SG58992G - Integrated circuit device having strip line structure therein - Google Patents
Integrated circuit device having strip line structure thereinInfo
- Publication number
- SG58992G SG58992G SG589/92A SG58992A SG58992G SG 58992 G SG58992 G SG 58992G SG 589/92 A SG589/92 A SG 589/92A SG 58992 A SG58992 A SG 58992A SG 58992 G SG58992 G SG 58992G
- Authority
- SG
- Singapore
- Prior art keywords
- line structure
- strip line
- microstrip line
- integrated circuit
- semiconductor chip
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
- H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6616—Vertical connections, e.g. vias
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microwave Amplifiers (AREA)
- Waveguides (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
- Coils Or Transformers For Communication (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Train Traffic Observation, Control, And Security (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60077550A JPH0812887B2 (ja) | 1985-04-13 | 1985-04-13 | 高速集積回路パツケ−ジ |
Publications (1)
Publication Number | Publication Date |
---|---|
SG58992G true SG58992G (en) | 1992-09-04 |
Family
ID=13637119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG589/92A SG58992G (en) | 1985-04-13 | 1992-06-03 | Integrated circuit device having strip line structure therein |
Country Status (8)
Country | Link |
---|---|
US (1) | US4875087A (de) |
EP (1) | EP0198698B1 (de) |
JP (1) | JPH0812887B2 (de) |
AT (1) | ATE68915T1 (de) |
CA (1) | CA1246170A (de) |
DE (1) | DE3682101D1 (de) |
HK (1) | HK56592A (de) |
SG (1) | SG58992G (de) |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2612697B1 (fr) * | 1987-03-20 | 1989-06-16 | Thomson Csf | Jonction entre une ligne triplaque et une ligne microruban et applications |
JPS63258046A (ja) * | 1987-04-15 | 1988-10-25 | Toshiba Corp | 半導体集積回路装置 |
JP2507476B2 (ja) * | 1987-09-28 | 1996-06-12 | 株式会社東芝 | 半導体集積回路装置 |
JP2580674B2 (ja) * | 1988-02-08 | 1997-02-12 | 三菱電機株式会社 | 高周波用モールド型パッケージ |
FR2630261B1 (fr) * | 1988-04-15 | 1990-08-17 | Trt Telecom Radio Electr | Circuit utilisable dans le domaine des hyperfrequences |
US5136271A (en) * | 1989-01-09 | 1992-08-04 | Mitsubishi Denki Kabushiki Kaisha | Microwave integrated circuit mountings |
JPH0716100B2 (ja) * | 1990-01-10 | 1995-02-22 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 多層配線モジュール |
US5157477A (en) * | 1990-01-10 | 1992-10-20 | International Business Machines Corporation | Matched impedance vertical conductors in multilevel dielectric laminated wiring |
US5065227A (en) * | 1990-06-04 | 1991-11-12 | International Business Machines Corporation | Integrated circuit packaging using flexible substrate |
CA2047486C (en) * | 1990-07-21 | 2002-03-05 | Shigeru Katayama | Semiconductor device and method for manufacturing the same |
US5065124A (en) * | 1990-09-04 | 1991-11-12 | Watkins-Johnson Company | DC-40 GHz module interface |
JPH0766949B2 (ja) * | 1990-09-28 | 1995-07-19 | 富士通株式会社 | Icパッケージ |
US5132613A (en) * | 1990-11-30 | 1992-07-21 | International Business Machines Corporation | Low inductance side mount decoupling test structure |
US5184095A (en) * | 1991-07-31 | 1993-02-02 | Hughes Aircraft Company | Constant impedance transition between transmission structures of different dimensions |
DE69318879T2 (de) * | 1992-04-03 | 1998-10-08 | Matsushita Electric Ind Co Ltd | Keramisches Mehrschicht-Substrat für hohe Frequenzen |
US5376909A (en) * | 1992-05-29 | 1994-12-27 | Texas Instruments Incorporated | Device packaging |
FR2695514B1 (fr) * | 1992-09-10 | 1994-10-21 | Alcatel Telspace | Dispositif hyperfréquence comprenant un filtre triplaque réalisé dans une semelle conductrice d'électricité recouverte d'un matériau diélectrique. |
US5338970A (en) * | 1993-03-24 | 1994-08-16 | Intergraph Corporation | Multi-layered integrated circuit package with improved high frequency performance |
US6271579B1 (en) * | 1993-10-08 | 2001-08-07 | Stratedge Corporation | High-frequency passband microelectronics package |
JPH10501102A (ja) * | 1995-03-02 | 1998-01-27 | サーキット コンポーネンツ インコーポレーテッド | Bga i/o rfポートフォーマットとセラミックス基板技術とを使用した90ghzまでの周波数領域のマイクロ波回路用の低コスト高性能パッケージ |
GB2298957A (en) * | 1995-03-16 | 1996-09-18 | Oxley Dev Co Ltd | Microstrip microwave package |
DE19534309C1 (de) * | 1995-09-15 | 1997-03-27 | Siemens Ag | Anordnung zum Übertragen von Signalen über Triplate-Leitungen |
FR2739492B1 (fr) * | 1995-10-03 | 1997-11-07 | Dassault Electronique | Circuit hyperfrequence multi-couches a elements actifs integres |
FR2739496B1 (fr) * | 1995-10-03 | 1998-01-30 | Dassault Electronique | Circuit hyperfrequence multicouches a elements actifs integres |
US5952709A (en) * | 1995-12-28 | 1999-09-14 | Kyocera Corporation | High-frequency semiconductor device and mounted structure thereof |
EP0795907A1 (de) * | 1996-03-14 | 1997-09-17 | Dassault Electronique | Mehrlagige Hochfrequenzschaltung mit integrierten aktiven Elementen |
US6018283A (en) * | 1996-12-18 | 2000-01-25 | Texas Instruments Incorporated | Ultrawide bandwidth Z-axis interconnect |
US6687842B1 (en) * | 1997-04-02 | 2004-02-03 | Tessera, Inc. | Off-chip signal routing between multiply-connected on-chip electronic elements via external multiconductor transmission line on a dielectric element |
US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US6261872B1 (en) | 1997-09-18 | 2001-07-17 | Trw Inc. | Method of producing an advanced RF electronic package |
US5923234A (en) * | 1997-10-27 | 1999-07-13 | Lockheed Martin Corp. | Hermetic feedthrough using three-via transmission lines |
US6057600A (en) * | 1997-11-27 | 2000-05-02 | Kyocera Corporation | Structure for mounting a high-frequency package |
KR100563122B1 (ko) * | 1998-01-30 | 2006-03-21 | 다이요 유덴 가부시키가이샤 | 하이브리드 모듈 및 그 제조방법 및 그 설치방법 |
US6225690B1 (en) * | 1999-12-10 | 2001-05-01 | Lsi Logic Corporation | Plastic ball grid array package with strip line configuration |
JP2001308547A (ja) * | 2000-04-27 | 2001-11-02 | Sharp Corp | 高周波多層回路基板 |
TW452953B (en) * | 2000-05-22 | 2001-09-01 | Via Tech Inc | BGA chip package capable of decreasing its impedance when operating at high frequency |
EP1293009A4 (de) * | 2000-06-09 | 2004-06-09 | Synergy Microwave Corproation | Mehrschichtige mikrowellenschaltungen und herstellungsverfahren |
JP3487283B2 (ja) * | 2000-10-31 | 2004-01-13 | 三菱電機株式会社 | 差動ストリップ線路垂直変換器および光モジュール |
JP4462758B2 (ja) * | 2000-12-27 | 2010-05-12 | 京セラ株式会社 | 高周波用配線基板 |
FR2826780A1 (fr) * | 2001-06-28 | 2003-01-03 | St Microelectronics Sa | Dispositif semi-conducteur a structure hyperfrequence |
DE10212769A1 (de) * | 2002-03-22 | 2003-10-02 | Dystar Textilfarben Gmbh & Co | Farbstoffmischungen von faserreaktiven Azofarbstoffen, ihre Herstellung und ihre Verwendung |
JP2005086603A (ja) * | 2003-09-10 | 2005-03-31 | Tdk Corp | 電子部品モジュールおよびその製造方法 |
JP2008537843A (ja) | 2005-03-01 | 2008-09-25 | エックストゥーワイ アテニュエイターズ,エルエルシー | 内部で重なり合った調整器 |
US8159832B2 (en) * | 2007-09-21 | 2012-04-17 | Nokia Corporation | Electromagnetic band gap structures and method for making same |
US8081045B1 (en) * | 2008-08-08 | 2011-12-20 | Lockheed Martin Corporation | Beamformer power divider/combiner with transmission lines distributed between MMIC and associated PC board |
JP5636834B2 (ja) * | 2010-09-10 | 2014-12-10 | 富士通株式会社 | 高周波回路用パッケージ及び高周波回路装置 |
US10062972B1 (en) * | 2013-04-23 | 2018-08-28 | National Technology & Engineering Solutions Of Sandia, Llc | Antenna array with low Rx and Tx sidelobe levels |
JP7155261B2 (ja) | 2017-11-10 | 2022-10-18 | レイセオン カンパニー | 無線周波数回路におけるアディティブ製造技術(amt)ファラデー境界 |
US20190150296A1 (en) * | 2017-11-10 | 2019-05-16 | Raytheon Company | Additive manufacturing technology microwave vertical launch |
US11289814B2 (en) | 2017-11-10 | 2022-03-29 | Raytheon Company | Spiral antenna and related fabrication techniques |
EP4235951A3 (de) | 2017-11-10 | 2023-09-06 | Raytheon Company | Flacher kühler einer technologie für generative fertigung (amt) |
KR102342520B1 (ko) | 2017-11-10 | 2021-12-22 | 레이던 컴퍼니 | 밀리미터파 전송 라인 구조 |
EP3760014B1 (de) | 2018-02-28 | 2022-09-28 | Raytheon Company | Einrast-hf-verbindungen |
US11089687B2 (en) | 2018-02-28 | 2021-08-10 | Raytheon Company | Additive manufacturing technology (AMT) low profile signal divider |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3715635A (en) * | 1971-06-25 | 1973-02-06 | Bendix Corp | High frequency matched impedance microcircuit holder |
GB1501500A (en) * | 1975-06-20 | 1978-02-15 | Int Computers Ltd | Multilayer printed circuit boards |
GB2007911B (en) * | 1977-10-12 | 1982-03-24 | Secr Defence | Methods of packaging microwave intergrated circuits and to microwave intergrated circiuted packages |
US4259684A (en) * | 1978-10-13 | 1981-03-31 | The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland | Packages for microwave integrated circuits |
US4276558A (en) * | 1979-06-15 | 1981-06-30 | Ford Aerospace & Communications Corp. | Hermetically sealed active microwave integrated circuit |
GB2078845A (en) * | 1980-06-23 | 1982-01-13 | Electronic Locks Sweden Ab | Lock system for storage units |
US4498122A (en) * | 1982-12-29 | 1985-02-05 | At&T Bell Laboratories | High-speed, high pin-out LSI chip package |
CA1246755A (en) * | 1985-03-30 | 1988-12-13 | Akira Miyauchi | Semiconductor device |
US4701573A (en) * | 1985-09-26 | 1987-10-20 | Itt Gallium Arsenide Technology Center | Semiconductor chip housing |
-
1985
- 1985-04-13 JP JP60077550A patent/JPH0812887B2/ja not_active Expired - Lifetime
-
1986
- 1986-04-09 CA CA000506182A patent/CA1246170A/en not_active Expired
- 1986-04-14 EP EP86302753A patent/EP0198698B1/de not_active Expired - Lifetime
- 1986-04-14 DE DE8686302753T patent/DE3682101D1/de not_active Expired - Fee Related
- 1986-04-14 AT AT86302753T patent/ATE68915T1/de not_active IP Right Cessation
-
1988
- 1988-07-22 US US07/222,303 patent/US4875087A/en not_active Expired - Fee Related
-
1992
- 1992-06-03 SG SG589/92A patent/SG58992G/en unknown
- 1992-07-30 HK HK565/92A patent/HK56592A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
EP0198698A3 (en) | 1988-08-03 |
EP0198698A2 (de) | 1986-10-22 |
DE3682101D1 (de) | 1991-11-28 |
EP0198698B1 (de) | 1991-10-23 |
HK56592A (en) | 1992-08-07 |
JPS61239650A (ja) | 1986-10-24 |
CA1246170A (en) | 1988-12-06 |
ATE68915T1 (de) | 1991-11-15 |
JPH0812887B2 (ja) | 1996-02-07 |
US4875087A (en) | 1989-10-17 |
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