FR2630261B1 - Circuit utilisable dans le domaine des hyperfrequences - Google Patents
Circuit utilisable dans le domaine des hyperfrequencesInfo
- Publication number
- FR2630261B1 FR2630261B1 FR8805011A FR8805011A FR2630261B1 FR 2630261 B1 FR2630261 B1 FR 2630261B1 FR 8805011 A FR8805011 A FR 8805011A FR 8805011 A FR8805011 A FR 8805011A FR 2630261 B1 FR2630261 B1 FR 2630261B1
- Authority
- FR
- France
- Prior art keywords
- microwave
- field
- circuit used
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8805011A FR2630261B1 (fr) | 1988-04-15 | 1988-04-15 | Circuit utilisable dans le domaine des hyperfrequences |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8805011A FR2630261B1 (fr) | 1988-04-15 | 1988-04-15 | Circuit utilisable dans le domaine des hyperfrequences |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2630261A1 FR2630261A1 (fr) | 1989-10-20 |
FR2630261B1 true FR2630261B1 (fr) | 1990-08-17 |
Family
ID=9365346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8805011A Expired - Lifetime FR2630261B1 (fr) | 1988-04-15 | 1988-04-15 | Circuit utilisable dans le domaine des hyperfrequences |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2630261B1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1986244B1 (fr) * | 2002-11-12 | 2017-01-11 | Fujitsu Limited | Structure d'assemblage |
CN101460018B (zh) * | 2007-12-14 | 2011-02-16 | 华为技术有限公司 | 一种印制电路板及其制造方法、射频装置 |
CN104125702B (zh) * | 2013-04-27 | 2017-04-12 | 启碁科技股份有限公司 | 复合电路板及雷达装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3649475A (en) * | 1969-07-22 | 1972-03-14 | Gen Dynamics Corp | Multi-layer printed circuit boards and methods of making same |
US3792383A (en) * | 1971-06-21 | 1974-02-12 | Motorola Inc | Hybrid strip transmission line circuitry and method of making same |
GB1501500A (en) * | 1975-06-20 | 1978-02-15 | Int Computers Ltd | Multilayer printed circuit boards |
JPS56154805A (en) * | 1980-04-30 | 1981-11-30 | Mitsubishi Electric Corp | Multilayer uniting method for triplet strip line |
JPS57124903A (en) * | 1981-01-28 | 1982-08-04 | Toshiba Corp | Circuit board |
JPS5871735A (ja) * | 1981-10-26 | 1983-04-28 | Hitachi Ltd | テレビジヨン受信機のチユ−ナ |
JPH0812887B2 (ja) * | 1985-04-13 | 1996-02-07 | 富士通株式会社 | 高速集積回路パツケ−ジ |
-
1988
- 1988-04-15 FR FR8805011A patent/FR2630261B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2630261A1 (fr) | 1989-10-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
ST | Notification of lapse |