KR101860296B1 - 와이어 소의 슬러리 관리 장치 - Google Patents

와이어 소의 슬러리 관리 장치 Download PDF

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Publication number
KR101860296B1
KR101860296B1 KR1020137015183A KR20137015183A KR101860296B1 KR 101860296 B1 KR101860296 B1 KR 101860296B1 KR 1020137015183 A KR1020137015183 A KR 1020137015183A KR 20137015183 A KR20137015183 A KR 20137015183A KR 101860296 B1 KR101860296 B1 KR 101860296B1
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KR
South Korea
Prior art keywords
slurry
concentration
waste
wire
tank
Prior art date
Application number
KR1020137015183A
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English (en)
Korean (ko)
Other versions
KR20130128415A (ko
Inventor
미키오 다카스
마사야 다나카
히로아키 우에다
쓰토무 마쓰시타
신지 가와부치
Original Assignee
가부시키가이샤 아이에이치아이 로테이팅 머시너리 엔지니어링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 아이에이치아이 로테이팅 머시너리 엔지니어링 filed Critical 가부시키가이샤 아이에이치아이 로테이팅 머시너리 엔지니어링
Publication of KR20130128415A publication Critical patent/KR20130128415A/ko
Application granted granted Critical
Publication of KR101860296B1 publication Critical patent/KR101860296B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020137015183A 2010-12-16 2011-12-14 와이어 소의 슬러리 관리 장치 KR101860296B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010280225A JP5624449B2 (ja) 2010-12-16 2010-12-16 ワイヤソーのスラリ管理装置
JPJP-P-2010-280225 2010-12-16
PCT/JP2011/006964 WO2012081239A1 (ja) 2010-12-16 2011-12-14 ワイヤソーのスラリ管理装置

Publications (2)

Publication Number Publication Date
KR20130128415A KR20130128415A (ko) 2013-11-26
KR101860296B1 true KR101860296B1 (ko) 2018-05-23

Family

ID=46244358

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137015183A KR101860296B1 (ko) 2010-12-16 2011-12-14 와이어 소의 슬러리 관리 장치

Country Status (7)

Country Link
JP (1) JP5624449B2 (zh)
KR (1) KR101860296B1 (zh)
CN (1) CN103237628B (zh)
MY (1) MY170481A (zh)
SG (1) SG191158A1 (zh)
TW (1) TWI533973B (zh)
WO (1) WO2012081239A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6085500B2 (ja) * 2013-03-08 2017-02-22 株式会社Ｉｈｉ回転機械 ワイヤソースラリのクーラント回収装置
JP6819619B2 (ja) * 2018-01-22 2021-01-27 信越半導体株式会社 ワーク切断方法及びワイヤソー
JP7003897B2 (ja) * 2018-11-16 2022-02-04 株式会社Sumco ウェーハの製造方法、ワイヤーソー用再利用スラリーの品質評価方法、及びワイヤーソー用使用済みスラリーの品質評価方法
CN111805775B (zh) * 2020-06-09 2022-08-26 徐州鑫晶半导体科技有限公司 砂浆供应方法、砂浆供应设备及晶棒切割系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000141362A (ja) * 1998-11-11 2000-05-23 Tokyo Seimitsu Co Ltd ワイヤソーの加工液交換制御装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5799643A (en) * 1995-10-04 1998-09-01 Nippei Toyama Corp Slurry managing system and slurry managing method for wire saws
JP3776675B2 (ja) * 2000-03-30 2006-05-17 三倉物産株式会社 無機研磨剤廃液の再生処理装置
JP2002144229A (ja) * 2000-11-02 2002-05-21 Nippei Toyama Corp ワイヤソー及びワイヤソーの切断方法
WO2008020507A1 (fr) * 2006-08-16 2008-02-21 Asahi Glass Company, Limited Procédé de récupération d'un abrasif à partir d'un rejet liquide de boue d'abrasif et appareil associé
AU2007290606B2 (en) * 2006-08-30 2011-03-17 Saint-Gobain Ceramics & Plastics, Inc. Aqueous fluid compositions for abrasive slurries, methods of production, and methods of use thereof
KR100786644B1 (ko) * 2007-06-15 2007-12-21 주식회사 유스테크코리아 반도체 웨이퍼 제조공정에서 발생하는 폐슬러리의 재생방법및 그 재생시스템
JP2010029998A (ja) * 2008-07-30 2010-02-12 Japan Fine Steel Co Ltd 固定砥粒ワイヤソーに使用したクーラントの処理方法及びその処理装置
JP5399125B2 (ja) * 2009-04-27 2014-01-29 株式会社Ｉｈｉ回転機械 ワイヤソーのクーラント管理方法及び装置
JP2010253621A (ja) * 2009-04-27 2010-11-11 Ihi Compressor & Machinery Co Ltd ワイヤソーのクーラント管理方法及び装置
CN201573118U (zh) * 2010-01-11 2010-09-08 湖南湘牛环保实业有限公司 磨切削液集中净化回用装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000141362A (ja) * 1998-11-11 2000-05-23 Tokyo Seimitsu Co Ltd ワイヤソーの加工液交換制御装置

Also Published As

Publication number Publication date
JP5624449B2 (ja) 2014-11-12
CN103237628A (zh) 2013-08-07
TWI533973B (zh) 2016-05-21
CN103237628B (zh) 2016-07-06
SG191158A1 (en) 2013-07-31
KR20130128415A (ko) 2013-11-26
MY170481A (en) 2019-08-07
TW201236815A (en) 2012-09-16
WO2012081239A1 (ja) 2012-06-21
JP2012125891A (ja) 2012-07-05

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