SG47805A1 - Wafer processing machine vacuum front end method and apparatus - Google Patents

Wafer processing machine vacuum front end method and apparatus

Info

Publication number
SG47805A1
SG47805A1 SG1996004458A SG1996004458A SG47805A1 SG 47805 A1 SG47805 A1 SG 47805A1 SG 1996004458 A SG1996004458 A SG 1996004458A SG 1996004458 A SG1996004458 A SG 1996004458A SG 47805 A1 SG47805 A1 SG 47805A1
Authority
SG
Singapore
Prior art keywords
processing machine
wafer processing
end method
machine vacuum
vacuum front
Prior art date
Application number
SG1996004458A
Other languages
English (en)
Inventor
Christopher Flegal
Original Assignee
Materials Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Materials Research Corp filed Critical Materials Research Corp
Publication of SG47805A1 publication Critical patent/SG47805A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG1996004458A 1992-12-04 1993-12-03 Wafer processing machine vacuum front end method and apparatus SG47805A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/985,300 US5516732A (en) 1992-12-04 1992-12-04 Wafer processing machine vacuum front end method and apparatus

Publications (1)

Publication Number Publication Date
SG47805A1 true SG47805A1 (en) 1998-04-17

Family

ID=25531354

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996004458A SG47805A1 (en) 1992-12-04 1993-12-03 Wafer processing machine vacuum front end method and apparatus

Country Status (9)

Country Link
US (1) US5516732A (zh)
EP (1) EP0672297A1 (zh)
JP (1) JP3332926B2 (zh)
KR (1) KR950704804A (zh)
AU (1) AU5739194A (zh)
CA (1) CA2150473A1 (zh)
SG (1) SG47805A1 (zh)
TW (1) TW357424B (zh)
WO (1) WO1994014185A1 (zh)

Families Citing this family (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07205067A (ja) * 1994-01-25 1995-08-08 Sony Corp 物品の移送機構
US5486080A (en) * 1994-06-30 1996-01-23 Diamond Semiconductor Group, Inc. High speed movement of workpieces in vacuum processing
JP3288200B2 (ja) * 1995-06-09 2002-06-04 東京エレクトロン株式会社 真空処理装置
JP3235012B2 (ja) * 1995-08-18 2001-12-04 株式会社新川 ダイ移送装置
US6176667B1 (en) * 1996-04-30 2001-01-23 Applied Materials, Inc. Multideck wafer processing system
US5779799A (en) * 1996-06-21 1998-07-14 Micron Technology, Inc. Substrate coating apparatus
JPH1050684A (ja) * 1996-07-31 1998-02-20 Sony Corp 半導体装置の製造方法
TW353772B (en) * 1996-09-09 1999-03-01 Tokyo Electron Ltd Workpiece relaying apparatus
KR100252210B1 (ko) * 1996-12-24 2000-04-15 윤종용 반도체장치 제조용 건식식각장치
USD406113S (en) * 1997-01-31 1999-02-23 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD410438S (en) * 1997-01-31 1999-06-01 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
US6432203B1 (en) * 1997-03-17 2002-08-13 Applied Komatsu Technology, Inc. Heated and cooled vacuum chamber shield
US5944857A (en) * 1997-05-08 1999-08-31 Tokyo Electron Limited Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor
US6468353B1 (en) * 1997-06-04 2002-10-22 Applied Materials, Inc. Method and apparatus for improved substrate handling
JP3936030B2 (ja) * 1997-06-23 2007-06-27 東京エレクトロン株式会社 被処理体の回収方法
US5882413A (en) * 1997-07-11 1999-03-16 Brooks Automation, Inc. Substrate processing apparatus having a substrate transport with a front end extension and an internal substrate buffer
US6073366A (en) * 1997-07-11 2000-06-13 Asm America, Inc. Substrate cooling system and method
US6312525B1 (en) 1997-07-11 2001-11-06 Applied Materials, Inc. Modular architecture for semiconductor wafer fabrication equipment
US6034000A (en) * 1997-07-28 2000-03-07 Applied Materials, Inc. Multiple loadlock system
USD405062S (en) * 1997-08-20 1999-02-02 Tokyo Electron Ltd. Processing tube for use in a semiconductor wafer heat processing apparatus
JPH11135600A (ja) * 1997-08-25 1999-05-21 Shibaura Mechatronics Corp ロボット装置および処理装置
DE69734877T2 (de) * 1997-09-10 2006-09-14 Samsung Electronics Co., Ltd., Suwon Vorrichtung zur Herstellung von einem Halbleiter-Bauelement und ein diese Vorrichtung verwendendes Verfahren zur Herstellung einer Polysilicium-Schicht
US6000227A (en) * 1997-09-24 1999-12-14 Applied Materials, Inc. Wafer cooling in a transfer chamber of a vacuum processing system
US6042623A (en) * 1998-01-12 2000-03-28 Tokyo Electron Limited Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor
JP4404481B2 (ja) 1998-02-18 2010-01-27 アプライド マテリアルズ インコーポレイテッド 真空処理システム、ウェーハハンドラーおよびエンドエフェクタ
US6236902B1 (en) * 1998-02-24 2001-05-22 Data I/O Corporation Apparatus and method for retaining a device for processing
US6134742A (en) * 1998-03-26 2000-10-24 Advanced Micro Devices, Inc. Apparatus for particle reduction in semiconductor processing equipment
KR20010043705A (ko) * 1998-05-18 2001-05-25 조셉 제이. 스위니 워크 스테이션간에 웨이퍼당 이송을 위한 웨이퍼 버퍼스테이션과 방법
US6086362A (en) 1998-05-20 2000-07-11 Applied Komatsu Technology, Inc. Multi-function chamber for a substrate processing system
US6957690B1 (en) 1998-09-10 2005-10-25 Asm America, Inc. Apparatus for thermal treatment of substrates
US6108937A (en) 1998-09-10 2000-08-29 Asm America, Inc. Method of cooling wafers
US6270307B1 (en) 1999-01-25 2001-08-07 Chartered Semiconductor Manufacturing Company Method for aligning wafers in a cassette
US6328815B1 (en) * 1999-02-19 2001-12-11 Taiwan Semiconductor Manufacturing Company Multiple chamber vacuum processing system configuration for improving the stability of mark shielding process
TW469483B (en) * 1999-04-19 2001-12-21 Applied Materials Inc Method and apparatus for aligning a cassette
US6763281B2 (en) 1999-04-19 2004-07-13 Applied Materials, Inc Apparatus for alignment of automated workpiece handling systems
US6440261B1 (en) 1999-05-25 2002-08-27 Applied Materials, Inc. Dual buffer chamber cluster tool for semiconductor wafer processing
WO2000074117A1 (en) 1999-05-27 2000-12-07 Matrix Integrated Systems, Inc. Rapid heating and cooling of workpiece chucks
US6558509B2 (en) * 1999-11-30 2003-05-06 Applied Materials, Inc. Dual wafer load lock
US6949143B1 (en) * 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
US6323463B1 (en) * 2000-03-29 2001-11-27 Applied Materials, Inc. Method and apparatus for reducing contamination in a wafer loadlock of a semiconductor wafer processing system
US6977014B1 (en) * 2000-06-02 2005-12-20 Novellus Systems, Inc. Architecture for high throughput semiconductor processing applications
US6235656B1 (en) * 2000-07-03 2001-05-22 Andrew Peter Clarke Dual degas/cool loadlock cluster tool
US6562141B2 (en) * 2000-07-03 2003-05-13 Andrew Peter Clarke Dual degas/cool loadlock cluster tool
EP1319243A2 (en) * 2000-09-15 2003-06-18 Applied Materials, Inc. Double dual slot load lock for process equipment
US6692219B2 (en) 2000-11-29 2004-02-17 Tokyo Electron Limited Reduced edge contact wafer handling system and method of retrofitting and using same
US6609869B2 (en) * 2001-01-04 2003-08-26 Asm America Transfer chamber with integral loadlock and staging station
US6612590B2 (en) 2001-01-12 2003-09-02 Tokyo Electron Limited Apparatus and methods for manipulating semiconductor wafers
US6568896B2 (en) 2001-03-21 2003-05-27 Applied Materials, Inc. Transfer chamber with side wall port
US6645344B2 (en) 2001-05-18 2003-11-11 Tokyo Electron Limited Universal backplane assembly and methods
US6584416B2 (en) * 2001-08-16 2003-06-24 Hewlett-Packard Development Company System and methods for forming data storage devices
US7316966B2 (en) * 2001-09-21 2008-01-08 Applied Materials, Inc. Method for transferring substrates in a load lock chamber
US6837974B2 (en) * 2002-02-01 2005-01-04 Tokyo Electron Limited Single piece pod shield for vertical plenum wafer processing machine
US6899507B2 (en) * 2002-02-08 2005-05-31 Asm Japan K.K. Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections
JP4121763B2 (ja) * 2002-04-08 2008-07-23 Ｔｄｋ株式会社 薄膜形成装置に対する基板の交換ユニットおよび基板交換方法
US6620253B1 (en) * 2002-04-11 2003-09-16 Micron Technology, Inc. Engagement mechanism for semiconductor substrate deposition process kit hardware
AU2003237852A1 (en) * 2002-05-14 2003-12-02 Tokyo Electron Limited Sputtering cathode adapter
US6932558B2 (en) 2002-07-03 2005-08-23 Kung Chris Wu Wafer aligner
CN100437894C (zh) 2002-09-10 2008-11-26 亚舍立技术有限公司 利用固定温度的卡盘以可变温度的工艺加热衬底的方法
WO2005022602A2 (en) * 2003-08-29 2005-03-10 Crossing Automation, Inc. A method and apparatus for semiconductor processing
US7207766B2 (en) * 2003-10-20 2007-04-24 Applied Materials, Inc. Load lock chamber for large area substrate processing system
US7497414B2 (en) * 2004-06-14 2009-03-03 Applied Materials, Inc. Curved slit valve door with flexible coupling
US20060045668A1 (en) * 2004-07-19 2006-03-02 Grabowski Al W System for handling of wafers within a process tool
US20060254715A1 (en) * 2005-05-12 2006-11-16 Joseph Yudoovsky Method and apparatus for vertical transfer of semiconductor substrates in a cleaning module
US20070006936A1 (en) * 2005-07-07 2007-01-11 Applied Materials, Inc. Load lock chamber with substrate temperature regulation
US7845891B2 (en) * 2006-01-13 2010-12-07 Applied Materials, Inc. Decoupled chamber body
JP5280861B2 (ja) * 2006-01-19 2013-09-04 エーエスエム アメリカ インコーポレイテッド 高温ａｌｄインレットマニホールド
US7665951B2 (en) * 2006-06-02 2010-02-23 Applied Materials, Inc. Multiple slot load lock chamber and method of operation
US7845618B2 (en) 2006-06-28 2010-12-07 Applied Materials, Inc. Valve door with ball coupling
US8124907B2 (en) * 2006-08-04 2012-02-28 Applied Materials, Inc. Load lock chamber with decoupled slit valve door seal compartment
US20080075563A1 (en) * 2006-09-27 2008-03-27 Mclane James R Substrate handling system and method
US20080251019A1 (en) * 2007-04-12 2008-10-16 Sriram Krishnaswami System and method for transferring a substrate into and out of a reduced volume chamber accommodating multiple substrates
US20100181500A1 (en) * 2009-01-16 2010-07-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for low temperature ion implantation
US8693856B2 (en) 2010-09-03 2014-04-08 Kla-Tencor Corporation Apparatus and methods for vacuum-compatible substrate thermal management
WO2012167285A1 (en) 2011-06-03 2012-12-06 Tel Nexx, Inc. Parallel single substrate processing system
US9574268B1 (en) 2011-10-28 2017-02-21 Asm America, Inc. Pulsed valve manifold for atomic layer deposition
US9388492B2 (en) 2011-12-27 2016-07-12 Asm America, Inc. Vapor flow control apparatus for atomic layer deposition
US9514916B2 (en) * 2013-03-15 2016-12-06 Varian Semiconductor Equipment Associates, Inc. Wafer platen thermosyphon cooling system
US10662527B2 (en) 2016-06-01 2020-05-26 Asm Ip Holding B.V. Manifolds for uniform vapor deposition
JP6723889B2 (ja) * 2016-09-28 2020-07-15 株式会社荏原製作所 めっき装置
SG11202108920SA (en) * 2019-02-19 2021-09-29 Veeco Instr Inc Automated batch production thin film deposition systems and methods of using the same
US11492701B2 (en) 2019-03-19 2022-11-08 Asm Ip Holding B.V. Reactor manifolds
KR20210048408A (ko) 2019-10-22 2021-05-03 에이에스엠 아이피 홀딩 비.브이. 반도체 증착 반응기 매니폴드
CN115747789B (zh) * 2022-11-07 2024-06-21 南京航空航天大学 一种防开裂激光熔覆涂层的制备装置及其方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0137819B1 (en) * 1983-02-14 1987-08-12 Aeronca Electronics, Inc. Articulated arm transfer device
US4909701A (en) * 1983-02-14 1990-03-20 Brooks Automation Inc. Articulated arm transfer device
JPS61106768A (ja) * 1984-10-31 1986-05-24 Anelva Corp 基体処理装置
JPH07105345B2 (ja) * 1985-08-08 1995-11-13 日電アネルバ株式会社 基体処理装置
GB8709064D0 (en) * 1986-04-28 1987-05-20 Varian Associates Wafer handling arm
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
US4722298A (en) * 1986-05-19 1988-02-02 Machine Technology, Inc. Modular processing apparatus for processing semiconductor wafers
US4951601A (en) * 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
DE3702775A1 (de) * 1987-01-30 1988-08-11 Leybold Ag Vorrichtung zum quasi-kontinuierlichen behandeln von substraten
US4785962A (en) * 1987-04-20 1988-11-22 Applied Materials, Inc. Vacuum chamber slit valve
US5092728A (en) * 1987-10-15 1992-03-03 Epsilon Technology, Inc. Substrate loading apparatus for a CVD process
US5019233A (en) * 1988-10-31 1991-05-28 Eaton Corporation Sputtering system
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
JP2683933B2 (ja) * 1989-01-20 1997-12-03 信越半導体株式会社 半導体ウエーハの表裏および方位判定検査装置
US5176493A (en) * 1989-02-24 1993-01-05 North American Philips Corporation High speed wafer handling method
FR2644567A1 (fr) * 1989-03-17 1990-09-21 Etudes Const Mecaniques Dispositif pour l'execution de traitements thermiques enchaines en continu sous vide
JP2642216B2 (ja) * 1989-05-23 1997-08-20 サイベック システムズ 半導体物品の予備位置決め方法及び装置
EP0408216A3 (en) * 1989-07-11 1991-09-18 Hitachi, Ltd. Method for processing wafers and producing semiconductor devices and apparatus for producing the same
US5110248A (en) * 1989-07-17 1992-05-05 Tokyo Electron Sagami Limited Vertical heat-treatment apparatus having a wafer transfer mechanism
IT1232241B (it) * 1989-09-11 1992-01-28 Cetev Cent Tecnolog Vuoto Dispositivo per il caricamento veloce di substrati in impianti da vuoto
JPH083146B2 (ja) * 1989-10-16 1996-01-17 富士通株式会社 薄膜形成方法
JPH0828205B2 (ja) * 1989-10-27 1996-03-21 株式会社日立製作所 ウエハ搬送装置
JPH03155619A (ja) * 1989-11-14 1991-07-03 Anelva Corp 真空処理装置
JPH05275511A (ja) * 1991-03-01 1993-10-22 Tokyo Electron Ltd 被処理体の移載システム及び処理装置
JP2986121B2 (ja) * 1991-03-26 1999-12-06 東京エレクトロン株式会社 ロードロック装置及び真空処理装置
JPH0812847B2 (ja) * 1991-04-22 1996-02-07 株式会社半導体プロセス研究所 半導体製造装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
JP3332926B2 (ja) 2002-10-07
KR950704804A (ko) 1995-11-20
EP0672297A1 (en) 1995-09-20
US5516732A (en) 1996-05-14
TW357424B (en) 1999-05-01
JPH08504301A (ja) 1996-05-07
WO1994014185A1 (en) 1994-06-23
CA2150473A1 (en) 1994-06-23
AU5739194A (en) 1994-07-04

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