WO1997029144A1 - Resine epoxy, composition de resine epoxy et produits obtenus par durcissement - Google Patents

Resine epoxy, composition de resine epoxy et produits obtenus par durcissement Download PDF

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Publication number
WO1997029144A1
WO1997029144A1 PCT/JP1997/000331 JP9700331W WO9729144A1 WO 1997029144 A1 WO1997029144 A1 WO 1997029144A1 JP 9700331 W JP9700331 W JP 9700331W WO 9729144 A1 WO9729144 A1 WO 9729144A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
curing
products
epoxy
resin composition
Prior art date
Application number
PCT/JP1997/000331
Other languages
English (en)
French (fr)
Inventor
Kenichi Kuboki
Yoshio Shimamura
Ryoichi Hasegawa
Yoshiaki Kurimoto
Akiyuki Kojima
Yukio Abe
Original Assignee
Nippon Kayaku Kabushiki Kaisha
Gun Ei Chemical Industry Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2417496A external-priority patent/JPH09216932A/ja
Application filed by Nippon Kayaku Kabushiki Kaisha, Gun Ei Chemical Industry Co., Ltd. filed Critical Nippon Kayaku Kabushiki Kaisha
Priority to KR1019970707236A priority Critical patent/KR100444348B1/ko
Priority to US08/930,892 priority patent/US6124420A/en
Priority to EP97902631A priority patent/EP0821020A4/en
Publication of WO1997029144A1 publication Critical patent/WO1997029144A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/16—Addition or condensation polymers of aldehydes or ketones according to C08L59/00 - C08L61/00; Derivatives thereof
PCT/JP1997/000331 1996-02-09 1997-02-07 Resine epoxy, composition de resine epoxy et produits obtenus par durcissement WO1997029144A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019970707236A KR100444348B1 (ko) 1996-02-09 1997-02-07 에폭시수지,에폭시수지조성물및이의경화물
US08/930,892 US6124420A (en) 1996-02-09 1997-02-07 Epoxy resin, epoxy resin composition and hardened product thereof
EP97902631A EP0821020A4 (en) 1996-02-09 1997-02-07 EPOXY RESIN, EPOXY RESIN COMPOSITION AND PRODUCTS OBTAINED BY CURING

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2417496A JPH09216932A (ja) 1996-02-09 1996-02-09 エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP8/24174 1996-02-09
JP8/144548 1996-06-06
JP14454896 1996-06-06

Publications (1)

Publication Number Publication Date
WO1997029144A1 true WO1997029144A1 (fr) 1997-08-14

Family

ID=26361658

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1997/000331 WO1997029144A1 (fr) 1996-02-09 1997-02-07 Resine epoxy, composition de resine epoxy et produits obtenus par durcissement

Country Status (8)

Country Link
US (1) US6124420A (ja)
EP (1) EP0821020A4 (ja)
KR (1) KR100444348B1 (ja)
CN (1) CN1099434C (ja)
MY (1) MY129953A (ja)
SG (1) SG63691A1 (ja)
TW (1) TW343990B (ja)
WO (1) WO1997029144A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002194274A (ja) * 2000-10-20 2002-07-10 Kansai Paint Co Ltd 塗料組成物
EP1419388B1 (en) * 2001-08-20 2009-10-07 Biosite Incorporated Diagnostic markers of stroke and cerebral injury and methods of use thereof
WO2005092826A1 (ja) * 2004-03-25 2005-10-06 Asahi Denka Co., Ltd. 新規フェノール化合物及び該フェノール化合物から誘導し得る新規エポキシ樹脂
WO2006121062A1 (ja) * 2005-05-11 2006-11-16 Toppan Printing Co., Ltd. アルカリ現像型感光性樹脂組成物、それを用いて形成した液晶分割配向制御突起付き基板及びカラーフィルタ、並びに液晶表示装置
KR100995683B1 (ko) 2008-06-30 2010-11-22 주식회사 코오롱 에폭시 수지, 그 제조방법 및 용도
CN102741344B (zh) * 2010-02-03 2014-03-05 Dic株式会社 酚醛树脂组合物、其制造方法、固化性树脂组合物、其固化物以及印刷电路基板
CN101979421A (zh) * 2010-11-04 2011-02-23 西安建筑科技大学 一种镍离子高选择性吸附树脂的制备方法
WO2015076626A1 (ko) * 2013-11-22 2015-05-28 코오롱인더스트리 주식회사 노볼락 수지, 이를 포함하는 경화제 및 에폭시 수지 조성물과 노볼락 에폭시 수지, 그 제조방법 및 노볼락 에폭시 수지를 포함하는 에폭시 수지 조성물
KR101399258B1 (ko) 2013-11-22 2014-05-27 코오롱인더스트리 주식회사 노볼락 에폭시 수지, 그 제조방법 및 노볼락 에폭시 수지를 포함하는 에폭시 수지 조성물
US9695271B2 (en) * 2013-12-18 2017-07-04 Blue Cube Ip Llc Distilled epoxy novolac resins
KR102168012B1 (ko) * 2013-12-18 2020-10-20 블루 큐브 아이피 엘엘씨 증류된 에폭시 노볼락 수지

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6381118A (ja) * 1986-09-25 1988-04-12 Nippon Kayaku Co Ltd ４核体フェノール類ノボラック型エポキシ化合物の製造法
JPS63301218A (ja) * 1987-06-02 1988-12-08 Asahi Chiba Kk エポキシ樹脂組成物
JPH01190722A (ja) * 1988-01-27 1989-07-31 Nippon Kayaku Co Ltd 耐熱性エポキシ樹脂組成物
JPH0288628A (ja) * 1988-09-26 1990-03-28 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物
JPH0347826A (ja) * 1989-04-12 1991-02-28 Nippon Kayaku Co Ltd 置換フェノール類ノボラック型エポキシ樹脂、その製造法及びエポキシ樹脂組成物
JPH03237123A (ja) * 1989-12-04 1991-10-23 Nippon Kayaku Co Ltd 樹脂組成物及びその硬化物
JPH0463826A (ja) * 1990-07-03 1992-02-28 Yuka Shell Epoxy Kk エポキシ樹脂の製造方法
JPH04220422A (ja) * 1990-12-20 1992-08-11 Nippon Kayaku Co Ltd エポキシ樹脂の製造方法
JPH04225012A (ja) * 1990-12-27 1992-08-14 Nippon Kayaku Co Ltd ４核体フェノール類ノボラック及びその製造法
JPH04318017A (ja) * 1991-04-15 1992-11-09 Yuka Shell Epoxy Kk ノボラック型エポキシ樹脂
JPH05255476A (ja) * 1992-03-12 1993-10-05 Yuka Shell Epoxy Kk エポキシ樹脂組成物
JPH05287053A (ja) * 1992-04-09 1993-11-02 Nippon Kayaku Co Ltd エポキシ樹脂、樹脂組成物及び硬化物
JPH0748425A (ja) * 1994-02-09 1995-02-21 Asahi Chiba Kk ノボラック樹脂のグリシジルエーテルの製造法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4518762A (en) * 1983-09-08 1985-05-21 Ciba Geigy Corporation Process for making epoxy novolac resins with high epoxy values
WO1986004075A1 (en) * 1985-01-11 1986-07-17 The Dow Chemical Company Epoxy novolac resins having reduced 2-functional components and a process for reducing 2-functional components in novolac resins
US5106923A (en) * 1985-01-11 1992-04-21 The Dow Chemical Company Substituted phenol-formaldehyde novolac resins containing reduced quantities of 2-functional components and epoxy novolac resins prepared therefrom
JPH0323723A (ja) * 1989-06-20 1991-01-31 Matsushita Electric Ind Co Ltd データ通信用送信装置
JPH05254762A (ja) * 1992-03-12 1993-10-05 Hitachi Ltd 展望用エレベータの乗りかご

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6381118A (ja) * 1986-09-25 1988-04-12 Nippon Kayaku Co Ltd ４核体フェノール類ノボラック型エポキシ化合物の製造法
JPS63301218A (ja) * 1987-06-02 1988-12-08 Asahi Chiba Kk エポキシ樹脂組成物
JPH01190722A (ja) * 1988-01-27 1989-07-31 Nippon Kayaku Co Ltd 耐熱性エポキシ樹脂組成物
JPH0288628A (ja) * 1988-09-26 1990-03-28 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物
JPH0347826A (ja) * 1989-04-12 1991-02-28 Nippon Kayaku Co Ltd 置換フェノール類ノボラック型エポキシ樹脂、その製造法及びエポキシ樹脂組成物
JPH03237123A (ja) * 1989-12-04 1991-10-23 Nippon Kayaku Co Ltd 樹脂組成物及びその硬化物
JPH0463826A (ja) * 1990-07-03 1992-02-28 Yuka Shell Epoxy Kk エポキシ樹脂の製造方法
JPH04220422A (ja) * 1990-12-20 1992-08-11 Nippon Kayaku Co Ltd エポキシ樹脂の製造方法
JPH04225012A (ja) * 1990-12-27 1992-08-14 Nippon Kayaku Co Ltd ４核体フェノール類ノボラック及びその製造法
JPH04318017A (ja) * 1991-04-15 1992-11-09 Yuka Shell Epoxy Kk ノボラック型エポキシ樹脂
JPH05255476A (ja) * 1992-03-12 1993-10-05 Yuka Shell Epoxy Kk エポキシ樹脂組成物
JPH05287053A (ja) * 1992-04-09 1993-11-02 Nippon Kayaku Co Ltd エポキシ樹脂、樹脂組成物及び硬化物
JPH0748425A (ja) * 1994-02-09 1995-02-21 Asahi Chiba Kk ノボラック樹脂のグリシジルエーテルの製造法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP0821020A4 *

Also Published As

Publication number Publication date
EP0821020A1 (en) 1998-01-28
KR19980703836A (ko) 1998-12-05
TW343990B (en) 1998-11-01
EP0821020A4 (en) 2000-11-02
US6124420A (en) 2000-09-26
MY129953A (en) 2007-05-31
CN1178538A (zh) 1998-04-08
KR100444348B1 (ko) 2005-02-24
CN1099434C (zh) 2003-01-22
SG63691A1 (en) 1999-03-30

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