SG63691A1 - Epoxy resin epoxy resin composition and hardened product thereof - Google Patents
Epoxy resin epoxy resin composition and hardened product thereofInfo
- Publication number
- SG63691A1 SG63691A1 SG1997000251A SG1997000251A SG63691A1 SG 63691 A1 SG63691 A1 SG 63691A1 SG 1997000251 A SG1997000251 A SG 1997000251A SG 1997000251 A SG1997000251 A SG 1997000251A SG 63691 A1 SG63691 A1 SG 63691A1
- Authority
- SG
- Singapore
- Prior art keywords
- epoxy resin
- hardened product
- resin composition
- composition
- hardened
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/16—Addition or condensation polymers of aldehydes or ketones according to C08L59/00 - C08L61/00; Derivatives thereof
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2417496A JPH09216932A (ja) | 1996-02-09 | 1996-02-09 | エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
JP14454896 | 1996-06-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG63691A1 true SG63691A1 (en) | 1999-03-30 |
Family
ID=26361658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1997000251A SG63691A1 (en) | 1996-02-09 | 1997-02-05 | Epoxy resin epoxy resin composition and hardened product thereof |
Country Status (8)
Country | Link |
---|---|
US (1) | US6124420A (ja) |
EP (1) | EP0821020A4 (ja) |
KR (1) | KR100444348B1 (ja) |
CN (1) | CN1099434C (ja) |
MY (1) | MY129953A (ja) |
SG (1) | SG63691A1 (ja) |
TW (1) | TW343990B (ja) |
WO (1) | WO1997029144A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002194274A (ja) * | 2000-10-20 | 2002-07-10 | Kansai Paint Co Ltd | 塗料組成物 |
ATE445160T1 (de) * | 2001-08-20 | 2009-10-15 | Biosite Inc | Diagnostische marker für schlaganfall und hirntrauma sowie verfahren zur verwendung davon |
CN100386298C (zh) * | 2004-03-25 | 2008-05-07 | 株式会社艾迪科 | 新型酚化合物和可由该酚化合物衍生得到的新型环氧树脂 |
CN101006393B (zh) * | 2005-05-11 | 2011-11-30 | 凸版印刷株式会社 | 碱性显影型感光性树脂组合物、带有使用它形成的液晶分割取向控制突起的基板和滤色器、以及液晶显示装置 |
KR100995683B1 (ko) | 2008-06-30 | 2010-11-22 | 주식회사 코오롱 | 에폭시 수지, 그 제조방법 및 용도 |
KR101340283B1 (ko) * | 2010-02-03 | 2013-12-10 | 디아이씨 가부시끼가이샤 | 페놀 수지 조성물, 경화성 수지 조성물, 그 경화물, 및 프린트 배선 기판 |
CN101979421A (zh) * | 2010-11-04 | 2011-02-23 | 西安建筑科技大学 | 一种镍离子高选择性吸附树脂的制备方法 |
KR101399258B1 (ko) | 2013-11-22 | 2014-05-27 | 코오롱인더스트리 주식회사 | 노볼락 에폭시 수지, 그 제조방법 및 노볼락 에폭시 수지를 포함하는 에폭시 수지 조성물 |
TW201520245A (zh) * | 2013-11-22 | 2015-06-01 | Kolon Inc | 酚醛樹脂、包含該酚醛樹脂的硬化劑及環氧樹脂組成物、以及酚醛環氧樹脂、製備該酚醛環氧樹脂的方法和含有該酚醛環氧樹脂的環氧樹脂組成物 |
TW201529147A (zh) * | 2013-12-18 | 2015-08-01 | Dow Global Technologies Llc | 經蒸餾的環氧酚醛樹脂(一) |
EP3083747B1 (en) | 2013-12-18 | 2017-11-08 | Blue Cube IP LLC | Distilled epoxy novolac resins |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4518762A (en) * | 1983-09-08 | 1985-05-21 | Ciba Geigy Corporation | Process for making epoxy novolac resins with high epoxy values |
EP0209572A4 (en) * | 1985-01-11 | 1988-10-24 | Dow Chemical Co | NOVOLAC EPOXY RESINS HAVING REDUCED 2-FUNCTION CONSTITUENTS AND A METHOD FOR REDUCING THE 2-FUNCTION CONSTITUENTS IN NOVOLAC RESINS. |
US5106923A (en) * | 1985-01-11 | 1992-04-21 | The Dow Chemical Company | Substituted phenol-formaldehyde novolac resins containing reduced quantities of 2-functional components and epoxy novolac resins prepared therefrom |
JPS6381118A (ja) * | 1986-09-25 | 1988-04-12 | Nippon Kayaku Co Ltd | 4核体フェノール類ノボラック型エポキシ化合物の製造法 |
JPS63301218A (ja) * | 1987-06-02 | 1988-12-08 | Asahi Chiba Kk | エポキシ樹脂組成物 |
JPH01190722A (ja) * | 1988-01-27 | 1989-07-31 | Nippon Kayaku Co Ltd | 耐熱性エポキシ樹脂組成物 |
JPH0288628A (ja) * | 1988-09-26 | 1990-03-28 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂組成物 |
JP2764454B2 (ja) * | 1989-04-12 | 1998-06-11 | 日本化薬株式会社 | 置換フェノール類ノボラック型エポキシ樹脂、その製造法及びエポキシ樹脂組成物 |
JPH0323723A (ja) * | 1989-06-20 | 1991-01-31 | Matsushita Electric Ind Co Ltd | データ通信用送信装置 |
JPH03237123A (ja) * | 1989-12-04 | 1991-10-23 | Nippon Kayaku Co Ltd | 樹脂組成物及びその硬化物 |
JP2997945B2 (ja) * | 1990-07-03 | 2000-01-11 | 油化シエルエポキシ株式会社 | エポキシ樹脂の製造方法 |
JP2823057B2 (ja) * | 1990-12-20 | 1998-11-11 | 日本化薬株式会社 | エポキシ樹脂の製造方法 |
JPH04225012A (ja) * | 1990-12-27 | 1992-08-14 | Nippon Kayaku Co Ltd | 4核体フェノール類ノボラック及びその製造法 |
JPH04318017A (ja) * | 1991-04-15 | 1992-11-09 | Yuka Shell Epoxy Kk | ノボラック型エポキシ樹脂 |
JPH05255476A (ja) * | 1992-03-12 | 1993-10-05 | Yuka Shell Epoxy Kk | エポキシ樹脂組成物 |
JPH05254762A (ja) * | 1992-03-12 | 1993-10-05 | Hitachi Ltd | 展望用エレベータの乗りかご |
JPH05287053A (ja) * | 1992-04-09 | 1993-11-02 | Nippon Kayaku Co Ltd | エポキシ樹脂、樹脂組成物及び硬化物 |
JP2663103B2 (ja) * | 1994-02-09 | 1997-10-15 | 旭チバ株式会社 | ノボラック樹脂のグリシジルエーテルの製造法 |
-
1997
- 1997-02-05 SG SG1997000251A patent/SG63691A1/en unknown
- 1997-02-05 TW TW086101454A patent/TW343990B/zh active
- 1997-02-05 MY MYPI97000456A patent/MY129953A/en unknown
- 1997-02-07 EP EP97902631A patent/EP0821020A4/en not_active Withdrawn
- 1997-02-07 CN CN97190058A patent/CN1099434C/zh not_active Expired - Fee Related
- 1997-02-07 US US08/930,892 patent/US6124420A/en not_active Expired - Fee Related
- 1997-02-07 WO PCT/JP1997/000331 patent/WO1997029144A1/ja not_active Application Discontinuation
- 1997-02-07 KR KR1019970707236A patent/KR100444348B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1178538A (zh) | 1998-04-08 |
WO1997029144A1 (fr) | 1997-08-14 |
TW343990B (en) | 1998-11-01 |
MY129953A (en) | 2007-05-31 |
KR19980703836A (ko) | 1998-12-05 |
US6124420A (en) | 2000-09-26 |
CN1099434C (zh) | 2003-01-22 |
EP0821020A1 (en) | 1998-01-28 |
KR100444348B1 (ko) | 2005-02-24 |
EP0821020A4 (en) | 2000-11-02 |
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