SG191158A1 - Slurry management device for wire saw - Google Patents
Slurry management device for wire saw Download PDFInfo
- Publication number
- SG191158A1 SG191158A1 SG2013045786A SG2013045786A SG191158A1 SG 191158 A1 SG191158 A1 SG 191158A1 SG 2013045786 A SG2013045786 A SG 2013045786A SG 2013045786 A SG2013045786 A SG 2013045786A SG 191158 A1 SG191158 A1 SG 191158A1
- Authority
- SG
- Singapore
- Prior art keywords
- slurry
- tank
- waste
- wire saw
- concentration
- Prior art date
Links
- 239000002002 slurry Substances 0.000 title claims abstract description 249
- 239000002699 waste material Substances 0.000 claims abstract description 79
- 239000007787 solid Substances 0.000 claims description 41
- 238000005520 cutting process Methods 0.000 claims description 31
- 239000002245 particle Substances 0.000 claims description 29
- 230000005484 gravity Effects 0.000 claims description 11
- 238000007599 discharging Methods 0.000 claims description 2
- 238000000605 extraction Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 description 10
- 239000002826 coolant Substances 0.000 description 9
- 239000006061 abrasive grain Substances 0.000 description 6
- 238000011084 recovery Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000010923 batch production Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010280225A JP5624449B2 (ja) | 2010-12-16 | 2010-12-16 | ワイヤソーのスラリ管理装置 |
| PCT/JP2011/006964 WO2012081239A1 (ja) | 2010-12-16 | 2011-12-14 | ワイヤソーのスラリ管理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG191158A1 true SG191158A1 (en) | 2013-07-31 |
Family
ID=46244358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2013045786A SG191158A1 (en) | 2010-12-16 | 2011-12-14 | Slurry management device for wire saw |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP5624449B2 (zh) |
| KR (1) | KR101860296B1 (zh) |
| CN (1) | CN103237628B (zh) |
| MY (1) | MY170481A (zh) |
| SG (1) | SG191158A1 (zh) |
| TW (1) | TWI533973B (zh) |
| WO (1) | WO2012081239A1 (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6085500B2 (ja) * | 2013-03-08 | 2017-02-22 | 株式会社Ｉｈｉ回転機械 | ワイヤソースラリのクーラント回収装置 |
| JP6819619B2 (ja) * | 2018-01-22 | 2021-01-27 | 信越半導体株式会社 | ワーク切断方法及びワイヤソー |
| JP7003897B2 (ja) * | 2018-11-16 | 2022-02-04 | 株式会社Sumco | ウェーハの製造方法、ワイヤーソー用再利用スラリーの品質評価方法、及びワイヤーソー用使用済みスラリーの品質評価方法 |
| CN111805775B (zh) * | 2020-06-09 | 2022-08-26 | 徐州鑫晶半导体科技有限公司 | 砂浆供应方法、砂浆供应设备及晶棒切割系统 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5799643A (en) * | 1995-10-04 | 1998-09-01 | Nippei Toyama Corp | Slurry managing system and slurry managing method for wire saws |
| JP2000141362A (ja) * | 1998-11-11 | 2000-05-23 | Tokyo Seimitsu Co Ltd | ワイヤソーの加工液交換制御装置 |
| JP3776675B2 (ja) * | 2000-03-30 | 2006-05-17 | 三倉物産株式会社 | 無機研磨剤廃液の再生処理装置 |
| JP2002144229A (ja) * | 2000-11-02 | 2002-05-21 | Nippei Toyama Corp | ワイヤソー及びワイヤソーの切断方法 |
| CN101500754A (zh) * | 2006-08-16 | 2009-08-05 | 旭硝子株式会社 | 从研磨剂浆料废液中回收研磨剂的方法及装置 |
| EP2061854A1 (en) * | 2006-08-30 | 2009-05-27 | Saint-Gobain Ceramics and Plastics, Inc. | Aqueous fluid compositions for abrasive slurries, methods of production, and methods of use thereof |
| KR100786644B1 (ko) * | 2007-06-15 | 2007-12-21 | 주식회사 유스테크코리아 | 반도체 웨이퍼 제조공정에서 발생하는 폐슬러리의 재생방법및 그 재생시스템 |
| JP2010029998A (ja) * | 2008-07-30 | 2010-02-12 | Japan Fine Steel Co Ltd | 固定砥粒ワイヤソーに使用したクーラントの処理方法及びその処理装置 |
| JP5399125B2 (ja) * | 2009-04-27 | 2014-01-29 | 株式会社Ｉｈｉ回転機械 | ワイヤソーのクーラント管理方法及び装置 |
| JP2010253621A (ja) * | 2009-04-27 | 2010-11-11 | Ihi Compressor & Machinery Co Ltd | ワイヤソーのクーラント管理方法及び装置 |
| CN201573118U (zh) * | 2010-01-11 | 2010-09-08 | 湖南湘牛环保实业有限公司 | 磨切削液集中净化回用装置 |
-
2010
- 2010-12-16 JP JP2010280225A patent/JP5624449B2/ja active Active
-
2011
- 2011-12-05 TW TW100144656A patent/TWI533973B/zh not_active IP Right Cessation
- 2011-12-14 MY MYPI2013002082A patent/MY170481A/en unknown
- 2011-12-14 KR KR1020137015183A patent/KR101860296B1/ko active IP Right Grant
- 2011-12-14 SG SG2013045786A patent/SG191158A1/en unknown
- 2011-12-14 CN CN201180060317.9A patent/CN103237628B/zh not_active Expired - Fee Related
- 2011-12-14 WO PCT/JP2011/006964 patent/WO2012081239A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN103237628B (zh) | 2016-07-06 |
| JP2012125891A (ja) | 2012-07-05 |
| CN103237628A (zh) | 2013-08-07 |
| KR20130128415A (ko) | 2013-11-26 |
| WO2012081239A1 (ja) | 2012-06-21 |
| KR101860296B1 (ko) | 2018-05-23 |
| TWI533973B (zh) | 2016-05-21 |
| TW201236815A (en) | 2012-09-16 |
| MY170481A (en) | 2019-08-07 |
| JP5624449B2 (ja) | 2014-11-12 |
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