SG46415A1 - Method for treating etchant - Google Patents

Method for treating etchant

Info

Publication number
SG46415A1
SG46415A1 SG1996004500A SG1996004500A SG46415A1 SG 46415 A1 SG46415 A1 SG 46415A1 SG 1996004500 A SG1996004500 A SG 1996004500A SG 1996004500 A SG1996004500 A SG 1996004500A SG 46415 A1 SG46415 A1 SG 46415A1
Authority
SG
Singapore
Prior art keywords
etchant
treating
treating etchant
Prior art date
Application number
SG1996004500A
Other languages
English (en)
Inventor
Yasuie Mikami
Masaaki Iosaki
Masao Shibasaki
Original Assignee
Nittetsu Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3281370A external-priority patent/JP2997110B2/ja
Priority claimed from JP3293127A external-priority patent/JP2698253B2/ja
Application filed by Nittetsu Mining Co Ltd filed Critical Nittetsu Mining Co Ltd
Publication of SG46415A1 publication Critical patent/SG46415A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/46Regeneration of etching compositions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • C25F7/02Regeneration of process liquids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrolytic Production Of Metals (AREA)
SG1996004500A 1991-10-28 1992-10-13 Method for treating etchant SG46415A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3281370A JP2997110B2 (ja) 1991-10-28 1991-10-28 エッチング液の処理方法
JP3293127A JP2698253B2 (ja) 1991-11-08 1991-11-08 銅を含む塩化第二鉄エッチング液の処理方法

Publications (1)

Publication Number Publication Date
SG46415A1 true SG46415A1 (en) 1998-02-20

Family

ID=26554156

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996004500A SG46415A1 (en) 1991-10-28 1992-10-13 Method for treating etchant

Country Status (10)

Country Link
US (1) US5393387A (ru)
EP (1) EP0539792B1 (ru)
KR (1) KR100256895B1 (ru)
CN (1) CN1038950C (ru)
AU (1) AU655680B2 (ru)
CA (1) CA2081578C (ru)
DE (1) DE69219063T2 (ru)
MY (1) MY108734A (ru)
RU (1) RU2119973C1 (ru)
SG (1) SG46415A1 (ru)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100972998B1 (ko) * 2002-02-06 2010-07-30 신꼬오덴기 고교 가부시키가이샤 전해 재생 처리 장치
DE10300597A1 (de) * 2003-01-10 2004-07-22 Eilenburger Elektrolyse- Und Umwelttechnik Gmbh Verfahren und Vorrichtung zur vollständigen Regenerierung von Metallchlorid-Ätzlösungen für Kupferwerkstoffe
CN101988199A (zh) * 2009-08-04 2011-03-23 章晓冬 微蚀液的循环再生及铜的回收装置
CN102807294A (zh) * 2011-05-31 2012-12-05 无锡尚德太阳能电力有限公司 处理已使用蚀刻液的再循环系统
CN103422154A (zh) * 2012-05-24 2013-12-04 叶福祥 电路板酸性废蚀刻液氯化亚铜(Cu+,CuCL)离子隔膜电积再生
CN104591255A (zh) * 2013-10-31 2015-05-06 孙立 一种利用氯化铜蚀刻废液制备微米级氧化铜的方法
CN103757664B (zh) * 2013-12-13 2017-04-05 陶克(苏州)机械设备有限公司 电解槽、使用该电解槽的蚀刻液再生设备及再生方法
CN104711636B (zh) * 2015-02-11 2018-09-25 昆山市益民环保技术开发有限公司 印刷电路板酸性蚀刻废液处理方法
CN106119852B (zh) * 2015-08-31 2019-09-03 叶旖婷 一种酸性氯化铜蚀刻液的电解回收及再生工艺
KR101799500B1 (ko) * 2017-06-19 2017-11-21 인천화학 주식회사 염화동 폐액을 이용한 황산동의 제조방법
RU2685103C1 (ru) * 2017-11-21 2019-04-16 Дмитрий Юрьевич Тураев Реагентный метод регенерации солянокислого медно-хлоридного раствора травления меди
CN108425116B (zh) * 2018-02-01 2019-10-22 深圳中科欧泰华环保科技有限公司 在酸性蚀刻生产线内采用三级循环吸收的处理方法及设备
CN109136985A (zh) * 2018-10-27 2019-01-04 揭阳市斯瑞尔环境科技有限公司 一种电解氯化铁蚀刻废液制取铁板和三氯化铁的方法
RU2715836C1 (ru) * 2019-07-23 2020-03-03 Тураев Дмитрий Юрьевич Реагентно-электролизный метод регенерации солянокислых медно-хлоридных растворов травления меди
CN110468417B (zh) * 2019-09-09 2021-08-06 深圳中科欧泰华环保科技有限公司 一种五金蚀刻废液在线再生处理的方法及装置
CN113493915A (zh) * 2020-04-01 2021-10-12 健鼎(湖北)电子有限公司 酸性蚀刻废液的再生方法及系统
CN114318372B (zh) * 2022-01-18 2022-07-12 广东德同环保科技有限公司 一种循环电解三氯化铁吸收氯气的装置及方法
CN114657566B (zh) * 2022-05-23 2022-08-09 江油星联电子科技有限公司 一种电路板生产用药水再生装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3794571A (en) * 1971-05-10 1974-02-26 Gen Electric Regeneration of ferric chloride copper etching solutions
US3761369A (en) * 1971-10-18 1973-09-25 Electrodies Inc Process for the electrolytic reclamation of spent etching fluids
JPS51119632A (en) * 1975-04-15 1976-10-20 Chiyuuoo Kk Process for treating etching agents
JPS5518558A (en) * 1978-07-27 1980-02-08 Kagaku Gijutsu Shinkoukai Recovering method for copper from ferric chloride etching waste solution containing copper
JPS55145175A (en) * 1979-04-28 1980-11-12 Kagaku Gijutsu Shinkoukai Recovering method of copper by electrolysis of copper chloride etching solution and its apparatus
JPS5617429A (en) * 1979-07-23 1981-02-19 Noriyuki Yoshida Inputting method for character and symbol to computer system with video interface
JPS5914097B2 (ja) * 1980-07-30 1984-04-03 新日本製鐵株式会社 靭性を改良せるフェライト系耐熱鋼
SU1019681A1 (ru) * 1981-01-29 1983-05-23 Предприятие П/Я В-2438 Устройство дл травлени печатных плат с непрерывной регенерацией раствора
US4604175A (en) * 1982-12-07 1986-08-05 Naumov Jury I Process for regeneration of iron-copper chloride etching solution
DE3303594A1 (de) * 1983-02-03 1984-08-09 Robert Bosch Gmbh, 7000 Stuttgart Verfahren und vorrichtung zur regenerierung einer kupferhaltigen aetzloesung
DE3330349A1 (de) * 1983-08-23 1985-03-14 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zur elektrochemischen kompensation der luftoxidation bei der elektrochemischen regenerierung von chloridhaltigen kupferaetzloesungen
JPS61246395A (ja) * 1985-04-23 1986-11-01 Toagosei Chem Ind Co Ltd 塩酸含有銅廃液の処理方法
JPH02254188A (ja) * 1989-03-27 1990-10-12 Kamioka Kogyo Kk 塩化銅溶液の電解処理方法

Also Published As

Publication number Publication date
EP0539792B1 (en) 1997-04-16
CN1072737A (zh) 1993-06-02
KR100256895B1 (ko) 2000-05-15
CA2081578C (en) 2003-04-29
MY108734A (en) 1996-11-30
EP0539792A1 (en) 1993-05-05
AU655680B2 (en) 1995-01-05
RU2119973C1 (ru) 1998-10-10
DE69219063D1 (de) 1997-05-22
US5393387A (en) 1995-02-28
CA2081578A1 (en) 1993-04-29
DE69219063T2 (de) 1997-11-20
KR930008197A (ko) 1993-05-21
CN1038950C (zh) 1998-07-01
AU2719392A (en) 1993-04-29

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