SG77619A1 - Electrically conductive paste materials and applications - Google Patents

Electrically conductive paste materials and applications

Info

Publication number
SG77619A1
SG77619A1 SG1997004678A SG1997004678A SG77619A1 SG 77619 A1 SG77619 A1 SG 77619A1 SG 1997004678 A SG1997004678 A SG 1997004678A SG 1997004678 A SG1997004678 A SG 1997004678A SG 77619 A1 SG77619 A1 SG 77619A1
Authority
SG
Singapore
Prior art keywords
applications
electrically conductive
conductive paste
paste materials
materials
Prior art date
Application number
SG1997004678A
Other languages
English (en)
Inventor
Sung K Kang
Teresita O Graham
Sampath Purushothaman
Judith Marie Roldan
Ravi F Saraf
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of SG77619A1 publication Critical patent/SG77619A1/en

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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
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    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)
  • Non-Adjustable Resistors (AREA)
  • Paints Or Removers (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
SG1997004678A 1994-10-20 1995-08-21 Electrically conductive paste materials and applications SG77619A1 (en)

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US32662694A 1994-10-20 1994-10-20

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JPH10200241A (ja) * 1997-01-06 1998-07-31 Fujitsu Ltd 導電性接着剤およびそれを使用する部品実装方法
JPH1145616A (ja) * 1997-05-28 1999-02-16 Yazaki Corp 導電性フィラー、導電性ペーストおよび回路体の形成方法
TW396471B (en) * 1997-06-04 2000-07-01 Ibm Electrodeposition of low temperature, high conductivity, powder materials for electrically conductive paste formulations
CA2244332C (fr) * 1997-07-30 2002-04-02 Becton, Dickinson And Company Adhesif et methode pour lier une electrode a un trace conductif
KR100339183B1 (ko) 1998-07-13 2002-05-31 포만 제프리 엘 접착제 번짐이 감소된 다이 부착법
CN1135611C (zh) 1999-01-27 2004-01-21 时至准钟表股份有限公司 使用各向异性导电粘接剂的半导体装置的安装方法
US6270363B1 (en) 1999-05-18 2001-08-07 International Business Machines Corporation Z-axis compressible polymer with fine metal matrix suspension
EP1192654A1 (fr) * 1999-06-30 2002-04-03 Siemens Dematic AG Connexion electromecanique entre des systemes de commutation electroniques et des substrats et procede permettant de l'obtenir
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GB2365816B (en) 2000-08-09 2002-11-13 Murata Manufacturing Co Method of bonding conductive adhesive and electrode,and bonded structure
JP4684439B2 (ja) 2001-03-06 2011-05-18 富士通株式会社 伝導性粒子、伝導性組成物および、電子機器の製造方法
KR20030050333A (ko) * 2001-12-18 2003-06-25 태크뱅크 주식회사 전자 패키징 시간 단축용 엠디씨
CN100409423C (zh) * 2003-02-05 2008-08-06 千住金属工业株式会社 端子间的连接方法及半导体装置的安装方法
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JP5034206B2 (ja) 2005-10-03 2012-09-26 株式会社デンソー 導電性接着剤
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KR960016651A (ko) 1996-05-22
MY118121A (en) 2004-09-30
JP3454509B2 (ja) 2003-10-06
JP2002151170A (ja) 2002-05-24
EP0708582A1 (fr) 1996-04-24
CN1084917C (zh) 2002-05-15
TW340132B (en) 1998-09-11
KR100229581B1 (ko) 1999-11-15
CN1129339A (zh) 1996-08-21
JPH08227613A (ja) 1996-09-03

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