SG 200007284 A SG200007284 A SG 200007284A SG 88806 A1 SG88806 A1 SG 88806A1
Authority
SG
Singapore
Prior art keywords
mram
semiconductor device
device integrated
integrated
semiconductor
Prior art date
Application number
SG200007284A
Other languages
English (en)
Inventor
Saied Tehrani
Jing Shi
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of SG88806A1 publication Critical patent/SG88806A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/10—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having two electrodes, e.g. diodes or MIM elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)
  • Hall/Mr Elements (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Junction Field-Effect Transistors (AREA)
SG200007284A 1999-12-13 2000-12-08 Mram having semiconductor device integrated therein SG88806A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/460,056 US6285581B1 (en) 1999-12-13 1999-12-13 MRAM having semiconductor device integrated therein

Publications (1)

Publication Number Publication Date
SG88806A1 true SG88806A1 (en) 2002-05-21

Family

ID=23827246

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200007284A SG88806A1 (en) 1999-12-13 2000-12-08 Mram having semiconductor device integrated therein

Country Status (7)

Country Link
US (1) US6285581B1 (zh)
EP (1) EP1109169B1 (zh)
JP (1) JP2001203332A (zh)
KR (1) KR20010062244A (zh)
CN (1) CN1200430C (zh)
DE (1) DE60021997T2 (zh)
SG (1) SG88806A1 (zh)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW440835B (en) * 1998-09-30 2001-06-16 Siemens Ag Magnetoresistive memory with raised interference security
EP1163676B1 (de) * 1999-03-19 2002-12-11 Infineon Technologies AG Speicherzellenanordnung und verfahren zu deren herstellung
JP4491870B2 (ja) * 1999-10-27 2010-06-30 ソニー株式会社 不揮発性メモリの駆動方法
EP1134743A3 (en) * 2000-03-13 2002-04-10 Matsushita Electric Industrial Co., Ltd. Magneto-resistive device and magneto-resistive effect type storage device
JP3604617B2 (ja) * 2000-06-12 2004-12-22 富士通株式会社 磁気検出素子
US6351409B1 (en) * 2001-01-04 2002-02-26 Motorola, Inc. MRAM write apparatus and method
US6649423B2 (en) * 2001-10-04 2003-11-18 Hewlett-Packard Development Company, L.P. Method for modifying switching field characteristics of magnetic tunnel junctions
US6636436B2 (en) 2001-10-25 2003-10-21 Hewlett-Packard Development Company, L.P. Isolation of memory cells in cross point arrays
US20030229058A1 (en) * 2001-11-13 2003-12-11 Moran Edmund J. Aryl aniline beta2 adrenergic receptor agonists
KR100465598B1 (ko) * 2001-12-26 2005-01-13 주식회사 하이닉스반도체 쇼트키 다이오드를 이용한 마그네틱 램
JP4157707B2 (ja) * 2002-01-16 2008-10-01 株式会社東芝 磁気メモリ
DE10209508B4 (de) * 2002-03-05 2009-01-15 Forschungszentrum Jülich GmbH Verfahren zur Speicherung von Daten in einem MRAM-Datenspeicher
US6927073B2 (en) * 2002-05-16 2005-08-09 Nova Research, Inc. Methods of fabricating magnetoresistive memory devices
JP3643823B2 (ja) 2002-09-30 2005-04-27 株式会社東芝 磁気抵抗効果素子
US6809388B2 (en) * 2002-10-31 2004-10-26 Hewlett-Packard Development Company, L.P. Magnetic sensor based on efficient spin injection into semiconductors
US20040089905A1 (en) * 2002-10-31 2004-05-13 Ossipov Viatcheslav V. Magnetic sensor using spin injection through a semiconductor with a graded doping profile
CN101114694A (zh) * 2002-11-26 2008-01-30 株式会社东芝 磁单元和磁存储器
JP2004179483A (ja) * 2002-11-28 2004-06-24 Hitachi Ltd 不揮発性磁気メモリ
US7528428B2 (en) * 2003-03-07 2009-05-05 Japan Science And Technology Agency Field-effect transistor with spin-dependent transmission characteristics and non-volatile memory using the same
JP2004319587A (ja) * 2003-04-11 2004-11-11 Sharp Corp メモリセル、メモリ装置及びメモリセル製造方法
JP2005109263A (ja) * 2003-09-30 2005-04-21 Toshiba Corp 磁性体素子及磁気メモリ
US6947333B2 (en) * 2003-10-30 2005-09-20 Hewlett-Packard Development Company, L.P. Memory device
DE602005022398D1 (de) * 2004-11-30 2010-09-02 Toshiba Kk Anordnung der Schreiblinien in einer MRAM-Vorrichtung
CN100459149C (zh) * 2005-03-24 2009-02-04 株式会社日立制作所 导电控制器件
EP1934984B1 (en) * 2005-09-30 2011-05-18 Nxp B.V. Nanowire magnetic random access memory
US8183652B2 (en) * 2007-02-12 2012-05-22 Avalanche Technology, Inc. Non-volatile magnetic memory with low switching current and high thermal stability
US20080246104A1 (en) * 2007-02-12 2008-10-09 Yadav Technology High Capacity Low Cost Multi-State Magnetic Memory
US8018011B2 (en) * 2007-02-12 2011-09-13 Avalanche Technology, Inc. Low cost multi-state magnetic memory
US8063459B2 (en) * 2007-02-12 2011-11-22 Avalanche Technologies, Inc. Non-volatile magnetic memory element with graded layer
US8058696B2 (en) * 2006-02-25 2011-11-15 Avalanche Technology, Inc. High capacity low cost multi-state magnetic memory
US8508984B2 (en) * 2006-02-25 2013-08-13 Avalanche Technology, Inc. Low resistance high-TMR magnetic tunnel junction and process for fabrication thereof
US7732881B2 (en) * 2006-11-01 2010-06-08 Avalanche Technology, Inc. Current-confined effect of magnetic nano-current-channel (NCC) for magnetic random access memory (MRAM)
US8535952B2 (en) * 2006-02-25 2013-09-17 Avalanche Technology, Inc. Method for manufacturing non-volatile magnetic memory
US8084835B2 (en) * 2006-10-20 2011-12-27 Avalanche Technology, Inc. Non-uniform switching based non-volatile magnetic based memory
US20070253245A1 (en) * 2006-04-27 2007-11-01 Yadav Technology High Capacity Low Cost Multi-Stacked Cross-Line Magnetic Memory
JP5072392B2 (ja) * 2007-03-08 2012-11-14 株式会社東芝 縦型スピントランジスタ及びその製造方法
JP2009064826A (ja) * 2007-09-04 2009-03-26 Tdk Corp スピントランジスタ及びその製造方法
JP5455313B2 (ja) * 2008-02-21 2014-03-26 株式会社東芝 磁気記憶素子及び磁気記憶装置
WO2009107780A1 (ja) * 2008-02-28 2009-09-03 日本電気株式会社 磁気抵抗記憶装置及びその動作方法
US8802451B2 (en) 2008-02-29 2014-08-12 Avalanche Technology Inc. Method for manufacturing high density non-volatile magnetic memory
JP4908540B2 (ja) 2009-03-25 2012-04-04 株式会社東芝 スピンｍｏｓｆｅｔおよびリコンフィギャラブルロジック回路
US7986572B2 (en) * 2009-08-17 2011-07-26 Magic Technologies, Inc. Magnetic memory capable of minimizing gate voltage stress in unselected memory cells
JP2013089890A (ja) * 2011-10-21 2013-05-13 Toshiba Corp 磁気記憶素子
TWI559450B (zh) * 2014-04-18 2016-11-21 力晶科技股份有限公司 記憶體結構及其操作方法
RU2573200C2 (ru) * 2014-11-20 2016-01-20 Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский университет "Московский институт электронной техники" Магниторезистивная ячейка памяти и способ ее использования
CN109859785B (zh) * 2019-01-11 2020-11-06 中电海康集团有限公司 一种时钟自适应访问mram的装置
WO2020160358A1 (en) * 2019-01-31 2020-08-06 Northwestern University Magnetic memory device using doped semiconductor layer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4780848A (en) * 1986-06-03 1988-10-25 Honeywell Inc. Magnetoresistive memory with multi-layer storage cells having layers of limited thickness
US5343422A (en) * 1993-02-23 1994-08-30 International Business Machines Corporation Nonvolatile magnetoresistive storage device using spin valve effect
US5734605A (en) * 1996-09-10 1998-03-31 Motorola, Inc. Multi-layer magnetic tunneling junction memory cells

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4320514A1 (de) * 1993-06-22 1995-01-05 Forschungszentrum Juelich Gmbh Neues optisches Schreibverfahren und Schichtsystem für magnetooptische Datenspeicher
US5745408A (en) * 1996-09-09 1998-04-28 Motorola, Inc. Multi-layer magnetic memory cell with low switching current
JP3655445B2 (ja) * 1996-09-17 2005-06-02 株式会社東芝 光半導体装置
WO1998025263A1 (en) * 1996-12-02 1998-06-11 Koninklijke Philips Electronics N.V. Lateral magneto-electronic device exploiting a quasi-two-dimensional electron gas
US5774394A (en) * 1997-05-22 1998-06-30 Motorola, Inc. Magnetic memory cell with increased GMR ratio
US5838608A (en) * 1997-06-16 1998-11-17 Motorola, Inc. Multi-layer magnetic random access memory and method for fabricating thereof
US5959880A (en) * 1997-12-18 1999-09-28 Motorola, Inc. Low aspect ratio magnetoresistive tunneling junction
US6069820A (en) * 1998-02-20 2000-05-30 Kabushiki Kaisha Toshiba Spin dependent conduction device
US5943574A (en) 1998-02-23 1999-08-24 Motorola, Inc. Method of fabricating 3D multilayer semiconductor circuits
DE69923386T2 (de) * 1998-05-13 2005-12-22 Sony Corp. Bauelement mit magnetischem Material und Adressierverfahren dafür
JPH11330387A (ja) * 1998-05-13 1999-11-30 Sony Corp 磁化制御方法、情報記録方法及び情報記録素子
JP4076197B2 (ja) * 1999-05-19 2008-04-16 株式会社東芝 磁性素子、記憶装置、磁気再生ヘッド、３端子素子、及び磁気ディスク装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4780848A (en) * 1986-06-03 1988-10-25 Honeywell Inc. Magnetoresistive memory with multi-layer storage cells having layers of limited thickness
US5343422A (en) * 1993-02-23 1994-08-30 International Business Machines Corporation Nonvolatile magnetoresistive storage device using spin valve effect
US5734605A (en) * 1996-09-10 1998-03-31 Motorola, Inc. Multi-layer magnetic tunneling junction memory cells

Also Published As

Publication number Publication date
CN1200430C (zh) 2005-05-04
DE60021997D1 (de) 2005-09-22
EP1109169A2 (en) 2001-06-20
EP1109169A3 (en) 2001-09-19
JP2001203332A (ja) 2001-07-27
US6285581B1 (en) 2001-09-04
EP1109169B1 (en) 2005-08-17
KR20010062244A (ko) 2001-07-07
CN1300077A (zh) 2001-06-20
DE60021997T2 (de) 2006-01-26

Similar Documents

Publication Publication Date Title
SG88806A1 (en) Mram having semiconductor device integrated therein
EP1164595A4 (en) SEMICONDUCTOR DEVICE
SG97903A1 (en) Semiconductor device
SG99939A1 (en) Semiconductor device
EP1231640A4 (en) SEMICONDUCTOR COMPONENT
GB2373634B (en) Semiconductor device
TW576544U (en) Semiconductor device
GB0000106D0 (en) Semiconductor device
EP1179851A4 (en) SEMICONDUCTOR
EP1310963A4 (en) SEMICONDUCTOR MEMORY MODULE
GB0129958D0 (en) Semiconductor memory device
GB2370916B (en) Semiconductor device
GB2347014B (en) Semiconductor device
GB2356489B (en) Semiconductor device
EP1229591A4 (en) SEMICONDUCTOR DEVICE
GB2365621B (en) Semiconductor device
EP1220071A4 (en) SEMICONDUCTOR DEVICE
EP1143453A4 (en) Semiconductor memory device
GB2354865B (en) Semi-conductor memory device
GB0000354D0 (en) Semiconductor memory device
SG109474A1 (en) Semiconductor device
SG97851A1 (en) Semiconductor memory device
EP1209752A4 (en) SEMICONDUCTOR DEVICE
EP1211733A4 (en) SEMICONDUCTOR DEVICE
GB2348556B (en) Semiconductor device