JPS55145175A - Recovering method of copper by electrolysis of copper chloride etching solution and its apparatus - Google Patents

Recovering method of copper by electrolysis of copper chloride etching solution and its apparatus

Info

Publication number
JPS55145175A
JPS55145175A JP5273979A JP5273979A JPS55145175A JP S55145175 A JPS55145175 A JP S55145175A JP 5273979 A JP5273979 A JP 5273979A JP 5273979 A JP5273979 A JP 5273979A JP S55145175 A JPS55145175 A JP S55145175A
Authority
JP
Japan
Prior art keywords
copper
current density
electrolysis
cathodic
etching solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5273979A
Other languages
Japanese (ja)
Inventor
Yoshio Nakano
Saburo Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KAGAKU GIJUTSU SHINKOUKAI
DIC Corp
Original Assignee
KAGAKU GIJUTSU SHINKOUKAI
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KAGAKU GIJUTSU SHINKOUKAI, Dainippon Ink and Chemicals Co Ltd filed Critical KAGAKU GIJUTSU SHINKOUKAI
Priority to JP5273979A priority Critical patent/JPS55145175A/en
Publication of JPS55145175A publication Critical patent/JPS55145175A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

PURPOSE:To recover easily granular metallic copper which precipitates on the cathode side, by specifying the cathodic current density in electrolytic treatment of etching waste soln. CONSTITUTION:The electrolysis of copper chloride etching waste soln. is conducted in the range of a cathodic current density 20-150 A/dm<2>. The area of cathode of the electrolytic cell is maintained not larger than 1/2 of the area of the anode, and the increase in anodic current density is restrained against the increase in cathodic current density. Hereby, the copper precipitating on the cathodic side maintains granular shape and hardly adheres to the electrode as agglomerate, and is separated, precipitated and recovered easily. Consequently the electrolysis is performed continuously without exchanging electrodes, and the cupric chloride is recovered at a high efficiency.
JP5273979A 1979-04-28 1979-04-28 Recovering method of copper by electrolysis of copper chloride etching solution and its apparatus Pending JPS55145175A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5273979A JPS55145175A (en) 1979-04-28 1979-04-28 Recovering method of copper by electrolysis of copper chloride etching solution and its apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5273979A JPS55145175A (en) 1979-04-28 1979-04-28 Recovering method of copper by electrolysis of copper chloride etching solution and its apparatus

Publications (1)

Publication Number Publication Date
JPS55145175A true JPS55145175A (en) 1980-11-12

Family

ID=12923288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5273979A Pending JPS55145175A (en) 1979-04-28 1979-04-28 Recovering method of copper by electrolysis of copper chloride etching solution and its apparatus

Country Status (1)

Country Link
JP (1) JPS55145175A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01162790A (en) * 1987-12-17 1989-06-27 Kamioka Kogyo Kk Electrolytic reduction method
US5393387A (en) * 1991-10-28 1995-02-28 Nittetsu Mining Co., Ltd. Method for treating etchant
KR20030064177A (en) * 2002-01-26 2003-07-31 대한민국(충남대학교) A method of preparing copper powder from waste etchant
CN107313069A (en) * 2017-05-22 2017-11-03 广东省稀有金属研究所 A kind of method by acid, the mashed up recovery copper of alkali spent etching solution
CN110144459A (en) * 2019-04-24 2019-08-20 常州技天电子有限公司 A kind of pcb board microetch processor containing micro-corrosion liquid and application method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01162790A (en) * 1987-12-17 1989-06-27 Kamioka Kogyo Kk Electrolytic reduction method
US5393387A (en) * 1991-10-28 1995-02-28 Nittetsu Mining Co., Ltd. Method for treating etchant
KR20030064177A (en) * 2002-01-26 2003-07-31 대한민국(충남대학교) A method of preparing copper powder from waste etchant
CN107313069A (en) * 2017-05-22 2017-11-03 广东省稀有金属研究所 A kind of method by acid, the mashed up recovery copper of alkali spent etching solution
CN110144459A (en) * 2019-04-24 2019-08-20 常州技天电子有限公司 A kind of pcb board microetch processor containing micro-corrosion liquid and application method

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