JPS5518558A - Recovering method for copper from ferric chloride etching waste solution containing copper - Google Patents

Recovering method for copper from ferric chloride etching waste solution containing copper

Info

Publication number
JPS5518558A
JPS5518558A JP9096978A JP9096978A JPS5518558A JP S5518558 A JPS5518558 A JP S5518558A JP 9096978 A JP9096978 A JP 9096978A JP 9096978 A JP9096978 A JP 9096978A JP S5518558 A JPS5518558 A JP S5518558A
Authority
JP
Japan
Prior art keywords
soln
copper
fecl3
etching
fecl2
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9096978A
Other languages
Japanese (ja)
Inventor
Yoshio Kodama
Yoshio Nakano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KAGAKU GIJUTSU SHINKOUKAI
DIC Corp
Original Assignee
KAGAKU GIJUTSU SHINKOUKAI
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KAGAKU GIJUTSU SHINKOUKAI, Dainippon Ink and Chemicals Co Ltd filed Critical KAGAKU GIJUTSU SHINKOUKAI
Priority to JP9096978A priority Critical patent/JPS5518558A/en
Publication of JPS5518558A publication Critical patent/JPS5518558A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

PURPOSE:To recover copper described in the title in a high yield and to regenerate FeCl3 etching soln. of constant quality, by electrolytic reduction of FeCl3 etching waste soln. to convert all or a portion of metallic ions to Fe<2+> and Cu<+>, then by further electrolytic reduction of the waste soln. to deposit metallic copper. CONSTITUTION:FeCl3 etching waste soln. contg. copper discharged from an etching process e is run into the cathodic chamber 1a of the first step electrolytic cell, where all or a portion of metallic ions contained in the waste soln. is reduced to Fe<2+> and Cu<+>. Then the soln. is led to the cathodic chamber 2a of the second step diaphragm electrolytic cell, where nearly all copper ions are deposited on the cathode. The deposited copper is collected by a suitable method into a collecting zone d at the bottom of the cell. soln. contg. principally FeCl2 is delivered to the anodic chamber 2b, where FeCl2 is oxidized partially with chlorine formed at the anode to FeCl3, then it is delivered to the anodic chamber 1b, where residual FeCl2 is oxidized completely to FeCl3. Resulting soln. is recycled to the process e as a regenerated etching soln.
JP9096978A 1978-07-27 1978-07-27 Recovering method for copper from ferric chloride etching waste solution containing copper Pending JPS5518558A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9096978A JPS5518558A (en) 1978-07-27 1978-07-27 Recovering method for copper from ferric chloride etching waste solution containing copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9096978A JPS5518558A (en) 1978-07-27 1978-07-27 Recovering method for copper from ferric chloride etching waste solution containing copper

Publications (1)

Publication Number Publication Date
JPS5518558A true JPS5518558A (en) 1980-02-08

Family

ID=14013318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9096978A Pending JPS5518558A (en) 1978-07-27 1978-07-27 Recovering method for copper from ferric chloride etching waste solution containing copper

Country Status (1)

Country Link
JP (1) JPS5518558A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS571491A (en) * 1980-06-06 1982-01-06 Kurita Water Ind Ltd Disposal of sewage
JPS60128279A (en) * 1983-12-16 1985-07-09 Tsurumi Soda Kk Method for producing metallic copper and chlorine from cuprous chloride
JPS62260090A (en) * 1986-05-06 1987-11-12 Mitsubishi Metal Corp Treatment of solution acidified with sulfuric acid and containing antimony and bismuth
JPH05117879A (en) * 1991-10-28 1993-05-14 Nittetsu Mining Co Ltd Treatment of etching liquid
JPH06240475A (en) * 1993-02-16 1994-08-30 Nittetsu Mining Co Ltd Treatment of iron chloride based etchant containing nickel
US5393387A (en) * 1991-10-28 1995-02-28 Nittetsu Mining Co., Ltd. Method for treating etchant
CN103556211A (en) * 2013-10-14 2014-02-05 刘刚 Printed circuit board copper surface microetching and coarsening method and equipment thereof
CN103710706A (en) * 2013-12-24 2014-04-09 沈阳师范大学 Purification and regeneration method of iron trichloride etching waste liquid

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS571491A (en) * 1980-06-06 1982-01-06 Kurita Water Ind Ltd Disposal of sewage
JPS6249118B2 (en) * 1980-06-06 1987-10-16 Kurita Water Ind Ltd
JPS60128279A (en) * 1983-12-16 1985-07-09 Tsurumi Soda Kk Method for producing metallic copper and chlorine from cuprous chloride
JPS6363638B2 (en) * 1983-12-16 1988-12-08
JPS62260090A (en) * 1986-05-06 1987-11-12 Mitsubishi Metal Corp Treatment of solution acidified with sulfuric acid and containing antimony and bismuth
JPH05117879A (en) * 1991-10-28 1993-05-14 Nittetsu Mining Co Ltd Treatment of etching liquid
US5393387A (en) * 1991-10-28 1995-02-28 Nittetsu Mining Co., Ltd. Method for treating etchant
JPH06240475A (en) * 1993-02-16 1994-08-30 Nittetsu Mining Co Ltd Treatment of iron chloride based etchant containing nickel
CN103556211A (en) * 2013-10-14 2014-02-05 刘刚 Printed circuit board copper surface microetching and coarsening method and equipment thereof
CN103556211B (en) * 2013-10-14 2016-08-10 刘刚 A kind of printed circuit board copper surface micro etching method of roughening and equipment thereof
CN103710706A (en) * 2013-12-24 2014-04-09 沈阳师范大学 Purification and regeneration method of iron trichloride etching waste liquid
CN103710706B (en) * 2013-12-24 2015-12-02 沈阳师范大学 The electrolysis method method of iron trichloride etching waste liquid

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